US4888269A
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Resin composition for solder resist ink
Assignee: Asahi Chemical Research Laboratory Co Ltd
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Filing: 1988-08-11
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Granted: 1989-12-19
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Expires: 2008-08-11
Abstract
Abstract A resin composition for use in a solder resist ink, said composition comprising as essential ingredients (A) an epoxy vinyl ester resin solution obtained by dissolving (A-a) an epoxy vinyl ester resin obtained by reacting a phenol novolak-type epoxy resin and/or a cresol novolak-type epoxy resin with 0.40 to 0.85 mol, per epoxy group of the epoxy resin, of an unsaturated monobasic acid in (A-b) an organic and/or (A-c) at least one photopolymerizable polyfunctional vinyl monomer selected from the group consisting trifunctional or higher polyoxyalkylene glycol poly(meth)acrylates, poly(meth)acrylates of polyoxyalkyl isocyanurates and poly(meth)acrylates of acetal compounds, (B) a photopolymerization initiator, and (C) a curing agent of an amino group and/or imino group-containing epoxy resin.
Inventors
- 👤 Yoneji Sato
- 👤 Masato Hoshino
- 👤 Seiichi Kitazawa
- 👤 Tadashi Yasuda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 16:37
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/027; G03F7/032; B; B23; B23K; B23K35/00; B23K35/22; B23K35/224; H; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/285; H05K3/287; H05K2203/00; H05K2203/07; H05K2203/0779; H05K2203/0783
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
194 words
A resin composition for use in solder resist ink consisting essentially of: (A) 100 parts by weight of a solution obtained by dissolving (A-a) an epoxy vinyl resin in (A-b) an organic solvent or (A-c) at least one photopolymerizable polyfunctional vinyl monomer selected from the group consisting of trifunctional or higher polyoxyalkylene glycol poly(meth)acrylates, poly(meth)acrylates of polyoxyalkyl isocyanurates and poly(meth)acrylates of acetal compounds, wherein said epoxy vinyl ester resin (A-a) is obtained by reacting a phenol novolak-type epoxy resin or a cresol novolak-type epoxy resin with 0.40 to 0.80 mole, per epoxy group of the epoxy resin, of an unsaturated monobasic acid, (B) 0.1 to 20 parts by weight of a photopolymerization initiator, and (C) an amine-type curing agent in such a proportion that the number of active hydrogen in said curing agent (C) is 0.4 to 1.5 per remaining epoxy group of the epoxy vinyl ester resin (A-a), provided that when the curing agent (C) is dicyandiamine, a tertiary amine, an imidazole or an amine complex compound, the proportion of the curing agent (C) is 2 to 30 parts by weight per 100 parts by weight of the epoxy vinyl ester resin (A-a).
Claim 2
Dependent Claim
194 words
A resin composition for use in solder resist ink consisting essentially of: (A) 100 parts by weight of a solution obtained by dissolving (A-a) an epoxy vinyl resin in (A-b) an organic solvent or (A-c) at least one photopolymerizable polyfunctional vinyl monomer selected from the group consisting of trifunctional or higher polyoxyalkylene glycol poly(meth)acrylates, poly(meth)acrylates of polyoxyalkyl isocyanurates and poly(meth)acrylates of acetal compounds, wherein said epoxy vinyl ester resin (A-a) is obtained by reacting a phenol novolak-type epoxy resin or a cresol novolak-type epoxy resin with 0.40 to 0.80 mole, per epoxy group of the epoxy resin, of an unsaturated monobasic acid, (B) 0.1 to 20 parts by weight of a photopolymerization initiator, and (C) an amine-type curing agent in such a proportion that the number of active hydrogen in said curing agent (C) is 0.4 to 1.5 per remaining epoxy group of the epoxy vinyl ester resin (A-a), provided that when the curing agent (C) is dicyandiamine, a tertiary amine, an imidazole or an amine complex compound, the proportion of the curing agent (C) is 2 to 30 parts by weight per 100 parts by weight of the epoxy vinyl ester resin (A-a).
Claim 3
Dependent Claim
41 words
The composition of claim 1 wherein the epoxy vinyl ester resin is a phenol novolak-type epoxy resin having a melting point of 60° to 120° C. and obtained by reacting a phenol novolak resin obtained from phenol and formaldehyde with epichlorohydrin.
Claim 4
Dependent Claim
41 words
The composition of claim 1 wherein the epoxy vinyl ester resin is a cresol novolak-type epoxy resin having a melting point of 60° to 120° C. and obtained by reacting a cresol novolak resin obtained from cresol and formaldehyde with epichlorohydrin.
Claim 5
Dependent Claim
43 words
The composition of claim 1 wherein the epoxy vinyl ester resin (A-a) is an epoxy vinyl ester resin obtained by reacting a cresol novolak-type epoxy resin with 0.40 to 0.80 mol, per epoxy group of the epoxy resin, of an unsaturated monobasic acid.
Claim 6
Dependent Claim
13 words
The composition of claim 1 wherein the unsaturated monobasic acid is acrylic acid.
Claim 7
Dependent Claim
39 words
The composition of claim 1 or 4 wherein the organic solvent (A-b) is at least one solvent selected from the group consisting of ethylene glycol monobutyl ether, ethylene glycol monoethyl ether, ethylene glycol monomethyl ether, cyclohexane and petroleum naphtha.
Claim 8
Dependent Claim
28 words
The composition of claim 1 or 4 wherein the photopolymerization initiator (B) is selected from the group consisting of benzophenone, p-tert-butyltrichloroacetophenone, benzoin, benzyl methyl ketal, thioxanethone and 2-ethylanthraquinone.
Claim 9
Dependent Claim
15 words
The composition of claim 1 or 4 wherein the amine-type curing agent (C) is dicyandiamide.
Claim 10
Dependent Claim
16 words
The composition of claim 1 or 4 wherein the amine-type curing agent (C) is an imidazole.
Claim 11
Dependent Claim
27 words
The composition of claim 4 wherein the cresol novolak-type epoxy resin is a cresol novolak-type epoxy resin melting at a temperature of from 60° to 120° C.
Claim 12
Dependent Claim
37 words
The composition of claim 1 or 13 wherein the photopolymerizable polyfunctional vinyl monomer (A-c) is at least one photopolymerizable polyfunctional vinyl monomer selected from the group consisting of dipentaerythritol hexaacrylate, dipentaerythritol pentacrylate, tris(acyoyloxyethyl) isocyanaurate and 2-(2-hydroxy-1,1-dimethylethyl)-5-hydroxymethyl-5-ethyl--1,3-dioxane diacrylate.
Claim 13
Dependent Claim
31 words
The composition of claim 8 wherein the amount of the dicyandiamide is from 3 to 20 parts by weight per 100 parts by weight of the epoxy vinyl ester resin (A-a).
Claim 14
Dependent Claim
32 words
The composition of claim 9 wherein the imidazole is present in an amount of 3 to 20 parts by weight per 100 parts by weight of the epoxy vinyl ester resin (A-a).
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-12-18 | 1993-06-19 | 1993-12-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-12-18 | 1997-06-19 | 1997-12-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-12-18 | 2001-06-19 | 2001-12-19 | $7700.00 | Window Closed / Lapsed |