US3989610A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Photosensitive epoxy-acrylate resin compositions
Assignee: Resonac Corp
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Filing: 1974-02-12
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Granted: 1976-11-02
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Expires: 1994-02-12
Abstract
Abstract A photosensitive resin composition consisting of, or comprising as the essential components, (A) a photo-polymerizable unsaturated compound having at least two terminal ethylene groups, (B) a sensitizer capable of initiating polymerization of the above unsaturated compound upon irradiation with active rays, (C) a compound containing at least two epoxy groups, and (D) a compound selected from the group consisting of dicyandiamide, p,p'-diaminodiphenyl compounds, polycarboxylic acids having at least two carboxyl groups, polycarboxylic anhydrides and mixtures of the polycarboxylic acids and the polycarboxlic anhydrides. The above photosensitive resin composition can give a protective film excellent in solvent resistance, chemical resistance, heat resistance and mechanical strengths, and hence, can be used in the production of printed circuit boards, precision-processing of metals and as materials for adhesives, paints, plastic relief and the like.
Inventors
- 👤 Katsushige Tsukada
- 👤 Asao Isobe
- 👤 Nobuyuki Hayashi
- 👤 Masahiro Abo
- 👤 Ken Ogawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 18:54
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/038; C; C08; C08F; C08F2/00; C08F2/46; C08F283/00; C08F283/10; C08G; C08G59/00; C08G59/18; C08G59/40; C08G59/42; C08G59/4292; C08L; C08L63/00; G03F7/027; G03F7/032
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
113 words
A photosensitive resin composition which consists essentially of (A) 10 to 90% by weight of a photo-polymerizable unsaturated compound containing at least two terminal ethylene groups, (B) 0.1 to 15% by weight of a sensitizer capable of initiating polymerization of the above unsaturated compound upon irradiation with active rays, (C) 5 to 80% by weight of a compound having at least two epoxy groups and (D) a compound selected from the group consisting of 0.1 to 20% by weight dicyandiamide, 1 to 30% by weight p,p'-diaminodiphenyl compounds, and 0.3 to 1.5 moles per mole of epoxy group of a polycarboxylic acid having at least two carboxyl groups, a polycarboxylic anhydride or mixtures thereof.
Claim 2
Dependent Claim
113 words
A photosensitive resin composition which consists essentially of (A) 10 to 90% by weight of a photo-polymerizable unsaturated compound containing at least two terminal ethylene groups, (B) 0.1 to 15% by weight of a sensitizer capable of initiating polymerization of the above unsaturated compound upon irradiation with active rays, (C) 5 to 80% by weight of a compound having at least two epoxy groups and (D) a compound selected from the group consisting of 0.1 to 20% by weight dicyandiamide, 1 to 30% by weight p,p'-diaminodiphenyl compounds, and 0.3 to 1.5 moles per mole of epoxy group of a polycarboxylic acid having at least two carboxyl groups, a polycarboxylic anhydride or mixtures thereof.
Claim 3
Dependent Claim
23 words
A photosensitive resin composition according to claim 1, wherein the photo-polymerizable unsaturated compound is an acrylic or methacrylic ester of a polyhydric alcohol.
Claim 4
Dependent Claim
26 words
A photosensitive resin composition according to claim 2, wherein the polyhydric alcohol is triethylene glycol, tetraethylene glycol, ethylene glycol, propylene glycol, trimethylolpropane, pentaerythritol or neopentyl glycol.
Claim 5
Dependent Claim
25 words
A photosensitive resin composition according to claim 1, wherein the photo-polymerizable unsaturated compound is an acrylate or methacrylate of alkylene oxide adduct of bisphenol A.
Claim 6
Dependent Claim
28 words
A photosensitive resin composition according to claim 1, wherein the proportion of the (A) component is 10 to 90% by weight based on the weight of the composition.
Claim 7
Dependent Claim
23 words
A photosensitive resin composition according to claim 1, wherein the sensitizer is benzophenone, Michiler's ketone, benzoin, benzoin alkyl ether, 2-ethylanthraquinone, 3-t-butylanthraquinone or benzil.
Claim 8
Dependent Claim
28 words
A photosensitive resin composition according to claim 1, wherein the proportion of the (B) component is 0.1 to 15% by weight based on the weight of the composition.
Claim 9
Dependent Claim
19 words
A photosensitive resin composition according to claim 1, wherein the (C) component is a novolac type epoxy resin prepolymer.
Claim 10
Dependent Claim
31 words
A photosensitive resin composition according to claim 1, wherein the (D) component is dicyandiamide, and the proportion thereof is 0.1 to 20% by weight based on the weight of the composition.
Claim 11
Dependent Claim
33 words
A photosensitive resin composition according to claim 1, wherein the (D) component is a p,p'-diaminodiphenyl compound, and the proportion thereof is 1 to 30% by weight based on the weight of the composition.
Claim 12
Dependent Claim
20 words
A photosensitive resin composition according to claim 10, wherein the p,p'-diaminodiphenyl compound is p,p'-diaminodiphenylmethane, p,p'-diaminodiphenyl ether, p,p'-diaminodiphenyl sulfone, or p,p'-diaminodiphenyl-dimethylmethane.
Claim 13
Dependent Claim
29 words
A photosensitive resin composition according to claim 1 wherein the (D) component is a polycarboxylic acid haing at least two carboxyl groups, a polycarboxylic anhydric or a mixture thereof.
Claim 14
Dependent Claim
26 words
A photosensitive resin composition according to claim 12, wherein the proportion of the (D) component is 0.3 to 1.5 moles per mole of the (C) component.
Claim 15
Dependent Claim
50 words
A photosensitive resin composition according to claim 1, which further contains up to 5% by weight, based on the weight of the composition, of a curing accelerator for epoxy resin selected from the group consisting of amine-boron trifluoride complex, fluoboric acid amine salt, tetraphenylphosphonium tetraphenylborate, 2-ethyl-4-methylimidazole and 2-ethyl-4-methylimidazole-zinc octenate complex.
Claim 16
Dependent Claim
23 words
A photosensitive resin composition according to claim 14, which further contains a heat-polymerization inhibitor, a linear high molecular weight binder or a plasticizer.
Claim 17
Dependent Claim
22 words
A photosensitive resin composition according to claim 14, which further contains a copolymer of acrylic or methacrylic acid with other vinyl compounds.
Claim 18
Dependent Claim
24 words
A photosensitive resin composition according to claim 16, wherein the (C) component is novolac type epoxy resin prepolymer and the (D) component is dicyandiamide.
Claim 19
Dependent Claim
16 words
A photosensitive resin composition according to claim 2, wherein said photo-polymerizable unsaturated compound is pentaerythritol triacrylate.
Claim 20
Dependent Claim
14 words
A photosensitive resin composition according to claim 18, wherein the (D) component is dicyandiamide.
Claim 21
Dependent Claim
14 words
A photosensitive resin composition according to claim 2, wherein the (D) component is dicyandiamide.
Claim 22
Dependent Claim
15 words
A photosensitive resin composition according to claim 2, wherein the polyhydric alcohol is tetraethylene glycol.
Claim 23
Dependent Claim
14 words
A photosensitive resin composition according to claim 2, wherein the polyhydric alcohol is trimethylolpropane.
Claim 24
Dependent Claim
14 words
A photosensitive resin composition according to claim 2, wherein the polyhydric alcohol is pentaerythritol.
Claim 25
Dependent Claim
27 words
A photosensitive resin composition according to claim 2, wherein said photo-polymerizable unsaturated compound is selected from the group consisting of pentaerythritol triacrylate, trimethylolpropane triacrylate, and pentaerythritol tetraacrylate.
Claim 26
Dependent Claim
69 words
A photosensitive resin composition consisting essentially of (A) 10 to 90% by weight of a photo-polymerizable unsaturated compound containing at least two terminal ethylene groups, (B) 0.1 to 15% by weight of a sensitizer capable of initiating said photo-polymerizable unsaturated compound upon irradiation with active rays, (C) 5 to 80% by weight of a compound having at least two epoxy groups and (D) 0.1 to 20% by weight dicyandiamide.
Claim 27
Dependent Claim
69 words
A photosensitive resin composition consisting essentially of (A) 10 to 90% by weight of a photo-polymerizable unsaturated compound containing at least two terminal ethylene groups, (B) 0.1 to 15% by weight of a sensitizer capable of initiating said photo-polymerizable unsaturated compound upon irradiation with active rays, (C) 5 to 80% by weight of a compound having at least two epoxy groups and (D) 0.1 to 20% by weight dicyandiamide.
Claim 28
Dependent Claim
23 words
A photosensitive resin composition according to claim 25, wherein the photo-polymerizable unsaturated compound is an acrylic or methacrylic ester of a polyhydric alcohol.
References Cited (Backward Citations)
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US3551246A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1979-11-02 | 1980-05-03 | 1980-11-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1983-11-02 | 1984-05-03 | 1984-11-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1987-11-02 | 1988-05-03 | 1988-11-02 | $7700.00 | Window Closed / Lapsed |