Pick and place nozzle with concentric grooves

Claim 1

A pick and place device for efficiently picking up electronic components of widely varying sizes and shapes and placing the components as desired on a substrate, said device comprising: a spindle, said spindle includes a nozzle body surrounding a concentric inner sleeve, said inner sleeve having a substantially funnel-shaped nozzle tip disposed at its lower end and said spindle further includes a central vacuum channel formed in said inner sleeve; a first vacuum means coupled to said spindle for creating a first vacuum pressure; a second vacuum means coupled to said spindle for creating a second vacuum pressure greater than said first vacuum pressure, said first vacuum means facilitating pick-up of smaller electronic components and said second vacuum means facilitating pick-up of larger electronic components; wherein said first vacuum means generates a first vacuum area A1 and said second vacuum means generates a second vacuum area A2, said second vacuum area A2 being substantially concentric to said first vacuum area A1; and an outer cushion disposed between the lower end portion of said nozzle body and said nozzle tip, said outer cushion forming a chamber between said outer cushion and said nozzle tip, said chamber corresponding to said vacuum area A2 and the inner diameter of said nozzle tip corresponding to said vacuum area A1.