US4885837A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for forming leads of semiconductor devices
Assignee: Mitsubishi Electric Corp
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Filing: 1988-12-15
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Granted: 1989-12-12
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Expires: 2008-12-15
Abstract
Abstract An apparatus for forming leads of semiconductor devices includes a tie-bar cutting device for cutting tie-bars connecting adjacent leads in a lead frame on which semiconductor chips are mounted and which has unwanted resin burrs as a result of resin-sealing, a resin-burr removing device for removing resin burrs from the lead frame whose tie-bars have been cut, and a bending device for bending the leads of the lead frame whose resin burrs have been removed. After tie-bars are cut from a lead frame on which semiconductor chips are mounted, resin burrs are removed from the lead frame and the leads of the lead frame are bent.
Inventors
- 👤 Taizo Eshima
- 👤 Kunihiro Yasutake
- 👤 Katuhiko Yamasaki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:10
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0446; H05; H05K; H05K13/00; H05K13/0092; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/51; Y10T29/5136
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
127 words
An apparatus for forming the leads of resin-sealed semiconductor devices comprising: tie-bar cutting means comprising a first press for cutting tie-bars connecting adjacent leads of a lead frame on which semiconductor chips are mounted and which has unwanted resin burrs as a result of resin-sealing of the semi-conductor chips; resin-burr removing means for removing the resin burrs from the lead frame whose tie-bars have been cut by said tie-bar cutting means, said resin-burr removing means comprising a brush and moving means for moving said brush relative to said lead frame to brush the resin burrs from the lead frame; and bending means comprising a second press for bending the leads of the lead frame whose resin burrs have been removed by means of said resin-burr removing means.
Claim 2
Independent Claim
127 words
An apparatus for forming the leads of resin-sealed semiconductor devices comprising: tie-bar cutting means comprising a first press for cutting tie-bars connecting adjacent leads of a lead frame on which semiconductor chips are mounted and which has unwanted resin burrs as a result of resin-sealing of the semi-conductor chips; resin-burr removing means for removing the resin burrs from the lead frame whose tie-bars have been cut by said tie-bar cutting means, said resin-burr removing means comprising a brush and moving means for moving said brush relative to said lead frame to brush the resin burrs from the lead frame; and bending means comprising a second press for bending the leads of the lead frame whose resin burrs have been removed by means of said resin-burr removing means.
Claim 3
Dependent Claim
27 words
An apparatus as claimed in claim 1 wherein said moving means includes means for reciprocatingly moving said brush into and out of contact with the lead frame.
Claim 4
Independent Claim
116 words
An apparatus for forming the leads of resin-sealed semiconductor devices comprising: tie-bar cutting means comprising a first press for cutting tie-bars connecting adjacent leads of a lead frame on which semiconductor chips are mounted and which has unwanted resin burrs as a result of resin-sealing of the semiconductor chips; resin-burr removing means for removing the resin burrs from the lead frame whose tie-bars have been cut by saiid tie-bar cutting means, wherein said resin-burr removing means includes means for blowing air at the lead frame for removing burrs; and bending means comprising a second press for bending the leads of the lead frame whose resin burrs have been removed by means of said resin-burr removing means.
Claim 5
Independent Claim
116 words
An apparatus for forming the leads of resin-sealed semiconductor devices comprising: tie-bar cutting means comprising a first press for cutting tie-bars connecting adjacent leads of a lead frame on which semiconductor chips are mounted and which has unwanted resin burrs as a result of resin-sealing of the semiconductor chips; resin-burr removing means for removing the resin burrs from the lead frame whose tie-bars have been cut by saiid tie-bar cutting means, wherein said resin-burr removing means includes means for blowing air at the lead frame for removing burrs; and bending means comprising a second press for bending the leads of the lead frame whose resin burrs have been removed by means of said resin-burr removing means.
Claim 6
Dependent Claim
27 words
An apparatus as claimed in claim 3 wherein said resin-burr removing means comprises an air nozzle and air supply means for blowing air through said air nozzle.
Claim 7
Dependent Claim
19 words
An apparatus as claimed in claim 4 wherein said air nozzle is disposed between said first and second presses.
Claim 8
Dependent Claim
17 words
An apparatus as claimed in claim 4 wherein said air nozzle is disposed in said first press.
Claim 9
Dependent Claim
18 words
An apparatus as claimed in claim 3 including means for ionizing the air blown at said lead frame.
Claim 10
Dependent Claim
27 words
An apparatus as claimed in claim 7 wherein said resin-burr removing means comprises an air nozzle and air supply means for blowing air through said air nozzle.
Claim 11
Dependent Claim
19 words
An apparatus as claimed in claim 8 wherein said air nozzle is disposed between said first and second presses.
Claim 12
Dependent Claim
17 words
An apparatus as claimed in claim 8 wherein said air nozzle is disposed in said first press.
Claim 13
Dependent Claim
28 words
An apparatus as claimed in claim 1 comprising dust collecting means for collecting the resin burrs removed from the lead frame by means of said resin-burr removing means.
Claim 14
Dependent Claim
26 words
An apparatus as claimed in claim 3 comprising dust collecting means for collecting the resin burrs removed from the lead frame by said resin-burr removing means.
Claim 15
Independent Claim
119 words
An apparatus for forming the leads of resin-sealed semiconductor devices comprising: tie-bar cutting means for cutting tie-bars connecting adjacent leads of a lead frame on which semiconductor chips are mounted and which has unwanted resin burrs as a result of resin-sealing of the semiconductor chips; resin-burr removing means for removing the resin burrs from the lead frame whose tie-bars have been cut by said tie-bar cutting means, said resin-burr removing means comprising a brush and moving means for moving said brush relative to said lead frame to brush the resin burrs from the lead frame; and bending means for bending the leads of the lead frame whose resin burrs have been removed by means of said resin-burr removing means.
Claim 16
Independent Claim
119 words
An apparatus for forming the leads of resin-sealed semiconductor devices comprising: tie-bar cutting means for cutting tie-bars connecting adjacent leads of a lead frame on which semiconductor chips are mounted and which has unwanted resin burrs as a result of resin-sealing of the semiconductor chips; resin-burr removing means for removing the resin burrs from the lead frame whose tie-bars have been cut by said tie-bar cutting means, said resin-burr removing means comprising a brush and moving means for moving said brush relative to said lead frame to brush the resin burrs from the lead frame; and bending means for bending the leads of the lead frame whose resin burrs have been removed by means of said resin-burr removing means.
Claim 17
Independent Claim
108 words
An apparatus for forming the leads of resin-sesaled semiconductor devices comprising: tie-bar cutting means for cutting tie-bars connecting adjacent leads of a lead frame on which semiconductor chips are mounted and which has unwanted resin burrs as a result of resin-sealing of the semiconductor chips; resin-burr removing means for removing the resin burrs from the lead frame whose tie-bars have been cut by said tie-bar cutting means, wherein said resin-burr removing means includes means for blowing air at the lead frame for removing burrs; and bending means for bending the leads of the lead frame whose resin burrs have been removed by means of said resin-burr removing means.
Claim 18
Independent Claim
108 words
An apparatus for forming the leads of resin-sesaled semiconductor devices comprising: tie-bar cutting means for cutting tie-bars connecting adjacent leads of a lead frame on which semiconductor chips are mounted and which has unwanted resin burrs as a result of resin-sealing of the semiconductor chips; resin-burr removing means for removing the resin burrs from the lead frame whose tie-bars have been cut by said tie-bar cutting means, wherein said resin-burr removing means includes means for blowing air at the lead frame for removing burrs; and bending means for bending the leads of the lead frame whose resin burrs have been removed by means of said resin-burr removing means.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-12-11 | 1993-06-12 | 1993-12-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-12-11 | 1997-06-12 | 1997-12-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-12-11 | 2001-06-12 | 2001-12-12 | $7700.00 | Window Closed / Lapsed |