JPS5572045A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Apparatus for removing resin burr removing of resin sealing type semiconductor device
Assignee: Mitsubishi Electric Corp
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Filing: 1978-11-24
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Granted: —
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Expires: 1998-11-24
Abstract
Abstract PURPOSE: To remove mechanically a resin burr without wounding the goods using a rotary cutter. CONSTITUTION: A lead frame 8 of semiconductor device 14 is held firmly in each setting jig 16 on a conveyor 15 so as a resin burr part 11 projects out of the conveyor edge, and the cutter is rotated and the conveyor is moved. The resin burr of the semiconductor device reached the cutter place is cutted off by the cutter. This method is different to shot-blast method and also does not wound the goods. COPYRIGHT: (C)1980,JPO&Japio
Inventors
- 👤 Takayoshi Shimomura
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-09 15:06
CPC Classifications
—
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