Bubble generation in condensation wells for cooling high density integrated circuit chips

Claim 1

An apparatus for containing and cooling a high-density integrated circuit package comprising in combination: a base, a high-density integrated circuit mounted on said base, a heat exchanger mounted on said base to enclose said circuit and carry away the operational heat thereof by means of a coolant which is passed through said heat exchanger, said heat exchanger comprising a housing having an especially configured thermally conductive wall for providing an elongated tunnel over said circuit, said tunnel being closed at one end and open at its other end which other end is juxtapositioned to said circuit, a plurality of thermally conductive spheroids arranged in said tunnel and biased into thermally conductive contact with each other, with said circuit and said wall forming said tunnel to maximize heat transfer from said circuit to said wall, and a particle centrally positioned in said spheriods in said tunnel at a point juxtapositioned to said circuit for catalytically enhancing bubble nucleation growth around said circuit.

Claim 2

An apparatus for containing and cooling a high-density integrated circuit package comprising in combination: a base, a high-density integrated circuit mounted on said base, a heat exchanger mounted on said base to enclose said circuit and carry away the operational heat thereof by means of a coolant which is passed through said heat exchanger, said heat exchanger comprising a housing having an especially configured thermally conductive wall for providing an elongated tunnel over said circuit, said tunnel being closed at one end and open at its other end which other end is juxtapositioned to said circuit, a plurality of thermally conductive spheroids arranged in said tunnel and biased into thermally conductive contact with each other, with said circuit and said wall forming said tunnel to maximize heat transfer from said circuit to said wall, and a particle centrally positioned in said spheriods in said tunnel at a point juxtapositioned to said circuit for catalytically enhancing bubble nucleation growth around said circuit.

Claim 13

An apparatus for containing and cooling a high density integrated circuit package comprising in combination: a base, a high-density integrated circuit mounted on said base, a heat exchanger mounted on said base to enclose said circuit and carry away the operational heat thereof by means of a coolant which is passed through said heat exchanger, said heat exchanger comprising a housing having a specifically configured thermally conductive wall for providing an elongated tunnel over said circuit, said tunnel being closed at one end and open at its other end which other end is juxtapositioned to said circuit, said tunnel being provided with a plurality of fins extending inwardly of its inside periphery, and a particle centrally positioned within said tunnel and secured by said fins for enhancing bubble nucleation growth around said cirucit.

Claim 14

An apparatus for containing and cooling a high density integrated circuit package comprising in combination: a base, a high-density integrated circuit mounted on said base, a heat exchanger mounted on said base to enclose said circuit and carry away the operational heat thereof by means of a coolant which is passed through said heat exchanger, said heat exchanger comprising a housing having a specifically configured thermally conductive wall for providing an elongated tunnel over said circuit, said tunnel being closed at one end and open at its other end which other end is juxtapositioned to said circuit, said tunnel being provided with a plurality of fins extending inwardly of its inside periphery, and a particle centrally positioned within said tunnel and secured by said fins for enhancing bubble nucleation growth around said cirucit.

Claim 20

An apparatus for containing and cooling a high-density integrated circuit package comprising in combination: a base housing defining an open chamber, at least one high-density integrated circuit package mounted in the bottom of the chamber of said base housing, said package including a substrate having at least one discrete integrated circuit mounted on one surface thereof, a cover demountably attached to said base housing for sealingly enclosing said chamber, said cover comprising a metallic flange extending over said open chamber of said base and being offset at a plurality of points along its surface to provide a plurality of tunnels extending into said cover, said tunnels being closed at one end in said cover and open at their other ends into said chamber of said base, the open end of each of said tunnels being juxtapositioned to a different discrete integrated circuit mounted on said one surface of said substrate, a plurality of spheroids, a first portion of said spheroids being assembled in each of said tunnels and in contact with the associated juxtapositioned integrated circuit, a second portion of said spheroids being formed around the top, ends and other side of said substrate, and a third portion of said spheroids at least partially filling the void in said cover extending around said tunnels, biasing means interposed between the closed end of said tunnels and the first portion of said spheroids in said tunnels, between said base and the second portion of said spheroids, and between said cover and said third portion of said spheroids for biasing said spheroids into thermal conductive contact with each other, the walls of said tunnels, and with each of the discrete integrated circuits, inlet port means and outlet port means by which a first dielectric immersion coolant is passable through said third portion of said spheroids, and means for immersing said first and second portions of said spheroids in a second dielectric coolant.

Claim 21

An apparatus for containing and cooling a high-density integrated circuit package comprising in combination: a base housing defining an open chamber, at least one high-density integrated circuit package mounted in the bottom of the chamber of said base housing, said package including a substrate having at least one discrete integrated circuit mounted on one surface thereof, a cover demountably attached to said base housing for sealingly enclosing said chamber, said cover comprising a metallic flange extending over said open chamber of said base and being offset at a plurality of points along its surface to provide a plurality of tunnels extending into said cover, said tunnels being closed at one end in said cover and open at their other ends into said chamber of said base, the open end of each of said tunnels being juxtapositioned to a different discrete integrated circuit mounted on said one surface of said substrate, a plurality of spheroids, a first portion of said spheroids being assembled in each of said tunnels and in contact with the associated juxtapositioned integrated circuit, a second portion of said spheroids being formed around the top, ends and other side of said substrate, and a third portion of said spheroids at least partially filling the void in said cover extending around said tunnels, biasing means interposed between the closed end of said tunnels and the first portion of said spheroids in said tunnels, between said base and the second portion of said spheroids, and between said cover and said third portion of said spheroids for biasing said spheroids into thermal conductive contact with each other, the walls of said tunnels, and with each of the discrete integrated circuits, inlet port means and outlet port means by which a first dielectric immersion coolant is passable through said third portion of said spheroids, and means for immersing said first and second portions of said spheroids in a second dielectric coolant.

Claim 27

An apparatus for containing and cooling a high-density integrated circuit package comprising in combination: a base housing defining an open chamber, at least one high-density integrated circuit package mounted in the bottom of the chamber of said base housing, said package including a substrate having at least one discrete integrated circuit mounted on one surface thereof, a cover demountably attached on said base housing for sealingly enclosing said chamber, said cover comprising a metallic flange extending over said open chamber of said base and being offset at a plurality of points along its surface to provide a plurality of tunnels extending into said cover, said tunnels being closed at one end in said cover and open at their other ends into said chamber of said base, the open end of each of said tunnels being juxtapositioned to a different discrete integrated circuit mounted on said one surface of said substrate, a plurality of steroids, a first portion of said spheroids being assembled in each of said tunnels and in contact with the associate juxtapositioned integrated circuit, a second portion of said spheroids being formed around ends and both major sides of said substrate to form a mechanical vibration dampening structure when said spheroids are immersed in a coolant, and a third portion of said spheroids at least partially filling the void in said cover extending around said tunnels, biasing means interposed between the closed end of said tunnels and the first portion of said spheroids in said tunnels, between said base and the second portion of said spheroids, and between said cover and said third portion of said spheroids for biasing said spheroids into thermal conductive contact with each other, the walls of said tunnels, and with each of the discrete integrated circuits, inlet port means and outlet port means by which a first dielectric immersion coolant is passable through said first portion of said spheroids, and means for immersing said second and third portions of said spheroids in a second dielectric coolant.

Claim 28

An apparatus for containing and cooling a high-density integrated circuit package comprising in combination: a base housing defining an open chamber, at least one high-density integrated circuit package mounted in the bottom of the chamber of said base housing, said package including a substrate having at least one discrete integrated circuit mounted on one surface thereof, a cover demountably attached on said base housing for sealingly enclosing said chamber, said cover comprising a metallic flange extending over said open chamber of said base and being offset at a plurality of points along its surface to provide a plurality of tunnels extending into said cover, said tunnels being closed at one end in said cover and open at their other ends into said chamber of said base, the open end of each of said tunnels being juxtapositioned to a different discrete integrated circuit mounted on said one surface of said substrate, a plurality of steroids, a first portion of said spheroids being assembled in each of said tunnels and in contact with the associate juxtapositioned integrated circuit, a second portion of said spheroids being formed around ends and both major sides of said substrate to form a mechanical vibration dampening structure when said spheroids are immersed in a coolant, and a third portion of said spheroids at least partially filling the void in said cover extending around said tunnels, biasing means interposed between the closed end of said tunnels and the first portion of said spheroids in said tunnels, between said base and the second portion of said spheroids, and between said cover and said third portion of said spheroids for biasing said spheroids into thermal conductive contact with each other, the walls of said tunnels, and with each of the discrete integrated circuits, inlet port means and outlet port means by which a first dielectric immersion coolant is passable through said first portion of said spheroids, and means for immersing said second and third portions of said spheroids in a second dielectric coolant.