US4883773A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of producing magnetosensitive semiconductor devices
Assignee: Sharp Corp
•
Filing: 1989-03-07
•
Granted: 1989-11-28
•
Expires: 2009-03-07
Abstract
Abstract Magnetosensitive semiconductor devices are produced by forming a magnetosensitive part on one surface of a semiconductor substrate, pasting the semiconductor substrate thus formed on a jig, wrapping or etching the opposite surface of the semiconductor substrate, pasting a magnetic substrate on it with the jig pasted thereon, dividing the pasted substrates into individual unistructural elements each with a semiconductor chip and a magnetic piece, and die bonding, wire bonding and resin molding these individual elements.
Inventors
- 👤 Takuro Ishikura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 14:47
CPC Classifications
H; H10; H10N; H10N52/00; H10N52/01; H10W; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10S; Y10S148/00; Y10S148/028; Y10S148/135; Y10S438/00; Y10S438/977
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
150 words
A method of producing magnetosensitive semiconductor devices comprising the steps of forming a magnetosensitive part on a first surface of a semiconductor substrate, pasting a supporting member on said first surface of said semiconductor substrate, reducing the thickness of said semiconductor substrate to less than and about equal to 100 micrometers from a second surface thereof with said supporting member kept on said first surface, said first and second surfaces being opposite from each other and said magnetosensitive part not appearing on said second surface, pasting a magnetic substrate of thickness about 300 micrometers on said second surface of said semiconductor substrate to form a layered structure, thereafter removing said supporting member and attaching an adhesive tape on said magnetic substrate, thereafter dividing said layered structure into individual unistructural elements each having a semiconductor chip and a magnetic piece, and die bonding, wire bonding and resin molding said individual elements.
Claim 2
Independent Claim
150 words
A method of producing magnetosensitive semiconductor devices comprising the steps of forming a magnetosensitive part on a first surface of a semiconductor substrate, pasting a supporting member on said first surface of said semiconductor substrate, reducing the thickness of said semiconductor substrate to less than and about equal to 100 micrometers from a second surface thereof with said supporting member kept on said first surface, said first and second surfaces being opposite from each other and said magnetosensitive part not appearing on said second surface, pasting a magnetic substrate of thickness about 300 micrometers on said second surface of said semiconductor substrate to form a layered structure, thereafter removing said supporting member and attaching an adhesive tape on said magnetic substrate, thereafter dividing said layered structure into individual unistructural elements each having a semiconductor chip and a magnetic piece, and die bonding, wire bonding and resin molding said individual elements.
Claim 3
Dependent Claim
21 words
The method of claim 1 wherein said step of reducing the thickness comprises lapping said second surface of said semiconductor substrate.
Claim 4
Dependent Claim
21 words
The method of claim 1 wherein said step of reducing the thickness comprises etching said second surface of said semiconductor substrate.
Claim 5
Dependent Claim
11 words
The method of claim 1 wherein said semiconductor substrate comprises GaAs.
Claim 6
Dependent Claim
12 words
The method of claim 1 wherein said magnetic substrate comprises Ni-Zn ferrite.
Claim 7
Dependent Claim
14 words
The method of claim 1 wherein said magnetosensitive part is formed by ion injection.
References Cited (Backward Citations)
GB926250A
Cited
GB1017033A
Cited
US4021767A
Cited
JPS5646583A
Cited
JPS5913385A
Cited
JPS59129483A
Cited
JPS6016478A
Cited
JPS60245220A
Cited
JPS61216372A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-11-27 | 1993-05-29 | 1993-11-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-11-27 | 1997-05-29 | 1997-11-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-11-27 | 2001-05-29 | 2001-11-28 | $7700.00 | Window Closed / Lapsed |