US4876177A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for producing printed circuit board
Assignee: Hitachi Ltd
•
Filing: 1987-09-08
•
Granted: 1989-10-24
•
Expires: 2007-09-08
Abstract
Abstract A process for producing a printed circuit board, which comprises the steps of forming a layer comprising a photosensitive resin composition on an insulating substrate having on its surface an adhesive layer adherent to a metal being subsequently plated thereon; exposing said layer comprising a photosensitive resin composition to an actinic radiation in a manner so as to form on said layer a negative pattern of a conductor circuit pattern and to semicure said negative pattern to an extent sufficient to keep it from erosion by a plating solution; developing by dissolving away with a solvent the uncured areas not exposed to said actinic radiation, thereby to form a plating resist on the areas of said negative pattern; chemically plating said conductor circuit pattern areas not covered with said plating resist, thereby to form a conductor circuit; and carrying out a curing treatment to cure completely said resist. According to this invention, it is possible to provide a printed circuit board of higher reliability compared with conventional processes.
Inventors
- 👤 Haruo Akahoshi
- 👤 Kanji Murakami
- 👤 Mineo Kawamoto
- 👤 Akio Tadokoro
- 👤 Toyofusa Yoshimura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 08:55
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K3/184; H05K2203/00; H05K2203/14; H05K2203/1407; H05K3/0011; H05K3/0017; H05K3/0023; H05K3/38; H05K3/386; H05K3/387
Claims Analysis
Total Claims: 40
Claim 1
Independent Claim
155 words
A process for producing a printed circuit board, which comprises the steps of: forming a layer comprising a photosensitive resin composition on an insulating substrate having on its surface an adhesive layer adherent to a metal being subsequently plated thereon; exposing said layer comprising a photosensitive resin composition to an actinic radiation in a manner so as to form on said layer a negative pattern of a conductor circuit pattern and to semicure said negative pattern to an extent sufficient to keep it from erosion by a plating solution; developing by dissolving away with a solvent the uncured areas not exposed to said actinic radiation, thereby to form a plating resist from the semicured areas of said negative pattern; chemically plating said conductor circuit pattern areas not covered with said plating resist, thereby to form a conductor circuit; and carrying out a curing treatment to cure completely said plating resist by exposing to actinic radiation.
Claim 2
Dependent Claim
155 words
A process for producing a printed circuit board, which comprises the steps of: forming a layer comprising a photosensitive resin composition on an insulating substrate having on its surface an adhesive layer adherent to a metal being subsequently plated thereon; exposing said layer comprising a photosensitive resin composition to an actinic radiation in a manner so as to form on said layer a negative pattern of a conductor circuit pattern and to semicure said negative pattern to an extent sufficient to keep it from erosion by a plating solution; developing by dissolving away with a solvent the uncured areas not exposed to said actinic radiation, thereby to form a plating resist from the semicured areas of said negative pattern; chemically plating said conductor circuit pattern areas not covered with said plating resist, thereby to form a conductor circuit; and carrying out a curing treatment to cure completely said plating resist by exposing to actinic radiation.
Claim 3
Dependent Claim
33 words
A process for producing a printed circuit board according to claim 1, wherein the curing treatment of the resist after the plating is carried out by exposing to an actinic radiation and heating.
Claim 4
Dependent Claim
33 words
A process for producing a printed circuit board according to claim 1, wherein the photosensitive resin composition is a resin composition curable by ultraviolet rays and the actinic radiation is the ultraviolet rays.
Claim 5
Dependent Claim
23 words
A process for producing a printed circuit board according to claim 1, wherein the photosensitive resin composition is in the form of film.
Claim 6
Dependent Claim
167 words
A process for producing a printed circuit board, which comprises the steps of: forming a layer comprising a photosensitive resin composition on an insulating substrate having on its surface an adhesive layer adherent to a metal being subsequently plated thereon; exposing said layer comprising a photosensitive resin composition to an actinic radiation in a manner so as to form on said layer a negative pattern of a conductor circuit pattern and to semicure said negative pattern to an extent sufficient to keep it from erosion by a plating solution; developing by dissolving away with a solvent the uncured areas not exposed to said actinic radiation, thereby to form a plating resist from the semicured areas of said negative pattern; chemically plating said conductor circuit pattern areas not covered with said plating resist, thereby to form a conductor circuit; carrying out a curing treatment to cure completely said plating resist by exposing to actinic radiation; and forming a solder resist on said plating resist and on said circuit.
Claim 7
Dependent Claim
167 words
A process for producing a printed circuit board, which comprises the steps of: forming a layer comprising a photosensitive resin composition on an insulating substrate having on its surface an adhesive layer adherent to a metal being subsequently plated thereon; exposing said layer comprising a photosensitive resin composition to an actinic radiation in a manner so as to form on said layer a negative pattern of a conductor circuit pattern and to semicure said negative pattern to an extent sufficient to keep it from erosion by a plating solution; developing by dissolving away with a solvent the uncured areas not exposed to said actinic radiation, thereby to form a plating resist from the semicured areas of said negative pattern; chemically plating said conductor circuit pattern areas not covered with said plating resist, thereby to form a conductor circuit; carrying out a curing treatment to cure completely said plating resist by exposing to actinic radiation; and forming a solder resist on said plating resist and on said circuit.
Claim 8
Dependent Claim
34 words
A process for producing a printed circuit board according to claim 5, wherein the curing treatment of the plating resist after the plating is carried out by exposing to an actinic radiation and heating.
Claim 9
Dependent Claim
33 words
A process for producing a printed circuit board according to claim 5, wherein the photosensitive resin composition is a resin composition curable by ultraviolet rays and the actinic radiation is the ultraviolet rays.
Claim 10
Dependent Claim
23 words
A process for producing a printed circuit board according to claim 5, wherein the photosensitive resin composition is in the form of film.
Claim 11
Dependent Claim
30 words
A process for producing a printed circuit board according to claim 5, wherein the solder resist comprises a photosensitive resin composition and is curable by exposing to an actinic radiation.
Claim 12
Dependent Claim
173 words
A process for producing a printed circuit board, which comprises the steps of: forming a layer comprising a photosensitive resin composition on an insulating substrate having on its surface an adhesive layer adherent to a metal being subsequently plated thereon; exposing said layer comprising a photosensitive resin composition to an actinic radiation in a manner so as to form on said layer a negative pattern of a conductor circuit pattern and to semicure said negative pattern to an extent sufficient to keep it from erosion by a plating solution; developing by dissolving away with a solvent the uncured areas not exposed to said actinic radiation, thereby to form a plating resist from the semicured areas of said negative pattern; chemically plating said conductor circuit pattern areas not covered with said plating resist, thereby to form a conductor circuit; forming a second photosensitive resin layer in a pattern on said plating resist and on said conductor circuit; and curing completely the photosensitive resin layers to form a solder resist by exposing to actinic radiation.
Claim 13
Dependent Claim
173 words
A process for producing a printed circuit board, which comprises the steps of: forming a layer comprising a photosensitive resin composition on an insulating substrate having on its surface an adhesive layer adherent to a metal being subsequently plated thereon; exposing said layer comprising a photosensitive resin composition to an actinic radiation in a manner so as to form on said layer a negative pattern of a conductor circuit pattern and to semicure said negative pattern to an extent sufficient to keep it from erosion by a plating solution; developing by dissolving away with a solvent the uncured areas not exposed to said actinic radiation, thereby to form a plating resist from the semicured areas of said negative pattern; chemically plating said conductor circuit pattern areas not covered with said plating resist, thereby to form a conductor circuit; forming a second photosensitive resin layer in a pattern on said plating resist and on said conductor circuit; and curing completely the photosensitive resin layers to form a solder resist by exposing to actinic radiation.
Claim 14
Dependent Claim
35 words
A process for producing a printed circuit board according to claim 10, wherein the curing treatment of the photosensitive resin layers after the plating is carried out by exposing to an actinic radiation and heating.
Claim 15
Dependent Claim
33 words
A process for producing a printed circuit board according to claim 10, wherein the photosensitive resin composition is a resin composition curable by ultraviolet rays and the actinic radiation is the ultraviolet rays.
Claim 16
Dependent Claim
23 words
A process for producing a printed circuit board according to claim 10, wherein the photosensitive resin layer is in the form of film.
Claim 17
Dependent Claim
24 words
A process for producing a printed circuit board according to claim 10, wherein the second photosensitive resin layer is in the form of film.
Claim 18
Dependent Claim
167 words
A process for producing a printed circuit board, which comprises the steps of: forming a layer comprising a photosensitive resin composition containing at least one triphenylmethane dye and at least one polyhalogen compound on an insulating substrate having on its surface an adhesive layer adherent to a metal being subsequently plated thereon; exposing said layer comprising a photosensitive resin composition to an actinic radiation in a manner so as to form on said layer a negative pattern of a conductor circuit pattern and to semicure said negative pattern to an extent sufficient to keep it from erosion by a plating solution; developing by dissolving away with a solvent the uncured areas not exposed to said actinic radiation, thereby to form a plating resist from the semicured areas of said negative pattern; chemically plating said conductor circuit pattern areas not covered with said plating resist, thereby to form a conductor circuit; and carrying out a curing treatment to cure completely said plating resist by exposing to actinic radiation.
Claim 19
Dependent Claim
167 words
A process for producing a printed circuit board, which comprises the steps of: forming a layer comprising a photosensitive resin composition containing at least one triphenylmethane dye and at least one polyhalogen compound on an insulating substrate having on its surface an adhesive layer adherent to a metal being subsequently plated thereon; exposing said layer comprising a photosensitive resin composition to an actinic radiation in a manner so as to form on said layer a negative pattern of a conductor circuit pattern and to semicure said negative pattern to an extent sufficient to keep it from erosion by a plating solution; developing by dissolving away with a solvent the uncured areas not exposed to said actinic radiation, thereby to form a plating resist from the semicured areas of said negative pattern; chemically plating said conductor circuit pattern areas not covered with said plating resist, thereby to form a conductor circuit; and carrying out a curing treatment to cure completely said plating resist by exposing to actinic radiation.
Claim 20
Dependent Claim
33 words
A process for producing a printed circuit board according to claim 15, wherein the curing treatment of the resist after the plating is carried out by exposing to an actinic radiation and heating.
Claim 21
Dependent Claim
33 words
A process for producing a printed circuit board according to claim 15, wherein the photosensitive resin composition is a resin composition curable by ultraviolet rays and the actinic radiation is the ultraviolet rays.
Claim 22
Dependent Claim
23 words
A process for producing a printed circuit board according to claim 15, wherein the photosensitive resin composition is in the form of film.
Claim 23
Dependent Claim
38 words
A process for producing a printed circuit board according to claim 15, wherein said triphenylmethane dye is at least one dye selected from the group consisting of Crystal Violet Lactone, Benzoyl Leuco Methylene Blue, and Leuco Crystal Violet.
Claim 24
Dependent Claim
32 words
A process for producing a printed circuit board according to claim 15, wherein said polyhalogen compound is at least one compound selected from the group consisting of pentabromoethane, tribromomethylphenysulfone, tribromoacetamide, and tribromophenylsulfone.
Claim 25
Dependent Claim
175 words
A process for producing a printed circuit board, which comprises the steps of: forming a layer comprising a photosensitive resin composition containing at least one triphenylmethane dye and at least one polyhalogen compound on an insulating substrate having on its surface an adhesive layer adherent to a metal being subsequently plated thereon; exposing said layer comprising a photosensitive resin composition to an actinic radiation in a manner so as to form on said layer a negative pattern of a conductor circuit pattern and to semicure said negative pattern to an extent sufficient to keep it from erosion by a plating solution; developing by dissolving away with a solvent the uncured areas not exposed to said actinic radiation, thereby to form a plating resist from the semicured areas of said negative pattern; chemically plating said conductor circuit pattern areas not covered with said plating resist, thereby to form a conductor circuit; carrying out a curing treatment to cure completely said plating resist by exposing to actinic radiation; and forming a solder resist on said plating resist.
Claim 26
Dependent Claim
175 words
A process for producing a printed circuit board, which comprises the steps of: forming a layer comprising a photosensitive resin composition containing at least one triphenylmethane dye and at least one polyhalogen compound on an insulating substrate having on its surface an adhesive layer adherent to a metal being subsequently plated thereon; exposing said layer comprising a photosensitive resin composition to an actinic radiation in a manner so as to form on said layer a negative pattern of a conductor circuit pattern and to semicure said negative pattern to an extent sufficient to keep it from erosion by a plating solution; developing by dissolving away with a solvent the uncured areas not exposed to said actinic radiation, thereby to form a plating resist from the semicured areas of said negative pattern; chemically plating said conductor circuit pattern areas not covered with said plating resist, thereby to form a conductor circuit; carrying out a curing treatment to cure completely said plating resist by exposing to actinic radiation; and forming a solder resist on said plating resist.
Claim 27
Dependent Claim
34 words
A process for producing a printed circuit board according to claim 21, wherein the curing treatment of the plating resist after the plating is carried out by exposing to an actinic radiation and heating.
Claim 28
Dependent Claim
33 words
A process for producing a printed circuit board according to claim 21, wherein the photosensitive resin composition is a resin composition curable by ultraviolet rays and the actinic radiation is the ultraviolet rays.
Claim 29
Dependent Claim
23 words
A process for producing a printed circuit board according to claim 21, wherein the photosensitive resin composition is in the form of film.
Claim 30
Dependent Claim
31 words
A process for producing a printed circuit board according to claim 21, wherein the solder resist comprises a photosensitive resin composition and is cured by the exposure to an actinic radiation.
Claim 31
Dependent Claim
38 words
A process for producing a printed circuit board according to claim 21, wherein said triphenylmethane dye is at least one dye selected from the group consisting of Crystal Violet Lactone, Benzoyl Leuco Methylene Blue, and Leuco Crystal Violet.
Claim 32
Dependent Claim
32 words
A process for producing a printed circuit board according to claim 21, wherein said polyhalogen compound is at least one compound selected from the group consisting of pentabromoethane, tribromomethylphenylsulfone, tribromoacetamide, and tribromophenylsulfone.
Claim 33
Dependent Claim
185 words
A process for producing a printed circuit board, which comprises the steps of: forming a layer comprising a photosensitive resin composition containing at least one triphenylmethane dye and at least one polyhalogen compound on an insulating substrate having on its surface an adhesive layer adherent to a metal being subsequently plated thereon; exposing said layer comprising a photosensitive resin composition to an actinic radiation in a manner so as to form on said layer a negative pattern of a conductor circuit pattern and to semicure said negative pattern to an extent sufficient to keep it from erosion by a plating solution; developing by dissolving away with a solvent the uncured areas not exposed to said actinic radiation, thereby to form a plating resist from the semicured areas of said negative pattern; chemically plating said conductor circuit pattern areas not covered with said plating resist, thereby to form a conductor circuit; forming a second photosensitive resin layer in a pattern on said plating resist and on said conductor circuit; and curing completely the photosensitive resin layers to form a solder resist by exposing to actinic radiation.
Claim 34
Dependent Claim
185 words
A process for producing a printed circuit board, which comprises the steps of: forming a layer comprising a photosensitive resin composition containing at least one triphenylmethane dye and at least one polyhalogen compound on an insulating substrate having on its surface an adhesive layer adherent to a metal being subsequently plated thereon; exposing said layer comprising a photosensitive resin composition to an actinic radiation in a manner so as to form on said layer a negative pattern of a conductor circuit pattern and to semicure said negative pattern to an extent sufficient to keep it from erosion by a plating solution; developing by dissolving away with a solvent the uncured areas not exposed to said actinic radiation, thereby to form a plating resist from the semicured areas of said negative pattern; chemically plating said conductor circuit pattern areas not covered with said plating resist, thereby to form a conductor circuit; forming a second photosensitive resin layer in a pattern on said plating resist and on said conductor circuit; and curing completely the photosensitive resin layers to form a solder resist by exposing to actinic radiation.
Claim 35
Dependent Claim
35 words
A process for producing a printed circuit board according to claim 28, wherein the curing treatment of the photosensitive resin layers after the plating is carried out by exposing to an actinic radiation and heating.
Claim 36
Dependent Claim
33 words
A process for producing a printed circuit board according to claim 28, wherein the photosensitive resin composition is a resin composition curable by ultraviolet rays and the actinic radiation is the ultraviolet rays.
Claim 37
Dependent Claim
23 words
A process for producing a printed circuit board according to claim 28, wherein the photosensitive resin composition is in the form of film.
Claim 38
Dependent Claim
24 words
A process for producing a printed circuit board according to claim 28, wherein the second photosensitive resin layer is in the form of film.
Claim 39
Dependent Claim
38 words
A process for producing a printed circuit board according to claim 28, wherein said triphenylmethane dye is at least one dye selected from the group consisting of Crystal Violet Lactone, Benzoyl Leuco Methylene Blue, and Leuco Crystal Violet.
Claim 40
Dependent Claim
32 words
A process for producing a printed circuit board according to claim 28, wherein said polyhalogen compound is at least one compound selected from the group consisting of pentabromoethane, tribromomethylphenysulfone, tribromoacetamide, and tribromophenylsulfone.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-10-23 | 1993-04-24 | 1993-10-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-10-23 | 1997-04-24 | 1997-10-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-10-23 | 2001-04-24 | 2001-10-24 | $7700.00 | Window Closed / Lapsed |