Patent US4875283A successfully refreshed from Google Patents.
US4875283A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for manufacturing printed circuit boards
Assignee: Gould Electronics Inc
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Filing: 1988-08-25
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Granted: 1989-10-24
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Expires: 2008-08-25
Abstract
Abstract There is disclosed a dual purpose separator-release plate (30) for the use in the lamination and drilling of printed circuit boards, comprising a substrate sheet of aluminum foil (32), covered on both sides with release material (34), the plates being placed in engagement with the foil surfaces (6) and (8) of a PC board prior to curing the epoxy layer (4), after curing, retaining the separator-release plates in engagement with the PC board, and which plates serve as drill entry and drill backup material.
Inventors
- 👤 James A. Johnston
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 13:32
CPC Classifications
B; B29; B29C; B29C43/00; B29C43/02; B29C43/18; B29C33/00; B29C33/56; B29C33/68; B29C43/20; B29C43/203; B29C43/32; B29C43/36; B29C43/3642; B32; B32B; B32B37/00; B32B37/14; B32B37/26; H; H05; H05K; H05K3/00; H05K3/02; H05K3/022; B29C2043/3657; B29K; B29K2105/00; B29K2105/06; B29K2105/08; B29K2105/0872; B29K2105/25; B29K2105/253; B29K2105/256; B32B2457/00; B32B2457/08; H05K2203/00; H05K2203/06; H05K2203/068; H05K3/0011; H05K3/0044; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49155; Y10T29/49163; Y10T29/49165
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
159 words
A method of making laminated printed circuit boards of the type having outer conductive metallic layers and at least one inner dielectric layer containing heat curable resin comprising the steps of: assembling a multi-layer book of circuit boards, one on top of another in a press lay-up, placing a dual purpose separator-release sheet formed of aluminum and coated on both sides with a siloxazane polymer in engagement with each outer metallic layer of a board, subjecting the laid-up book to heat and pressure to cure the heat curable resin separating at least one cured board from the book, retaining the separator-release sheets in engagement with the outer metallic layers of the separated board and drilling conductor lead holes in the board with the separator-release sheets attached, whereby the separator-release sheets serve to prevent the heat curable resin from contaminating adjacent boards in the curing process and serve as drill entry and drill back up material in the drilling process.
Claim 2
Independent Claim
159 words
A method of making laminated printed circuit boards of the type having outer conductive metallic layers and at least one inner dielectric layer containing heat curable resin comprising the steps of: assembling a multi-layer book of circuit boards, one on top of another in a press lay-up, placing a dual purpose separator-release sheet formed of aluminum and coated on both sides with a siloxazane polymer in engagement with each outer metallic layer of a board, subjecting the laid-up book to heat and pressure to cure the heat curable resin separating at least one cured board from the book, retaining the separator-release sheets in engagement with the outer metallic layers of the separated board and drilling conductor lead holes in the board with the separator-release sheets attached, whereby the separator-release sheets serve to prevent the heat curable resin from contaminating adjacent boards in the curing process and serve as drill entry and drill back up material in the drilling process.
Claim 3
Independent Claim
190 words
A method of making laminated printed circuit boards of the type having outer conductive metallic layers and at least one inner dielectric layer containing heat curable resin comprising the steps of: assembling a multi-layer book of circuit boards, one on top of another in a press lay-up, placing a dual purpose separator-release sheet formed of aluminum and coated on both sides with a siloxazane polymeric resin in engagement with each outer metallic layer of a board, placing a second separator release sheet in engagement with a sheet that separates at least every second board in the book, subjecting the laid-up book to heat and pressure to cure the heat curable resin, separating the book of cured boards into stacks of at least two boards each, retaining the separator-release sheets in engagement with the outer metallic layers of the stack of two or more boards, and drilling conductor lead holes in each stack of two or more boards with the separator-release sheets attached, the separator-release sheets serving to prevent the heat curable resin from contaminating adjacent boards and serving as drill entry and drill back up material in the drilling process.
Claim 4
Independent Claim
190 words
A method of making laminated printed circuit boards of the type having outer conductive metallic layers and at least one inner dielectric layer containing heat curable resin comprising the steps of: assembling a multi-layer book of circuit boards, one on top of another in a press lay-up, placing a dual purpose separator-release sheet formed of aluminum and coated on both sides with a siloxazane polymeric resin in engagement with each outer metallic layer of a board, placing a second separator release sheet in engagement with a sheet that separates at least every second board in the book, subjecting the laid-up book to heat and pressure to cure the heat curable resin, separating the book of cured boards into stacks of at least two boards each, retaining the separator-release sheets in engagement with the outer metallic layers of the stack of two or more boards, and drilling conductor lead holes in each stack of two or more boards with the separator-release sheets attached, the separator-release sheets serving to prevent the heat curable resin from contaminating adjacent boards and serving as drill entry and drill back up material in the drilling process.
References Cited (Backward Citations)
US3969177A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-10-23 | 1993-04-24 | 1993-10-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-10-23 | 1997-04-24 | 1997-10-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-10-23 | 2001-04-24 | 2001-10-24 | $7700.00 | Window Closed / Lapsed |