Component mounting process for printed circuit boards

Claim 2

For use in the manufacture of a layered printed circuit board assembly having first and second layers with electrically conductive patterns thereon, a process for through-mounting in said assembly a surface-mount device having an electrically conductive cap at each end, comprising: providing aligned holes in said first and second layers adjoining said conductive patterns; providing an inner layer between said first and second layers and forming said layer of plastic tape inherently compliant and yielding for receiving said surface-mount device; coating said tape with an easily performable metal layer providing electrical shielding between said layers; inserting said device through said aligned holes and said material; electrically and mechanically connecting at least one of said end caps of said surface-mount device to at least one of said conductive layers; said inner layer, by virtue of its being inherently compliant and yielding, physically retaining said surface-mount device in place pending the electrical and mechanical connection of the electrically conductive end caps to the conductive patterns

Claim 3

For use in the manufacture of a layered printed circuit board assembly having first and second layers with electrically conductive patterns thereon, a process for through-mounting in said assembly a surface-mount device having an electrically conductive cap at each end, comprising: providing aligned holes in said first and second layers adjoining said conductive patterns; providing an inner layer between said first and second layers comprising a compliant plastic tape coated with an easily perforable metal layer providing electrical shielding between said layers; inserting said device through aligned holes and said compliant plastic tape; electrically and mechanically connecting at least one of said end caps of said surface-mounted device to at least one of said conductive layers; said compliant plastic tape physically retaining said surface-mount device in place pending the electrical and mechanical connection of said electrically conductive end caps to said conductive patterns, and said metal layer providing electrical shielding between said layers.

Claim 4

For use in the manufacture of a layered printed circuit board assembly having first and second layers with electrically conductive patterns thereon, a process for through-mounting in said assembly a surface-mount device having an electrically conductive cap at each end, comprising: providing aligned holes in said first and second layers adjoining said conductive patterns; providing an inner layer between said first and second layers comprising a compliant plastic tape coated with an easily perforable metal layer providing electrical shielding between said layers; inserting said device through aligned holes and said compliant plastic tape; electrically and mechanically connecting at least one of said end caps of said surface-mounted device to at least one of said conductive layers; said compliant plastic tape physically retaining said surface-mount device in place pending the electrical and mechanical connection of said electrically conductive end caps to said conductive patterns, and said metal layer providing electrical shielding between said layers.

Claim 5

For use in the manufacture of a layered printed circuit board assembly having first and second layers with electrically conductive patterns thereon, a process for through-mounting a surface-mount device having a cap at each end, comprising: providing aligned holes in said layers adjoining with said conductive patterns; providing an inner layer having at least one hole aligned with said aligned holes in said first and second layers, and coating said layer with metal in electrical contact with at least one of said conductive patterns. extending a flexible electrical coextension of said inner layer from said assembly with an electrical connector on the end thereof; inserting said surface-mount device through said aligned holes; electrically and mechanically connecting at least one of said end caps to at least one of said conductive layers; said inner layer physically retaining said surface-mount device in plane pending the electrical and mechanical connection of said end caps to said conductive patterns, and by its extension, providing for electrical connection of said assembly to other assemblies.

Claim 6

For use in the manufacture of a layered printed circuit board assembly having first and second layers with electrically conductive patterns thereon, a process for through-mounting a surface-mount device having a cap at each end, comprising: providing aligned holes in said layers adjoining with said conductive patterns; providing an inner layer having at least one hole aligned with said aligned holes in said first and second layers, and coating said layer with metal in electrical contact with at least one of said conductive patterns. extending a flexible electrical coextension of said inner layer from said assembly with an electrical connector on the end thereof; inserting said surface-mount device through said aligned holes; electrically and mechanically connecting at least one of said end caps to at least one of said conductive layers; said inner layer physically retaining said surface-mount device in plane pending the electrical and mechanical connection of said end caps to said conductive patterns, and by its extension, providing for electrical connection of said assembly to other assemblies.

Claim 7

The process according to claim 3 comprising forming said flexible extension from printed wiring cable having printed conductors, and electrically connecting said conductors to said electrically conductive patterns of said assembly.

Claim 8

For use in the manufacture of a layered printed circuit board assembly having first and second layers with electrically conductive patterns thereon, a process for through-mounting in said assembly a surface-mount device having an electrically conductive cap at each end, comprising: providing aligned holes in said first and second layers adjoining said conductive patterns; heat-sinking and electrically shielding said assembly by interleaving a sheet of metal between said first and second layers; providing at least one surface-mount device having an electrically conductive cap at each end for electrical connection to at least one of said conductive patterns; forming at least one hole in said sheet of metal for receiving said surface-mount device inserted through aligned holes in said outer layers; adapting said sheet of metal to physically retain said surface-mount device in place pending electrical connection of said end cap to at least one of said conductive patterns by applying a compliant plastic tape to said sheet of metal; and extending said sheet of metal external said assembly, and mechanically attaching said assembly to another component.

Claim 9

For use in the manufacture of a layered printed circuit board assembly having first and second layers with electrically conductive patterns thereon, a process for through-mounting in said assembly a surface-mount device having an electrically conductive cap at each end, comprising: providing aligned holes in said first and second layers adjoining said conductive patterns; heat-sinking and electrically shielding said assembly by interleaving a sheet of metal between said first and second layers; providing at least one surface-mount device having an electrically conductive cap at each end for electrical connection to at least one of said conductive patterns; forming at least one hole in said sheet of metal for receiving said surface-mount device inserted through aligned holes in said outer layers; adapting said sheet of metal to physically retain said surface-mount device in place pending electrical connection of said end cap to at least one of said conductive patterns by applying a compliant plastic tape to said sheet of metal; and extending said sheet of metal external said assembly, and mechanically attaching said assembly to another component.