US4871608A
Expired / Lapsed
US
⏱️ 0.0 years remaining
High-density wiring multilayered substrate
Assignee: Niterra Co Ltd
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Filing: 1987-12-10
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Granted: 1989-10-03
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Expires: 2007-12-10
Abstract
Abstract A high-density wiring multi-layered substrate comprising a plurality of sequentially laminated green sheets containing crystallizable glass, each of the green sheets having a conductor paste on the surface thereof, the conductive component of the conductor paste comprising at least about 80 wt % of one copper component selected from copper and copper oxide and at least one member selected from up to about 15 parts by weight of MnO 2 and up to about 10 parts by weight of Ag 2 O based on 100 parts by weight of said copper component in terms of metallic copper.
Inventors
- 👤 Kazuo Kondo
- 👤 Asao Morikawa
- 👤 Hiroshi Iwata
- 👤 Yoshimasa Shibata
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 21:09
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/09; H05K1/092; C; C03; C03C; C03C17/00; C03C17/006; C03C17/008; C03C17/06; C03C17/22; C03C17/23; C03C2217/00; C03C2217/20; C03C2217/21; C03C2217/23; C03C2217/29; C03C2218/00; C03C2218/10; C03C2218/11; C03C2218/119; H05K1/03; H05K1/0306; H05K3/00; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4629; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/24926
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
95 words
A high-density wiring multi-layered substrate comprising a plurality of sequentially laminated green sheets of crystallizable glass, each of said green sheets having a conductor paste on the surface thereof, the conductive component of said conductor paste comprising at least about 80% of one copper component selected from copper and copper oxide and at least one member selected from up to about 15 parts by weight of MnO 2 and up to about 10 parts by weight of Ag 2 O based on 100 parts by weight of said copper component in terms of metallic copper.
Claim 2
Dependent Claim
95 words
A high-density wiring multi-layered substrate comprising a plurality of sequentially laminated green sheets of crystallizable glass, each of said green sheets having a conductor paste on the surface thereof, the conductive component of said conductor paste comprising at least about 80% of one copper component selected from copper and copper oxide and at least one member selected from up to about 15 parts by weight of MnO 2 and up to about 10 parts by weight of Ag 2 O based on 100 parts by weight of said copper component in terms of metallic copper.
Claim 3
Dependent Claim
50 words
A high density wiring multi-layered substrate according to claim 1, wherein said conductor paste further comprises a titanium compound selected from TiO 2 and TiH 2 in an amount of up to about 4 parts by weight per 100parts by weight of said copper component in terms of metallic copper.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-10-02 | 1993-04-03 | 1993-10-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-10-02 | 1997-04-03 | 1997-10-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-10-02 | 2001-04-03 | 2001-10-03 | $7700.00 | Window Closed / Lapsed |