US4870751A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing printed circuit boards
Assignee: Siemens AG
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Filing: 1988-03-31
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Granted: 1989-10-03
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Expires: 2008-03-31
Abstract
Abstract A method of manufacturing printed circuit boards. An environmentally safe method for manufactured printed circuit boards using additive technology provides a simple and exact transfer of conductor patterns. The novel method provides a selective ablation of a nucleation, B, applied to a substrate either by itself or together with a thin base layer, G, applied by chemical metal deposition. This ablation is done by electromagnetic radiation preferably with an excimer laser in those regions of the substrate that do not correspond to the conductor tracks and/or interlayer connections or through-connections to be formed later. Conductor material is subsequently built up by chemical and/or galvanic metal deposition.
Inventors
- 👤 Mattelin Antoon
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 02:42
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K3/185; H05K3/02; C; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1603; C23C18/1607; C23C18/1608; C23C18/1612; C23C18/18; C23C18/20; C23C18/28; C23C18/285; C23C18/30; C23C18/31; C23C18/38; C25; C25D; C25D5/00; C25D5/02; H05K2203/00; H05K2203/10; H05K2203/107; H05K3/40; H05K3/42; H05K3/425; H05K3/426; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49165
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
83 words
A method for the manufacture of printed circuit boards using additive technology, wherein conductor material is applied onto an electrically insulating substrate by nucleation, activation and by at least chemical metal deposition of chemical and galvanic metal deposition, comprising: applying by chemical metal deposition a nucleation, B, over the substrate; removing by a ablation with electromagnetic radiation the nucleation, B, in regions of the substrate that do not correspond to electrically conductive paths; and applying the conductor material to the electrically conductive paths.
Claim 2
Independent Claim
83 words
A method for the manufacture of printed circuit boards using additive technology, wherein conductor material is applied onto an electrically insulating substrate by nucleation, activation and by at least chemical metal deposition of chemical and galvanic metal deposition, comprising: applying by chemical metal deposition a nucleation, B, over the substrate; removing by a ablation with electromagnetic radiation the nucleation, B, in regions of the substrate that do not correspond to electrically conductive paths; and applying the conductor material to the electrically conductive paths.
Claim 3
Dependent Claim
16 words
The method according to claim 1, wherein PdCl 2 -SnCl 2 is used as nucleation, B.
Claim 4
Dependent Claim
15 words
The method according to claim 1, wherein a palladium-organic compound is used as nucleation, B.
Claim 5
Dependent Claim
24 words
The method according to claim 1, wherein ablation is done after the application of the nucleation, B, and before activation of the nucleation, B.
Claim 6
Dependent Claim
15 words
The method according to claim 1, wherein a substrate of fiberglass-reinforced polyether imide is used.
Claim 7
Dependent Claim
18 words
The method according to claim 1, wherein the ablation is done with the use of a UV laser.
Claim 8
Dependent Claim
18 words
The method according to claim 6, wherein the ablation is done with the use of an excimer laser.
Claim 9
Dependent Claim
15 words
The method according to claim 7, wherein the excimer laser is a pulse excimer laser.
Claim 10
Dependent Claim
55 words
The method according to claim 1, wherein the method further comprises after applying the nucleation, B, applying by chemical metal deposition a thin base layer, G, and removing by ablation the thin base layer, G, along with the nucleation, B, in regions of the substrate that do not correspond to conductor tracks and interlayer connections.
Claim 11
Dependent Claim
16 words
The method according to claim 1, wherein the conductor material is applied by chemical metal deposition.
Claim 12
Dependent Claim
16 words
The method according to claim 1, wherein the conductor material is applied by galvanic metal deposition.
Claim 13
Dependent Claim
14 words
The method according to claim 1, wherein the electrically conductive paths are conductor tracks.
Claim 14
Dependent Claim
14 words
The method according to claim 1, wherein the electrically conductive paths are interlayer connections.
Claim 15
Dependent Claim
17 words
The method according to claim 1, wherein the electrically conductive paths are conductor tracks and interlayer connections.
Claim 16
Independent Claim
83 words
A method for the manufacture of printed circuit boards using additive technology comprising: providing an electrically insulating substrate; applying by chemical metal deposition a nucleation, B, over the substrate; apply by chemical metal deposition a thin base layer, G, over the nucleation, B; removing by ablation with electromagnetic radiation the thin base layer, G, and the nucleation, B, in regions of the substrate that do not correspond to conductor tracks and interlayer connections; applying conductor material over the remaining thin base layer, G.
Claim 17
Independent Claim
83 words
A method for the manufacture of printed circuit boards using additive technology comprising: providing an electrically insulating substrate; applying by chemical metal deposition a nucleation, B, over the substrate; apply by chemical metal deposition a thin base layer, G, over the nucleation, B; removing by ablation with electromagnetic radiation the thin base layer, G, and the nucleation, B, in regions of the substrate that do not correspond to conductor tracks and interlayer connections; applying conductor material over the remaining thin base layer, G.
Claim 18
Dependent Claim
16 words
The method according to claim 15, wherein the conductor material is applied by chemical metal deposition.
Claim 19
Dependent Claim
16 words
The method according to claim 15, wherein the conductor material is applied by galvanic metal deposition.
Claim 20
Dependent Claim
16 words
The method according to claim 15, wherein PdCl 2 -SnCl 2 is used as nucleation, B.
Claim 21
Dependent Claim
15 words
The method according to claim 15, wherein a palladium-organic compound is used as nucleation, B.
Claim 22
Dependent Claim
16 words
The method according to claim 15, wherein the ablation is done with a pulse excimer laser.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-10-02 | 1993-04-03 | 1993-10-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-10-02 | 1997-04-03 | 1997-10-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-10-02 | 2001-04-03 | 2001-10-03 | $7700.00 | Window Closed / Lapsed |