US4859571A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Embedded catalyst receptors for metallization of dielectrics
Assignee: EIDP Inc
•
Filing: 1986-12-30
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Granted: 1989-08-22
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Expires: 2006-12-30
Abstract
Abstract The invention is directed to a laminate for the preparation of printed circuits by electroless plating of conductive metal thereon which comprises a. an electrically insulative substrate bearing b. an adherent layer of crosslinked polymeric adhesive, which is insoluble in photodielectric developing solutions, having partially embedded therein finely divided particles of adsorbent which protrude from the adhesive surface away from the substrate, the protrusive surfaces of which are adsorptive with respect to electroless plating catalysts or reductive precursors thereof, and c. a solid layer of photodielectric adherently overlying the layer of adhesive and adsorbent particles.
Inventors
- 👤 Abraham B. Cohen
- 👤 Roxy Fan
- 👤 John A. Quinn
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 02:17
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/18; H05K3/00; H05K3/38; G; G03; G03F; G03F7/00; G03F7/004; G03F7/0047; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K3/184; H05K3/185; H05K3/386; H05K3/387; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2203/00; H05K2203/05; H05K2203/0502; H05K2203/0525; H05K2203/14; H05K2203/1415; H05K3/0011; H05K3/0017; H05K3/0023
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
88 words
A laminate for the preparation of printed circuits by electroless plating of conductive metal thereon which comprises a. a substrate b. at least one surface of the substrate having an adherent layer of polymeric adhesive, having partially embedded therein finely divided microporus particles of adsorbent which protrude from the adhesive surface away from the substrate, the protrusive surfaces of which are adsorptive with respect to electroless plating catalysts or reductive precursors thereof, and c. a solid layer of photodielectric adherently overlying the layer of adhesive and adsorbent particles.
Claim 2
Dependent Claim
88 words
A laminate for the preparation of printed circuits by electroless plating of conductive metal thereon which comprises a. a substrate b. at least one surface of the substrate having an adherent layer of polymeric adhesive, having partially embedded therein finely divided microporus particles of adsorbent which protrude from the adhesive surface away from the substrate, the protrusive surfaces of which are adsorptive with respect to electroless plating catalysts or reductive precursors thereof, and c. a solid layer of photodielectric adherently overlying the layer of adhesive and adsorbent particles.
Claim 3
Dependent Claim
11 words
The laminate of claim 1 in which the substrate is inorganic.
Claim 4
Dependent Claim
11 words
The laminate of claim 2 in which the substrate is alumina.
Claim 5
Dependent Claim
13 words
The laminate of claim 1 in which the substrate is an organic polymer.
Claim 6
Dependent Claim
12 words
The laminate of claim 1 in which the substrate is a composite.
Claim 7
Dependent Claim
14 words
The laminate of claim 1 in which the substrate is a glass-filled network resin.
Claim 8
Dependent Claim
12 words
The laminate of claim 1 in which the adsorbent is microporous alumina.
Claim 9
Dependent Claim
15 words
The laminate of claim 1 in which the photodielectric layer is a dry film photodielectric.
Claim 10
Dependent Claim
16 words
The laminate of claim 1 in which the photodielectric is a dried layer of liquid photodielectric.
Claim 11
Dependent Claim
15 words
The laminate of either claim 6 or 7 in which the photodielectric is nonaqueously developable.
Claim 12
Dependent Claim
28 words
The laminate of claim 1 in which the adsorptive surfaces have been rendered catalystic by adsorption thereon of an electroless plating catalyst prior to applying the photodielectric layer.
Claim 13
Dependent Claim
17 words
The laminate of claim 6 in which the photodielectric layer is protected by a strippable cover sheet.
Claim 14
Independent Claim
122 words
A method for making a laminate for the preparation of printed circuits by electroless plating of conductive metal thereon which comprises the sequential steps of 1. forming an adherent layer of crosslinkable polymeric adhesive on at least one surface of a substrate; 2. toning the layer with finely divided microporous, particles of adsorbent so that they become partially embedded within and protrude form the surface of the adhesive, the surfaces of the protruding part of the particles being adsorptive with respect to electroless plating catalysts or reductive precursors thereof; 3. crosslinking the polymer adhesive to harden the layer and firmly hold the embedded particle surfaces; and 4. applying a layer of photodielectric to the layer of crosslinked adhesive and protrusive adsorbent particles.
Claim 15
Independent Claim
122 words
A method for making a laminate for the preparation of printed circuits by electroless plating of conductive metal thereon which comprises the sequential steps of 1. forming an adherent layer of crosslinkable polymeric adhesive on at least one surface of a substrate; 2. toning the layer with finely divided microporous, particles of adsorbent so that they become partially embedded within and protrude form the surface of the adhesive, the surfaces of the protruding part of the particles being adsorptive with respect to electroless plating catalysts or reductive precursors thereof; 3. crosslinking the polymer adhesive to harden the layer and firmly hold the embedded particle surfaces; and 4. applying a layer of photodielectric to the layer of crosslinked adhesive and protrusive adsorbent particles.
Claim 16
Dependent Claim
15 words
The laminate of claim 1 in which the substrate contains a plurality of through holes.
Claim 17
Dependent Claim
19 words
The laminate of claim 1 in which have an adherent layer (b) and an overlying layer of photodielectric (c).
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-08-21 | 1993-02-20 | 1993-08-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-08-21 | 1997-02-20 | 1997-08-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-08-21 | 2001-02-20 | 2001-08-22 | $7700.00 | Window Closed / Lapsed |