Manufacture of integrated circuits using holographic techniques

Claim 1

A method of manufacturing integrated circuits using holographic techniques including the steps of: (a) providing a first recording medium exhibiting negligible scatter and high resolution without shrinking or distorting during the course of manufacture. (b) forming a volume holographic image of the integrated circuit on the first recording medium by interference between an input beam of coherent light which passes through a mask window containing the design of the integrated circuit, and a reference beam of coherent light which is totally internally reflected at the surface on which the recording medium is located, the interference taking place both with the incident and the reflected reference beam; (c) removing the mask window and placing in its place a silicon slice having a second recording medium on which the formed holographic image is to be reproduced; (d) forming an image of the hologram on the second recording medium of the silicon slice by interference between the input beam and another reference beam which travels in the reverse direction from the first reference beam which formed the hologram; and (e) repeating step (d) with another silicon slice as many times as required to manufacture a plurality of silicon slices containing an image of the integrated circuit formed thereon.

Claim 2

A method of manufacturing integrated circuits using holographic techniques including the steps of: (a) providing a first recording medium exhibiting negligible scatter and high resolution without shrinking or distorting during the course of manufacture. (b) forming a volume holographic image of the integrated circuit on the first recording medium by interference between an input beam of coherent light which passes through a mask window containing the design of the integrated circuit, and a reference beam of coherent light which is totally internally reflected at the surface on which the recording medium is located, the interference taking place both with the incident and the reflected reference beam; (c) removing the mask window and placing in its place a silicon slice having a second recording medium on which the formed holographic image is to be reproduced; (d) forming an image of the hologram on the second recording medium of the silicon slice by interference between the input beam and another reference beam which travels in the reverse direction from the first reference beam which formed the hologram; and (e) repeating step (d) with another silicon slice as many times as required to manufacture a plurality of silicon slices containing an image of the integrated circuit formed thereon.

Claim 8

A method of manufacturing integrated circuits using holographic techniques including the steps of: (a) providing a first recording medium exhibiting negligible scatter and high resolution without shrinking or distorting during the course of manufacture. (b) generating an input beam and first and second reference beams from a source of coherent light; (c) forming a volume holographic image of the integrated circuit on the first recording medium by interference between the input beam which passes through a mask window containing the design of the integrated circuit, and the first reference beam which is totally internally reflected at the surface on which the recording medium is located, the interference taking place both with the incident and the reflected reference beam; (d) removing the mask window and placing in its place a silicon slice having a second recording medium on which the formed holographic image is to be reproduced; (e) forming an image of the hologram on the second recording medium of the silicon slice by interference between the input beam and the second reference beam which travels in the reverse direction from the first reference beam which formed the hologram; and (f) repeating step (e) with another silicon slice a plurality of times in order to manufacture a plurality of silicon slices containing an image of the integrated circuit formed thereon.

Claim 9

A method of manufacturing integrated circuits using holographic techniques including the steps of: (a) providing a first recording medium exhibiting negligible scatter and high resolution without shrinking or distorting during the course of manufacture. (b) generating an input beam and first and second reference beams from a source of coherent light; (c) forming a volume holographic image of the integrated circuit on the first recording medium by interference between the input beam which passes through a mask window containing the design of the integrated circuit, and the first reference beam which is totally internally reflected at the surface on which the recording medium is located, the interference taking place both with the incident and the reflected reference beam; (d) removing the mask window and placing in its place a silicon slice having a second recording medium on which the formed holographic image is to be reproduced; (e) forming an image of the hologram on the second recording medium of the silicon slice by interference between the input beam and the second reference beam which travels in the reverse direction from the first reference beam which formed the hologram; and (f) repeating step (e) with another silicon slice a plurality of times in order to manufacture a plurality of silicon slices containing an image of the integrated circuit formed thereon.

Claim 11

A method of manufacturing integrated circuits using holographic techniques including the steps of: (a) providing a first recording medium exhibiting negligible scatter and high resolutions without shrinking or distortion; (b) generating an input beam and a first reference beam from an argon laser; (c) generating a second reference beam from a source in which a strong spectral line is used: (d) filtering out the unwanted radiation on either side of the spectral line; (e) forming a volume holographic image of the integrated circuit on the first recording medium by interference between the input beam which passes through a mask window containing the design of the integrated circuit, and the first reference beam which is totally internally reflected at the surface on which the recording medium is located, the interference taking place both with the incident and the reflected reference beam; (f) removing the mask window and placing in its place a silicon slice having a second recording medium on which the formed holographic image is to be reproduced; (g) forming an image of the hologram on the second recording medium of the silicon slice by interference between the input beam and the second reference beam which travels in the reverse direction from the first reference beam which forms the hologram; (h) moving the silicon slice vertically during exposure to achieve the required depth of focus; and (i) repeating step (g) with a series of silicon slices as many times as required so as to manufacture the required number of silicon slices each containing an image of the integrated circuit formed thereon.

Claim 12

A method of manufacturing integrated circuits using holographic techniques including the steps of: (a) providing a first recording medium exhibiting negligible scatter and high resolutions without shrinking or distortion; (b) generating an input beam and a first reference beam from an argon laser; (c) generating a second reference beam from a source in which a strong spectral line is used: (d) filtering out the unwanted radiation on either side of the spectral line; (e) forming a volume holographic image of the integrated circuit on the first recording medium by interference between the input beam which passes through a mask window containing the design of the integrated circuit, and the first reference beam which is totally internally reflected at the surface on which the recording medium is located, the interference taking place both with the incident and the reflected reference beam; (f) removing the mask window and placing in its place a silicon slice having a second recording medium on which the formed holographic image is to be reproduced; (g) forming an image of the hologram on the second recording medium of the silicon slice by interference between the input beam and the second reference beam which travels in the reverse direction from the first reference beam which forms the hologram; (h) moving the silicon slice vertically during exposure to achieve the required depth of focus; and (i) repeating step (g) with a series of silicon slices as many times as required so as to manufacture the required number of silicon slices each containing an image of the integrated circuit formed thereon.

Claim 16

A method of manufacturing integrated circuits using holographic techniques including the steps of: (a) providing a first recording medium exhibiting negligible scatter and high resolution without shrinking or distorting; (b) generating from a single laser source an input beam; (c) splitting from said input beam, a reference beam; (d) forming a volume holographic image of the integrated circuit on the first recording medium by interference between the input beam which passes through a mask window containing the design of the integrated circuit, and the reference beam which is totally internally reflected at the surface on which the recording medium is located, the interference taking place both with the incident and the reflected reference beam; (e) removing the mask window and placing in its place a silicon slice having a second recording medium on which the formed holographic image is to be reproduced; (f) redirecting the reference beam so as to travel in the reverse direction from that reference beam which formed the hologram; (g) forming an image of the hologram on the second recording medium of the silicon slice by interference between the input beam and the redirected reference beam; and (h) repeating step (g) with another silicon slice as many times as required to manufacture a plurality of silicons slices containing an image of the integrated circuit formed thereon.

Claim 17

A method of manufacturing integrated circuits using holographic techniques including the steps of: (a) providing a first recording medium exhibiting negligible scatter and high resolution without shrinking or distorting; (b) generating from a single laser source an input beam; (c) splitting from said input beam, a reference beam; (d) forming a volume holographic image of the integrated circuit on the first recording medium by interference between the input beam which passes through a mask window containing the design of the integrated circuit, and the reference beam which is totally internally reflected at the surface on which the recording medium is located, the interference taking place both with the incident and the reflected reference beam; (e) removing the mask window and placing in its place a silicon slice having a second recording medium on which the formed holographic image is to be reproduced; (f) redirecting the reference beam so as to travel in the reverse direction from that reference beam which formed the hologram; (g) forming an image of the hologram on the second recording medium of the silicon slice by interference between the input beam and the redirected reference beam; and (h) repeating step (g) with another silicon slice as many times as required to manufacture a plurality of silicons slices containing an image of the integrated circuit formed thereon.