Patent US4857387A successfully refreshed from Google Patents.
US4857387A
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Compensating element for stresses of thermal or mechanical orgin, especially for printed circuits, and process for making such an element employed in a printed circuit
Assignee: Cimulec SA
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Filing: 1987-10-27
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Granted: 1989-08-15
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Expires: 2007-10-27
Abstract
Abstract A printed circuit comprising an electrically insulating substrate and an electrically conductive layer on the substrate, this layer being a pseudo-elastic or elastically deformable alloy that undergoes significant deformations in a reversible manner and is a copper alloy containing at least 50% by weight copper in the form of large-grained polycrystals that undergo martensitic transformation. Preferably, the layer contains 60-80% by weight of copper, the large-grained polycrystals having a grain size of at least about 3 mm. The martensitic transformation takes place within the temperature range -55° C. to +125° C., and the layer has a thickness between 30μ and 200μ, preferably about 100μ.
Inventors
- 👤 Andre Eberhardt
- 👤 Serge Dominiak
- 👤 Marcel Berveiller
- 👤 Jean P. Lucas
- 👤 Robert P. Y. Guyon
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 19:16
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/09; C; C03; C03C; C03C27/00; C03C27/04; C03C27/042; C03C27/046; C04; C04B; C04B37/00; C04B37/02; C04B37/028; C22; C22F; C22F1/00; C22F1/006; H05K1/0271; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/257; C04B2237/00; C04B2237/30; C04B2237/32; C04B2237/40; C04B2237/407; C04B2237/50; C04B2237/70; C04B2237/706; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0308; H05K2201/06; H05K2201/068; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/12; Y10T428/12014; Y10T428/12028; Y10T428/12431; Y10T428/12438; Y10T428/12493; Y10T428/125; Y10T428/12507; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/26; Y10T428/263; Y10T428/264
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
88 words
A printed circuit comprising an electrically insulating substrate and an electrically conductive layer on said substrate, said layer having a thickness between 30μ and 200μ and being a pseudo-elastic alloy that undergoes significant deformations in a reversible manner, said layer being a copper alloy consisting essentially of at least 50% by weight copper in the form of large-grained polycrystals that undergo martensitic transformation and at least one other metal selected from the group consisting of tin, zinc, aluminum, nickel, silver, gold cadmium, gallium, indium, germamium, antimony and silicon.
Claim 2
Dependent Claim
88 words
A printed circuit comprising an electrically insulating substrate and an electrically conductive layer on said substrate, said layer having a thickness between 30μ and 200μ and being a pseudo-elastic alloy that undergoes significant deformations in a reversible manner, said layer being a copper alloy consisting essentially of at least 50% by weight copper in the form of large-grained polycrystals that undergo martensitic transformation and at least one other metal selected from the group consisting of tin, zinc, aluminum, nickel, silver, gold cadmium, gallium, indium, germamium, antimony and silicon.
Claim 3
Dependent Claim
18 words
A printed circuit as claimed in claim 1, in which said layer contains 60-80% by weight of copper.
Claim 4
Dependent Claim
29 words
A printed circuit as claimed in claim 2, in which said layer consists essentially of about 73.5% by weight copper, 20.5% by weight zinc, and 6% by weight aluminum.
Claim 5
Dependent Claim
29 words
A printed circuit as claimed in claim 2, in which said layer consists essentially of about 74.42% by weight copper, 18.45% by weight zinc, and 7.13% by weight aluminum.
Claim 6
Dependent Claim
23 words
A printed circuit as claimed in claim 1, in which said large-grained polycrystals have a grain size of at least about 3 mm.
Claim 7
Dependent Claim
24 words
A printed circuit as claimed in claim 1, in which said martensitic transformation takes place within the temperature range -55° C. to +125° C.
Claim 8
Dependent Claim
18 words
A printed circuit as claimed in claim 1, in which the thickness of said layer is about 100μ.
Claim 9
Dependent Claim
17 words
A printed circuit as claimed in claim 1, in which said alloy is an alloy of copper-zinc-aluminum.
Claim 10
Dependent Claim
17 words
A printed circuit as claimed in claim 1, in which said alloy is an alloy of copper-zinc-tin.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-08-14 | 1993-02-13 | 1993-08-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-08-14 | 1997-02-13 | 1997-08-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-08-14 | 2001-02-13 | 2001-08-15 | $7700.00 | Window Closed / Lapsed |