Solid state telephone protector module

Claim 1

An improved solid state protector module for use with laminar type connector blocks for protecting an individual subscriber circuit, said module comprising: a generally planar insulated base having a pair of through openings extending between first and second oppositely disposed surfaces thereof, a printed circuit on one of said first and second surfaces; tip, ring and ground contacts extending outwardly of said base at one end thereof and communicating with said printed circuit; a pair of solid state integrated protector elements positioned within said through openings and electrically communicating with said printed circuit, said units being heat responsive to current overloads; a shorting spring interconnected at a medial point to said base to conduct to said ground contact having end portions overlying contacts communicating with said tip and ring contacts; a pair of fusable solder preforms each having an angularly positioned camming surface thereon positioned beneath each end portion of said shorting spring and within a through opening wherein said camming surface contacts an edge of a respective opening and is urged against a surface of a protector circuit for the transmission of heat thereto; whereby upon the occurrence of an overload current within said protector circuits, heat generated by said protective circuit causes said solder preforms to fuse and allow said shorting spring to contact said contacts communicating with said tip and ring contacts to ground the protected subscriber circuit.