Patent US4855807A successfully refreshed from Google Patents.
US4855807A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device
Assignee: Toshiba Corp
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Filing: 1987-12-18
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Granted: 1989-08-08
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Expires: 2007-12-18
Abstract
Abstract This invention provides a semiconductor device comprising a die-pad supported by tie-bars, a semiconductor element mounted on the die-pad with the die-pad, tie-bars and semiconductor element being encapsulated in a moulding compound, means for defining an aperture which extends in to the moulding compound so as to expose a portion of a tie-bar.
Inventors
- 👤 Yasuhiro Yamaji
- 👤 Kenji Takahashi
- 👤 Seiichi Hirata
- 👤 Toshiharu Sakurai
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 15:36
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W70/00; H10W70/40; H10W70/421; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
66 words
A semiconductor device comprising: a die-pad supported by a plurality of tie-bars; a semiconductor element mounted on the die-pad with the die-pad, tie-bars and semiconductor element being encapsulated in moulding compound; and means for defining at least one aperture which each extends from a surface of said moulding compound into said moulding compound so as to expose a portion of a respective one of said tie-bars.
Claim 2
Dependent Claim
66 words
A semiconductor device comprising: a die-pad supported by a plurality of tie-bars; a semiconductor element mounted on the die-pad with the die-pad, tie-bars and semiconductor element being encapsulated in moulding compound; and means for defining at least one aperture which each extends from a surface of said moulding compound into said moulding compound so as to expose a portion of a respective one of said tie-bars.
Claim 3
Dependent Claim
17 words
A semiconductor device as claimed in claim 1, wherein the defining means is formed as a hole.
Claim 4
Dependent Claim
31 words
A semiconductor device as claimed in claim 1, wherein the defining means is in the form of a cut-away open to the underside and one lateral edge of the moulding compound.
Claim 5
Dependent Claim
33 words
A semiconductor device as claimed in claim 1, wherein said exposed portion of said tie-bar is part of a shaped area of the tie-bar which is larger than the cross-section of the aperture.
Claim 6
Dependent Claim
28 words
A semiconductor device as claimed in claim 1, wherein at least two apertures extend into the moulding compound so as to expose a portion of two respective tie-bars.
Claim 7
Dependent Claim
41 words
A semiconductor device as claimed in claim 1, wherein at least two apertures extend in both the underside and the upperside of the moulding compound, with the apertures extending into the moulding compound so as to expose respective portions of tie-bars.
Claim 8
Dependent Claim
34 words
A semiconductor device as claimed in claim 1, wherein the portion of the tie-bar adjacent the exposed portion of the tie-bar is smaller in surface area than is the exposed portion of the tie-bar.
References Cited (Backward Citations)
US4250347A
Cited
JPS5577160A
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JPS5879739A
Cited
JPS59208764A
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JPS6129157A
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JPS61184855A
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JPS61191055A
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JPS61208847A
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JPS6242548A
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JPS61166052A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-08-07 | 1993-02-06 | 1993-08-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-08-07 | 1997-02-06 | 1997-08-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-08-07 | 2001-02-06 | 2001-08-08 | $7700.00 | Window Closed / Lapsed |