US4855256A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing masked semiconductor laser
Assignee: Ricoh Co Ltd
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Filing: 1988-02-12
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Granted: 1989-08-08
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Expires: 2008-02-12
Abstract
Abstract A masking layer is formed on the light-emitting mirror surface of a semiconductor laser body. The masking layer is capable of blocking light emitted from the semiconductor laser body and of being thermally melted and evaporated by exposure to the emitted light. When the masking layer is formed on the light-emitting mirror surface of the semiconductor laser body, a small light-emitting hole is defined in the masking layer by the heat of the emitted light which is effective to prevent the material of the masking layer from being evaporated on a portion of the light-emitting surface.
Inventors
- 👤 Hiroshi Kobayashi
- 👤 Haruhiko Machida
- 👤 Makoko Harigaya
- 👤 Yasushi Ide
- 👤 Jun Akedo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 01:23
CPC Classifications
H; H01; H01S; H01S5/00; H01S5/02; H01S5/028; H01S5/10; H01S5/1082; H01S2301/00; H01S2301/18; H01S5/0286; Y; Y10; Y10S; Y10S148/00; Y10S148/071; Y10S148/094; Y10S148/106; Y10S148/169
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
90 words
A method of manufacturing a masked semiconductor laser, comprising the steps of: forming a masking layer capable of cutting off light emitted from a semiconductor laser body on a light-emitting surface of the semiconductor laser body by means of a vacuum evaporation process; and simultaneously, while energizing the semiconductor laser body, defining a light-emitting hole in the depositing masking layer by the action of a beam of laser light emitted from the semiconductor, which beam prevents evaporation of masking material onto the body of the laser at the light-emitting hole.
Claim 2
Independent Claim
90 words
A method of manufacturing a masked semiconductor laser, comprising the steps of: forming a masking layer capable of cutting off light emitted from a semiconductor laser body on a light-emitting surface of the semiconductor laser body by means of a vacuum evaporation process; and simultaneously, while energizing the semiconductor laser body, defining a light-emitting hole in the depositing masking layer by the action of a beam of laser light emitted from the semiconductor, which beam prevents evaporation of masking material onto the body of the laser at the light-emitting hole.
Claim 3
Dependent Claim
44 words
The method of claim 1, wherein said masking layer is capable of cutting off or reflecting almost all of the light emitted from said semiconductor laser body but which is thermally melted and evaporated where laser light is emitted from the semiconductor laser body.
Claim 4
Dependent Claim
30 words
The method of claim 2, wherein said masking layer is formed from a material selected from the group consisting of metals, their compounds, amphoteric metals, their compounds and organic materials.
Claim 5
Dependent Claim
25 words
The method of claim 3, wherein said masking material is a metal selected from the group consisting of Au, Ag, Cr, In, Al and Zn.
Claim 6
Dependent Claim
23 words
The method of claim 3, wherein said masking material is an amphoteric metal selected from the group consisting of Se, Te and Sn.
Claim 7
Dependent Claim
22 words
The method of claim 3, wherein said masking material is a non-metal selected from the group consisting of carbon, Ge and sulfur.
Claim 8
Dependent Claim
23 words
The method of claim 3, wherein said organic masking material is a member selected from the group consisting of phthalocyanine and cyanine dyes.
Claim 9
Dependent Claim
34 words
The method of claim 1, wherein an electrically insulative layer of low refractive index and which is optically transparent is deposited between said masking layer and the light-emitting surface of said semiconductor laser body.
Claim 10
Dependent Claim
35 words
The method of claim 8, wherein the electrically insulating material of said insulative layer is SiO, SiO 2 , Al 2 S 3 , Si 3 N 4 , MgF 2 or TiO 2 .
References Cited (Backward Citations)
US3849738A
Cited
US3866238A
Cited
US4001719A
Cited
US4178564A
Cited
US4100508A
Cited
US4337443A
Cited
US4317086A
Cited
JPS5889890A
Cited
EP0090135A1
Cited
US4656638A
Cited
JPS59211292A
Cited
JPS609189A
Cited
US4653059A
Cited
JPS60214578A
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JPS61140190A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-08-07 | 1993-02-06 | 1993-08-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-08-07 | 1997-02-06 | 1997-08-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-08-07 | 2001-02-06 | 2001-08-08 | $7700.00 | Window Closed / Lapsed |