US4853761A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device
Assignee: MITSUBISHIKI DENKI 2-3 MARUNOUCHI 2-CHOME CHIYODA-KU TOKYO JAPAN KK
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Filing: 1987-03-13
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Granted: 1989-08-01
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Expires: 2007-03-13
Abstract
Abstract A semiconductor device obtained by using plastic molding to obtain an ultraviolet ray erasable type EPROM semiconductor chip in which an ultraviolet ray transparent resin film is inserted between the semiconductor chip and the molding material so as to cover a portion of the surface or the whole surface of the semiconductor chip except for the surfaces of the wire bonding electrodes.
Inventors
- 👤 Shingo Ikeda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 10:07
CPC Classifications
H; H10; H10W; H10W74/00; G; G11; G11C; G11C16/00; G11C16/02; G11C16/06; G11C16/10; G11C16/18; H10W72/00; H10W72/50; H10W72/531; H10W72/536
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
133 words
A plastic molded ultraviolet ray erasable type EPROM semiconductor device which comprises: a semiconductor chip having an element region; wire bonding electrodes operatively connected to said semiconductor chip; a surface protection film formed on said semiconductor chip; an ultraviolet ray transparent resin film comprising polyimide formed on said surface protection film so as to cover at least said element region and the surface of said semiconductor chip except for said wire bonding electrodes; and molding material formed on said resin film, said wire bonding electrodes, and said surface protection film so as to cover said semiconductor chip, wherein said EPROM semiconductor device is one time programmable so as to have one time only erasing and writing functions, and wherein said resin film reduces stresses arising between said semiconductor chip and said molding material.
Claim 2
Dependent Claim
133 words
A plastic molded ultraviolet ray erasable type EPROM semiconductor device which comprises: a semiconductor chip having an element region; wire bonding electrodes operatively connected to said semiconductor chip; a surface protection film formed on said semiconductor chip; an ultraviolet ray transparent resin film comprising polyimide formed on said surface protection film so as to cover at least said element region and the surface of said semiconductor chip except for said wire bonding electrodes; and molding material formed on said resin film, said wire bonding electrodes, and said surface protection film so as to cover said semiconductor chip, wherein said EPROM semiconductor device is one time programmable so as to have one time only erasing and writing functions, and wherein said resin film reduces stresses arising between said semiconductor chip and said molding material.
Claim 3
Dependent Claim
22 words
A semiconductor device as defined in claim 1, further comprising a differential amplifier disposed on said element region of said semiconductor chip.
Claim 4
Dependent Claim
26 words
A semiconductor device as defined in claim 2, wherein said semiconductor chip includes electrode windows formed therein so as to provide for said wire bonding electrodes.
References Cited (Backward Citations)
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JPS5763831A
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JPS58126645A
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JPS6083337A
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JPS6083338A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-07-31 | 1993-01-30 | 1993-08-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-07-31 | 1997-01-30 | 1997-08-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-07-31 | 2001-01-30 | 2001-08-01 | $7700.00 | Window Closed / Lapsed |