Patent US4851956A successfully refreshed from Google Patents.
US4851956A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Packaged solid-state surge protector
Assignee: CCS Holdings Inc
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Filing: 1987-09-25
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Granted: 1989-07-25
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Expires: 2007-09-25
Abstract
Abstract A solid-state surge protection device comprises two electrodes between which is sandwiched a semiconductor chip. A resilient, annular, sealing member comprised of a thermoplastic resin extends around the periphery of the device and is adhered to both electrodes. The resin is a flexible, dielectric material which is not disrupted by heat generated under surge conditons in the device, and which is environmentally inert. The electrodes can be soldered to opposite surfaces of the chip.
Inventors
- 👤 Gerzy Borkowicz
- 👤 William P. Trumble
- 👤 James E. Anderson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 19:00
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/138; H02; H02H; H02H9/00; H02H9/04; H02H9/044; H10W42/00; H10W42/80; H10W72/00
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
135 words
An electronic system comprising at least one circuit that includes surge-protecting means for protecting said circuit against a current surge up to 10 4 amps or more, said surge-protecting means comprising a first electrode and a second electrode; a heat and electrical-conductive layer applied to a surface of said first and second electrodes, respectively; a semiconductor chip that contacts a conductive layer applied to said first and second electrodes, respectively; and a resilient, annular sealing member extending around the periphery of and adhered to both electrodes, said sealing member (a) defining with said electrodes a cavity wherein said chip is provided and (b) comprising a thermoplastic resin that is a flexible, dielectric material, wherein said electrodes are capable of moving together into direct contact to sustain a short-circuit in the event of total chip destruction.
Claim 2
Dependent Claim
135 words
An electronic system comprising at least one circuit that includes surge-protecting means for protecting said circuit against a current surge up to 10 4 amps or more, said surge-protecting means comprising a first electrode and a second electrode; a heat and electrical-conductive layer applied to a surface of said first and second electrodes, respectively; a semiconductor chip that contacts a conductive layer applied to said first and second electrodes, respectively; and a resilient, annular sealing member extending around the periphery of and adhered to both electrodes, said sealing member (a) defining with said electrodes a cavity wherein said chip is provided and (b) comprising a thermoplastic resin that is a flexible, dielectric material, wherein said electrodes are capable of moving together into direct contact to sustain a short-circuit in the event of total chip destruction.
Claim 3
Dependent Claim
17 words
An electronic system as claimed in claim 1, wherein said thermoplastic resin comprises an olefin acrylic copolymer.
Claim 4
Dependent Claim
44 words
An electronic system as claimed in claim 2, wherein said copolymer comprises a monomer from the group consisting of an ethylene acrylic acid, an ethylene methacrylic acid, a propylene acrylic acid and a propylene methacrylic acid copolymer, or a metal salt or ester thereof.
Claim 5
Dependent Claim
25 words
An electronic system as claimed in claim 3, wherein said copolymer is an ethylene acrylic acid copolymer containing from about 6% to 30% acrylic acid.
Claim 6
Dependent Claim
19 words
An electronic system as claimed in claim 4, wherein said ethylene acrylic acid copolymer contains about 20% acrylic acid.
Claim 7
Dependent Claim
31 words
An electronic system as claimed in claim 1, wherein said first and second electrodes are comprised of copper, each of said electrode having a thickness of at least about 20 mil.
Claim 8
Dependent Claim
18 words
An electronic system as claimed in claim 6, wherein said conductive layer is comprised of a metal foil.
Claim 9
Dependent Claim
26 words
An electronic system as claimed in claim 1, wherein said conductive layer is a solder layer which joins an electrode to a surface of said chip.
Claim 10
Dependent Claim
22 words
An electronic system as claimed in claim 8, wherein said solder layer has a thickness of between about 0.3 and 3 mil.
Claim 11
Dependent Claim
25 words
An electronic system as claimed in claim 9, wherein said first electrode has a total area that is larger than that of said second electrode.
Claim 12
Dependent Claim
28 words
An electronic system as claimed in claim 10, wherein said second electrode is disc-shaped and has a diameter approximately equal to the maximum transverse dimension of said chip.
Claim 13
Dependent Claim
28 words
An electronic system as claimed in claim 11, wherein said annular sealing member is adhered to a surface on said first electrode that faces towards said second electrode.
Claim 14
Dependent Claim
28 words
An electronic system as claimed in claim 12, wherein each of said first and second electrodes is a copper disc having a thickness of at least 9 mil.
Claim 15
Dependent Claim
111 words
A semiconductor surge protection device comprising a first electrode and a second electrode; a heat- and electrical-conductive layer applied to a surface of said first and second electrodes, respectively; a semiconductor chip that contacts a conductive layer applied to said first and second electrodes, respectively; and a resilient, annular sealing member extending around the periphery of and adhered to both electrodes, said sealing member (a) defining with said electrodes a cavity wherein said chip is provided and (b) comprising a thermoplastic resin that is a flexible, dielectric material, wherein said electrodes are capable of moving together into direct contact to sustain a short circuit in the event of total chip destruction.
Claim 16
Dependent Claim
111 words
A semiconductor surge protection device comprising a first electrode and a second electrode; a heat- and electrical-conductive layer applied to a surface of said first and second electrodes, respectively; a semiconductor chip that contacts a conductive layer applied to said first and second electrodes, respectively; and a resilient, annular sealing member extending around the periphery of and adhered to both electrodes, said sealing member (a) defining with said electrodes a cavity wherein said chip is provided and (b) comprising a thermoplastic resin that is a flexible, dielectric material, wherein said electrodes are capable of moving together into direct contact to sustain a short circuit in the event of total chip destruction.
Claim 17
Dependent Claim
16 words
A device as claimed in claim 14, wherein said thermoplastic resin comprises an olefin acrylic copolymer.
Claim 18
Dependent Claim
42 words
A device as claimed in claim 15, wherein said copolymer comprises a monomer from the group consisting of an ethylene-acrylic acid, an ethylene methacrylic acid, a propylene acrylic acid and a propylene methacrylic acid copolymer, or a metal salt or ester thereof.
Claim 19
Dependent Claim
23 words
A device as claimed in claim 16, wherein said copolymer is an ethylene-acrylic acid copolymer containing from about 6% to 30% acrylic acid.
Claim 20
Dependent Claim
17 words
A device as claimed in claim 17, wherein said ethylene-acrylic acid copolymer contains about 20% acrylic acid.
Claim 21
Dependent Claim
30 words
A device as claimed in claim 14, wherein said first and second electrodes are comprised of copper, each of said electrode having a thickness of at least about 20 mil.
Claim 22
Dependent Claim
17 words
A device as claimed in claim 19, wherein said conductive layer is comprised of a metal foil.
Claim 23
Dependent Claim
25 words
A device as claimed in claim 14, wherein said conductive layer is a solder layer which joins an electrode to a surface of said chip.
Claim 24
Dependent Claim
21 words
A device as claimed in claim 21, wherein said solder layer has a thickness of between about 0.3 and 3 mil.
Claim 25
Dependent Claim
24 words
A device as claimed in claim 22, wherein said first electrode has a total area that is larger than that of said second electrode.
Claim 26
Dependent Claim
27 words
A device as claimed in claim 23, wherein said second electrode is disc-shaped and has a diameter approximately equal to the maximum transverse dimension of said chip.
Claim 27
Dependent Claim
27 words
A device as claimed in claim 24, wherein said annular sealing member is adhered to a surface on said first electrode that faces towards said second electrode.
Claim 28
Dependent Claim
27 words
A device as claimed in claim 25, wherein each of said first and second electrodes is a copper disc having a thickness of at least 9 mil.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-07-24 | 1993-01-23 | 1993-07-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-07-24 | 1997-01-23 | 1997-07-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-07-24 | 2001-01-23 | 2001-07-25 | $7700.00 | Window Closed / Lapsed |