US4849689A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Microwave wafer probe having replaceable probe tip
Assignee: FormFactor Beaverton Inc
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Filing: 1988-11-04
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Granted: 1989-07-18
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Expires: 2008-11-04
Abstract
Abstract A microwave wafer probe having a replaceable planar transmission line probe tip which detachably connects to a planar transmission line circuit board within the probe head. The circuit board may include passive and/or active electrical circuit components interconnecting its conductors which, due to the detachable interconnection with the probe tip, do not have to be replaced if the probe tip should be damaged. The detachable interconnection between the probe tip and the circuit board is tolerant to misalignment of the two elements because the interconnected end portions of the respective conductors are shaped so as to maintain the impedance between the two elements substantially constant despite misalignment. Preferably, both the circuit board and the detachable tip include coplanar transmission lines interconnected by compressing the overlapping end portions of their conductors together.
Inventors
- 👤 K. Reed Gleason
- 👤 Keith E. Jones
- 👤 Eric W. Strid
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 10:52
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/06772
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
128 words
A microwave wafer probe comprising: (a) a connector assembly for connecting said probe to an external first transmission line; (b) a planar probe tip comprising multiple planar conductors mounted on a dielectric substrate forming a second transmission line for detachably contacting a device under test; (c) a planar circuit board, interconnected operatively between said connector assembly and said probe tip, comprising multiple planar conductors mounted on a dielectric substrate forming a third transmission line for conducting signals between said connector assembly and said probe tip; (d) at least one electrical circuit component mounted on said circuit board in addition to said third transmission line; and (e) selectively releasable means detachably connecting said probe tip to said circuit board and detachably interconnecting said second and third transmission lines operatively.
Claim 2
Dependent Claim
128 words
A microwave wafer probe comprising: (a) a connector assembly for connecting said probe to an external first transmission line; (b) a planar probe tip comprising multiple planar conductors mounted on a dielectric substrate forming a second transmission line for detachably contacting a device under test; (c) a planar circuit board, interconnected operatively between said connector assembly and said probe tip, comprising multiple planar conductors mounted on a dielectric substrate forming a third transmission line for conducting signals between said connector assembly and said probe tip; (d) at least one electrical circuit component mounted on said circuit board in addition to said third transmission line; and (e) selectively releasable means detachably connecting said probe tip to said circuit board and detachably interconnecting said second and third transmission lines operatively.
Claim 3
Dependent Claim
25 words
The probe of claim 1 wherein said electrical circuit component includes at least one passive electrical circuit component in addition to said third transmission line.
Claim 4
Dependent Claim
18 words
The probe of claim 1 wherein said electrical circuit component includes at least one active electrical circuit component.
Claim 5
Dependent Claim
30 words
The probe of claim 1 wherein the dielectric substrate of said probe tip has a rigidity which is different from the rigidity of the dielectric substrate of said circuit board.
Claim 6
Dependent Claim
36 words
The probe of claim 1, further including resilient means for contacting said planar probe tip and forcing the plane of said tip to conform yieldably to said device under test when said tip contacts said device.
Claim 7
Dependent Claim
63 words
The probe of claim 1 wherein the multiple conductors of said probe tip and the multiple conductors of said circuit board, respectively, include interconnecting ends having dissimilar shapes for maintaining the impedance of the interface between said probe tip and said circuit board substantially constant despite changes in the positions of said probe tip and said circuit board with respect to each other.
Claim 8
Dependent Claim
25 words
The probe of claim 1 wherein the multiple conductors of said probe tip are coplanar and the multiple conductors of said circuit board are coplanar.
Claim 9
Dependent Claim
57 words
The probe of claim 7 wherein said selectively releasable means includes means for holding respective portions of the multiple conductors of said probe tip and respective portions of the multiple conductors of said circuit board in overlapping contacting relation to each other by releasably compressing them together in a direction normal to the planes of said conductors.
Claim 10
Dependent Claim
54 words
The probe of claim 8 wherein said respective portions of said multiple conductors include interconnecting ends having dissimilar shapes for maintaining the impedance of the interface between said probe tip and said circuit board substantially constant despite changes in the positions of said probe tip and said circuit board with respect to each other.
Claim 11
Dependent Claim
132 words
A microwave wafer probe comprising: (a) a connector assembly for connecting said probe to an external first transmission line; (b) a planar probe tip comprising multiple planar conductors mounted on a dielectric substrate forming a second transmission line for detachably contacting a device under test; (c) a planar circuit board, interconnected operatively between said connector assembly and said probe tip, comprising multiple planar conductors mounted on a dielectric substrate forming a third transmission line for conducting signals between said connector assembly and said probe tip; (d) said probe tip and said circuit board having respective controlled impedance coplanar transmission lines constituting said second and third transmission lines, respectively; and (e) selectively releasable means detachably connecting said probe tip to said circuit board and detachably interconnecting said second and third transmission lines operatively.
Claim 12
Dependent Claim
132 words
A microwave wafer probe comprising: (a) a connector assembly for connecting said probe to an external first transmission line; (b) a planar probe tip comprising multiple planar conductors mounted on a dielectric substrate forming a second transmission line for detachably contacting a device under test; (c) a planar circuit board, interconnected operatively between said connector assembly and said probe tip, comprising multiple planar conductors mounted on a dielectric substrate forming a third transmission line for conducting signals between said connector assembly and said probe tip; (d) said probe tip and said circuit board having respective controlled impedance coplanar transmission lines constituting said second and third transmission lines, respectively; and (e) selectively releasable means detachably connecting said probe tip to said circuit board and detachably interconnecting said second and third transmission lines operatively.
Claim 13
Dependent Claim
63 words
The probe of claim 10 wherein the multiple conductors of said probe tip and the multiple conductors of said circuit board, respectively, include interconnecting ends having dissimilar shapes for maintaining the impedance of the interface between said probe tip and said circuit board substantially constant despite changes in the positions of said probe tip and said circuit board with respect to each other.
Claim 14
Dependent Claim
57 words
The probe of claim 10 wherein said selectively releasable means includes means for holding respective portions of the multiple conductors of said probe tip and respective portions of the multiple conductors of said circuit board in overlapping contacting relation to each other by releasably compressing them together in a direction normal to the planes of said conductors.
References Cited (Backward Citations)
US4697143A
Cited
US4764723A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-07-17 | 1993-01-16 | 1993-07-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-07-17 | 1997-01-16 | 1997-07-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-07-17 | 2001-01-16 | 2001-07-18 | $7700.00 | Window Closed / Lapsed |