Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines

Abstract

Abstract PCT No. PCT/JP86/00335 Sec. 371 Date Jun. 3, 1987 Sec. 102(e) Date Jun. 3, 1987 PCT Filed Jun. 30, 1986 PCT Pub. No. WO87/01378 PCT Pub. Date Mar. 12, 1987.Polyimide having repeating units of the following formula (I) and its polyamic acid precursor having repeating units of the following formula (II) are disclosed; <IMAGE> (I) <IMAGE> (II) (where Y is a radial selected from the group consisting of a bond, divalent hydrocarbon having 1 to 10 carbons, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxide, and R is a tetra-valent radical selected from the group consisting of aliphatic radical having 2 and more carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and noncondensed polyaromatic radical wherein aromatic radicals ae mutually connected with a bond or a crosslinking function). Typical examples of polyimide and polyamic acid include where Y is thio radical and R is <IMAGE> Y is a bond and R is III or IV, andy is isopropylidene radical and R is IV. The polymers can be prepared from corresponding diamine and tetracarboxylic acid dianhydride. Polyimide or polyamic acid of this invention is excellent for high-temperature adhesive.

Inventors

• 👤 Masahiro Ohta
• 👤 Saburo Kawashima
• 👤 Yoshiho Sonobe
• 👤 Shoji Tamai
• 👤 Hideaki Oikawa
• 👤 Kouji Ohkoshi
• 👤 Akihiro Yamaguchi

Bibliographic Details