Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
97 words
An optical transmission package comprising a housing having an entrance for an optical fibre, a sub-mount within the housing, an optical fibre extending through the entrance and onto the sub-mount, and a semiconductor optical transmission device in direct light-transfer-connection with the end of the fibre, the sub-mount comprising a plurality of thick films formed one on top of the other by deposition and firing of thick film inks, one of said films of the sub-mount being formed as an electrical resistance heating element, the fibre being secured to the uppermost film of the sub-mount by an adhesive.
Claim 2
Dependent Claim
97 words
An optical transmission package comprising a housing having an entrance for an optical fibre, a sub-mount within the housing, an optical fibre extending through the entrance and onto the sub-mount, and a semiconductor optical transmission device in direct light-transfer-connection with the end of the fibre, the sub-mount comprising a plurality of thick films formed one on top of the other by deposition and firing of thick film inks, one of said films of the sub-mount being formed as an electrical resistance heating element, the fibre being secured to the uppermost film of the sub-mount by an adhesive.
Claim 3
Dependent Claim
14 words
A package as claimed in claim 1, wherein the adhesive comprises a low-melting-point solder.
Claim 4
Dependent Claim
31 words
A package as claimed in claim 1 wherein the optical fibre traverses a gap between the entrance and a nearer edge of the sub-mount, and remains physically unsupported over that gap.
Claim 5
Dependent Claim
51 words
A package as claimed in claim 1 wherein the sub-mount is formed on a rigid insulating base, and at least one thermistor element is formed on the base by a thick film screening process said element being arranged to sense the temperature of the substrate and for providing temperature compensation thereto.
Claim 6
Dependent Claim
76 words
A mounting arrangement comprising a substrate, a sub-mount formed of a multi-layer thick film construction on said substrate, one of said layers within said construction being a resistive layer which can be used as a heating element, and connection terminals an said substrate connected with said element whereby an electric current can be passed through the element to heat the mounting arrangement, each layer of said multi-layer construction comprising a deposited and fired thick film ink.
Claim 7
Dependent Claim
76 words
A mounting arrangement comprising a substrate, a sub-mount formed of a multi-layer thick film construction on said substrate, one of said layers within said construction being a resistive layer which can be used as a heating element, and connection terminals an said substrate connected with said element whereby an electric current can be passed through the element to heat the mounting arrangement, each layer of said multi-layer construction comprising a deposited and fired thick film ink.