US4844325A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for die-bonding semiconductor chip bonding
Assignee: Sumitomo Electric Industries Ltd
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Filing: 1988-03-16
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Granted: 1989-07-04
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Expires: 2008-03-16
Abstract
Abstract A process of die-bonding a semiconductor chip. The semiconductor chip is sucked by a collet and fixed on a preform which is formed on a die pad. A load is applied to the chip and a gas is blown around the semiconductor chip. so as to flatten any of the preform that has gone beyond the interface between the chip and die pad. The entire assembly is heated thereby curing the preform. In a preferred embodiment the semiconductor chip is sucked with the collet via a vacuum pump and an inert gas is blown around the semiconductor chip.
Inventors
- 👤 Masanori Nishiguchi
- 👤 Takeshi Sekiguchi
- 👤 Mitsuaki Fujihira
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 17:06
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0446; H10W; H10W72/00; H10W72/071; H10W72/0711; H10W72/07178; H10W72/073; H10W72/07341
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
140 words
An apparatus for die-bonding a semiconductor chip comprising: a collet comprising a semiconductor chip grip section having a cavity so shaped as to enable the gripping of a semiconductor chip and having an aspiration hole therein communicating with a space defined by the cavity and the semiconductor chip; exhaust means that communicate with the aspiration hole vacuum-sucking the semiconductor chip into the cavity in the collet; and gas supply means communicating with the aspiration hole in the collet for blowing a gas from the space to an area around the semiconductor chip, the blowing of gas, causing any raised part of the preform bonding resin that goes beyond the interface between the chip and the die pad to be flattened without solidifying in a ball form or climbing the lateral sides of the chip thereby preventing soiling of the chip.
Claim 2
Independent Claim
140 words
An apparatus for die-bonding a semiconductor chip comprising: a collet comprising a semiconductor chip grip section having a cavity so shaped as to enable the gripping of a semiconductor chip and having an aspiration hole therein communicating with a space defined by the cavity and the semiconductor chip; exhaust means that communicate with the aspiration hole vacuum-sucking the semiconductor chip into the cavity in the collet; and gas supply means communicating with the aspiration hole in the collet for blowing a gas from the space to an area around the semiconductor chip, the blowing of gas, causing any raised part of the preform bonding resin that goes beyond the interface between the chip and the die pad to be flattened without solidifying in a ball form or climbing the lateral sides of the chip thereby preventing soiling of the chip.
Claim 3
Dependent Claim
20 words
A die-bonding apparatus according to claim 1 wherein said gas supply means supplies an inert gas or a forming gas.
Claim 4
Dependent Claim
28 words
A die-bonding apparatus according to claim 1 or 2 wherein said collet is a hollow member having a rectangular cross section with grooves cut in its inner surface.
Claim 5
Independent Claim
99 words
A method of die-bonding a semiconductor chip comprising the steps of: coating an Ag containing epoxy resin as a preform on a die pad; gripping a semiconductor chip in a collet; fixing the semiconductor chip on the preform; applying a load to the chip; supplying a gas flow to an area around the semiconductor chip to flatten any raised parts of the preform that goes beyond the interface between the chip and the die pad so it will not solidify in a ball form or climbing the lateral sides of the chip thereby preventing soiling; and curing the preform.
Claim 6
Independent Claim
99 words
A method of die-bonding a semiconductor chip comprising the steps of: coating an Ag containing epoxy resin as a preform on a die pad; gripping a semiconductor chip in a collet; fixing the semiconductor chip on the preform; applying a load to the chip; supplying a gas flow to an area around the semiconductor chip to flatten any raised parts of the preform that goes beyond the interface between the chip and the die pad so it will not solidify in a ball form or climbing the lateral sides of the chip thereby preventing soiling; and curing the preform.
Claim 7
Dependent Claim
25 words
A method as in claim 4 wherein said gripping step comprises the step of vacuum sucking the semiconductor chip into a cavity in the collet.
Claim 8
Dependent Claim
17 words
A method as in claim 5 wherein said curing step comprises the step of heating the preform.
Claim 9
Independent Claim
96 words
A method for preventing the soiling of semiconductor chips during the die bonding process comprising the steps of: placing the semiconductor chip onto a preform to mount it to a die pad; applying pressure so as to adhere the chip to the die pad; and blowing gas onto an area around the semiconductor chip in order to flatten any raised parts of the preform that goes between the chip and the die pad so as to prevent the formation of any preform balls and to prevent the preform from climbing the lateral sides of the chip.
Claim 10
Independent Claim
96 words
A method for preventing the soiling of semiconductor chips during the die bonding process comprising the steps of: placing the semiconductor chip onto a preform to mount it to a die pad; applying pressure so as to adhere the chip to the die pad; and blowing gas onto an area around the semiconductor chip in order to flatten any raised parts of the preform that goes between the chip and the die pad so as to prevent the formation of any preform balls and to prevent the preform from climbing the lateral sides of the chip.
References Cited (Backward Citations)
US3705457A
Cited
US4274576A
Cited
US4295596A
Cited
US4564135A
Cited
US4634043A
Cited
US4752025A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-07-03 | 1993-01-02 | 1993-07-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-07-03 | 1997-01-02 | 1997-07-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-07-03 | 2001-01-02 | 2001-07-04 | $7700.00 | Window Closed / Lapsed |