US4843031A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of fabricating compound semiconductor laser using selective irradiation
Assignee: Panasonic Holdings Corp
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Filing: 1988-03-15
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Granted: 1989-06-27
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Expires: 2008-03-15
Abstract
Abstract Disclosed is a method of fabricating a compound semiconductor device which is capable of forming a multi-wavelength semiconductor laser structure, double cavity type semiconductor laser structure, stripe type semiconductor laser structure transverse junction stripe type semiconductor laser structure, or semiconductor grating by a single step of epitaxial growth while illuminating a desired part of substrate surface selectively with light at the time of epitaxial growth.
Inventors
- 👤 Yuzaburo Ban
- 👤 Hiraaki Tsujii
- 👤 Youichi Sasai
- 👤 Mototsugu Ogura
- 👤 Hiroyuki Serizawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 07:25
CPC Classifications
H; H01; H01S; H01S5/00; H01S5/40; H01S5/4025; H01S5/4031; H01S5/20; H10; H10H; H10H20/00; H10H20/01; H10H20/011; H10H20/013; H01S5/2054; H01S5/2059; H01S5/4087; Y; Y10; Y10S; Y10S148/00; Y10S148/029; Y10S148/048; Y10S148/071; Y10S148/094; Y10S438/00; Y10S438/914; Y10S438/925; Y10S438/956
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
121 words
A method of fabricating a compound semiconductor device comprising: a step of epitaxially growing a first clad layer on a semiconductor substrate, an active layer on said first clad layer, a second clad layer on said active layer and a contact layer on said second clad layer while partially illuminating said semiconductor substrate with light; a step of electrically insulating between the illuminated part and non-illuminated part of said first clad layer, active layer, second clad layer and contact layer; and a step of forming first and second electrode layers in the illuminated part and non-illuminated part of said contact layer, and a third electrode layer on the side of said semiconductor substrate where said first clad layer is not formed.
Claim 2
Independent Claim
121 words
A method of fabricating a compound semiconductor device comprising: a step of epitaxially growing a first clad layer on a semiconductor substrate, an active layer on said first clad layer, a second clad layer on said active layer and a contact layer on said second clad layer while partially illuminating said semiconductor substrate with light; a step of electrically insulating between the illuminated part and non-illuminated part of said first clad layer, active layer, second clad layer and contact layer; and a step of forming first and second electrode layers in the illuminated part and non-illuminated part of said contact layer, and a third electrode layer on the side of said semiconductor substrate where said first clad layer is not formed.
Claim 3
Dependent Claim
40 words
A method of claim 1, wherein said semiconductor substrate and first clad layer are of a first conductive type, and second clad layer and contact layer is of a second conductive type which is different from said first conductive type.
Claim 4
Dependent Claim
38 words
A method of claim 1, wherein electric insualtion is achieved by etching and removing the contact layer, the first and second clad layer and active layer located in the boundary area of the illuminated part and non-illuminated part.
Claim 5
Dependent Claim
11 words
A method of claim 1, wherein said light is laser light.
Claim 6
Independent Claim
88 words
A method of fabricating a semiconductor laser comprising: a step of forming a first clad layer on a semiconductor substrate; a step of epitaxially growing an active layer on said first clad layer while illuminating part of the first clad layer with light; a step of epitaxially growing a second clad layer on said active layer; and a step of forming a first electrode on said second clad layer and a second electrode on the side of the semiconductor substrate where said first clad layer is not formed.
Claim 7
Independent Claim
88 words
A method of fabricating a semiconductor laser comprising: a step of forming a first clad layer on a semiconductor substrate; a step of epitaxially growing an active layer on said first clad layer while illuminating part of the first clad layer with light; a step of epitaxially growing a second clad layer on said active layer; and a step of forming a first electrode on said second clad layer and a second electrode on the side of the semiconductor substrate where said first clad layer is not formed.
Claim 8
Dependent Claim
26 words
A method of claim 5, wherein the band gap energy of the illuminated part of the active layer is greater than that of the non-illuminated part.
Claim 9
Independent Claim
100 words
A method of fabricating a semiconductor laser comprising: a step of sequentially growing epitaxially a first clad layer on a semiconductor substrate, an active layer on said first clad layer, and a second clad layer on said active layer; a step of growing epitaxially a semiconductor layer while illuminating a desired part with light while supplying n-type and p-type dopant sources simultaneosuly on said second clad layer; and a step of forming a first electrode layer on said semiconductor layer, and a second electrode layer on the side of said semiconductor substrate where said first clad layer is not formed.
Claim 10
Independent Claim
100 words
A method of fabricating a semiconductor laser comprising: a step of sequentially growing epitaxially a first clad layer on a semiconductor substrate, an active layer on said first clad layer, and a second clad layer on said active layer; a step of growing epitaxially a semiconductor layer while illuminating a desired part with light while supplying n-type and p-type dopant sources simultaneosuly on said second clad layer; and a step of forming a first electrode layer on said semiconductor layer, and a second electrode layer on the side of said semiconductor substrate where said first clad layer is not formed.
Claim 11
Dependent Claim
37 words
A method of claim 7, wherein at least one of the n-type and p-type dopant sources supplied simultaneosuly is a material of which photodecomposition rate is greater than the thermal decomposition efficiency at the epitaxial growth temperature.
Claim 12
Independent Claim
76 words
A method of fabricating a semiconductor laser comprising: a step of growing epitaxially a first clad layer, an active layer, a second clad layer and a cap layer sequentially on a semi-insulating semiconductor substrate, while simultaneously supplying n-type and p-type dopant sources and illuminating part of said semiconductor substrate with light; and a step of forming a first electrode layer and a second electrode layer on the illuminated part and non-illuminated part on said cap layer.
Claim 13
Independent Claim
76 words
A method of fabricating a semiconductor laser comprising: a step of growing epitaxially a first clad layer, an active layer, a second clad layer and a cap layer sequentially on a semi-insulating semiconductor substrate, while simultaneously supplying n-type and p-type dopant sources and illuminating part of said semiconductor substrate with light; and a step of forming a first electrode layer and a second electrode layer on the illuminated part and non-illuminated part on said cap layer.
Claim 14
Dependent Claim
37 words
A method of claim 9, wherein at least one of the n-type and p-type dopant sources supplied simultaneously is a material of which photodecomposition rate is greater than the thermal decomposition efficiency at the epitaxial growth temperature.
Claim 15
Independent Claim
25 words
A method of fabricating a semiconductor grating by epitaxially growing a semiconductor layer on a substrate while illuminating the substrate surface with interference laser light.
Claim 16
Independent Claim
25 words
A method of fabricating a semiconductor grating by epitaxially growing a semiconductor layer on a substrate while illuminating the substrate surface with interference laser light.
References Cited (Backward Citations)
US4318059A
Cited
WO1981001529A1
Cited
US4476563A
Cited
JPS5879791A
Cited
EP0086008A2
Cited
US4577207A
Cited
US4627065A
Cited
US4607370A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-06-26 | 1992-12-26 | 1993-06-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-06-26 | 1996-12-26 | 1997-06-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-06-26 | 2000-12-26 | 2001-06-27 | $7700.00 | Window Closed / Lapsed |