Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
129 words
An aluminum enamel board for printed circuits, comprising a base plate and an electrically insulating glass layer on said base plate, said base plate being selected from the group consisting of an Al-Si alloy plate containing at least 5% of Si, and a composite metal plate consisting of a metal plate and an Al or Al alloy layer formed on said metal plate such that said Al or Al alloy layer is interposed between said metal plate and said insulating glass layer, and said metal plate consists essentially of a material selected from the group consisting of an Al-Si alloy containing at least 5% of Si, an Fe-Ni alloy containing at least 36% Ni, W, Mo, Si and combination of Cu and any one of W, Mo and Si.
Claim 2
Dependent Claim
129 words
An aluminum enamel board for printed circuits, comprising a base plate and an electrically insulating glass layer on said base plate, said base plate being selected from the group consisting of an Al-Si alloy plate containing at least 5% of Si, and a composite metal plate consisting of a metal plate and an Al or Al alloy layer formed on said metal plate such that said Al or Al alloy layer is interposed between said metal plate and said insulating glass layer, and said metal plate consists essentially of a material selected from the group consisting of an Al-Si alloy containing at least 5% of Si, an Fe-Ni alloy containing at least 36% Ni, W, Mo, Si and combination of Cu and any one of W, Mo and Si.
Claim 3
Dependent Claim
23 words
The board according to claim 1, wherein the metal plate is said Al-Si alloy plate containing at least 5 wt % of Si.
Claim 4
Dependent Claim
20 words
The board according to claim 1, wherein the aluminum or aluminum alloy layer is clad to said composite metal plate.
Claim 5
Dependent Claim
97 words
The board according to claim 1, wherein the base plate is said composite metal plate consisting of a metal plate and an Al or Al alloy layer formed on said metal plate such that said Al or Al alloy layer is interposed between said metal plate and said insulating glass layer, and said metal plate consists essentially of a material selected from the group consisting of an Al-Si containing at least 5% of Si, an Fe-Ni alloy containing at least 36% Ni, W, Mo, Si and combination of Cu and any one of W, Mo and Si.
Claim 6
Dependent Claim
22 words
The board according to claim 8 wherein said metal plate consists essentially of said Al-Si alloy containing at least 5% of Si.
Claim 7
Dependent Claim
23 words
The board according to claim 4 wherein said metal plate consists essentially of said Fe-Ni alloy and said Fe-Ni alloy contains 36%-42% Ni.
Claim 8
Dependent Claim
14 words
The board according to claim 4 wherein said metal plate consists essentially of W.
Claim 9
Dependent Claim
14 words
The board according to claim 4 wherein said metal plate consists essentially of Mo.
Claim 10
Dependent Claim
14 words
The board according to claim 4 wherein said metal plate consists essentially of Si.
Claim 11
Dependent Claim
19 words
The board according to claim 4 wherein said metal plate consists essentially of said combination of Cu and W.
Claim 12
Dependent Claim
19 words
The board according to claim 4 wherein said metal plate consists essentially of said combination of Cu and Mo.
Claim 13
Dependent Claim
19 words
The board according to claim 4 wherein said metal plate consists essentially of said combination of Cu and Si.
Claim 14
Dependent Claim
133 words
An aluminum enamel board for printed circuits, comprising a base plate and an electrically insulating glass layer which comprises a ceramic material and a metal powder on said base plate, said base plate being selected from the group consisting of an Al-Si alloy plate containing at least 5% of Si, and a composite metal plate consisting of a metal plate and an Al or Al alloy layer formed on said metal plate such that said Al or Al alloy layer is interposed between said metal plate and said insulating glass layer, and said metal plate consists essentially of a material selected from the group consisting of an Al-Si alloy containing at least 5% of Si, an Fe-Ni alloy, W, Mo, Si and combination of Cu and any one of W, Mo and Si.
Claim 15
Dependent Claim
133 words
An aluminum enamel board for printed circuits, comprising a base plate and an electrically insulating glass layer which comprises a ceramic material and a metal powder on said base plate, said base plate being selected from the group consisting of an Al-Si alloy plate containing at least 5% of Si, and a composite metal plate consisting of a metal plate and an Al or Al alloy layer formed on said metal plate such that said Al or Al alloy layer is interposed between said metal plate and said insulating glass layer, and said metal plate consists essentially of a material selected from the group consisting of an Al-Si alloy containing at least 5% of Si, an Fe-Ni alloy, W, Mo, Si and combination of Cu and any one of W, Mo and Si.
Claim 16
Dependent Claim
36 words
The board according to claim 13, wherein the metal powder is a material selected from the group consisting of an aluminum powder, an aluminum alloy powder, a surface-oxidized aluminum powder, and a surface-oxidized aluminum alloy powder.
Claim 17
Dependent Claim
31 words
The board according to claim 13, wherein the electrically insulating glass layer has a composition of 5 to 50 vol % of the metal powder with respect to the ceramic material.
Claim 18
Dependent Claim
130 words
An aluminum enamel board for printed circuits, comprising a base plate and an electrically insulating PbO-B 2 O 3 -SiO 2 glass layer on said base plate, said base plate being selected from the group consisting of an Al-Si alloy plate containing at least 5% of Si, and a composite metal plate consisting of a metal plate and an Al or Al alloy layer formed on said metal plate such that said Al or Al alloy layer is interposed between said metal plate and said insulating glass layer, and said metal plate consists essentially of a material selected from the group consisting of an Al-Si alloy containing at least 5% of Si, and Fe-Ni alloy, W, Mo, Si and combination of Cu and any one of W, Mo and Si.
Claim 19
Dependent Claim
130 words
An aluminum enamel board for printed circuits, comprising a base plate and an electrically insulating PbO-B 2 O 3 -SiO 2 glass layer on said base plate, said base plate being selected from the group consisting of an Al-Si alloy plate containing at least 5% of Si, and a composite metal plate consisting of a metal plate and an Al or Al alloy layer formed on said metal plate such that said Al or Al alloy layer is interposed between said metal plate and said insulating glass layer, and said metal plate consists essentially of a material selected from the group consisting of an Al-Si alloy containing at least 5% of Si, and Fe-Ni alloy, W, Mo, Si and combination of Cu and any one of W, Mo and Si.
Claim 20
Dependent Claim
130 words
An aluminum enamel board for printed circuits, comprising a base plate and an electrically insulating ZnO-B 2 O 3 -SiO 2 glass layer on said base plate, said base plate being selected from the group consisting of an Al-Si alloy plate containing at least 5% of Si, and a composite metal plate consisting of a metal plate and an Al or Al alloy layer formed on said metal plate such that said Al or Al alloy layer is interposed between said metal plate and said insulating glass layer, and said metal plate consists essentially of a material selected from the group consisting of an Al-Si alloy containing at least 5% of Si, and Fe-Ni alloy, W, Mo, Si and combination of Cu and any one of W, Mo and Si.
Claim 21
Dependent Claim
130 words
An aluminum enamel board for printed circuits, comprising a base plate and an electrically insulating ZnO-B 2 O 3 -SiO 2 glass layer on said base plate, said base plate being selected from the group consisting of an Al-Si alloy plate containing at least 5% of Si, and a composite metal plate consisting of a metal plate and an Al or Al alloy layer formed on said metal plate such that said Al or Al alloy layer is interposed between said metal plate and said insulating glass layer, and said metal plate consists essentially of a material selected from the group consisting of an Al-Si alloy containing at least 5% of Si, and Fe-Ni alloy, W, Mo, Si and combination of Cu and any one of W, Mo and Si.