Patent US4837408A successfully refreshed from Google Patents.
US4837408A
Expired / Lapsed
US
⏱️ 0.0 years remaining
High density multilayer wiring board and the manufacturing thereof
Assignee: Niterra Co Ltd
•
Filing: 1988-05-20
•
Granted: 1989-06-06
•
Expires: 2008-05-20
Abstract
Abstract A multilayered wiring board comprising a plurality of green sheets of crystallizable glass which have a conductive pattern printed thereon. The green sheets are laminated together and sintered as a unit. The conductive composition used for the conductive pattern mainly comprises Cu or CuO with lesser amounts of MnO 2 . According to two embodiments the conductive composition additionally contains (1) Pd and/or Pt or (2) Ag 2 O and TiO 2 or TiH 2 . Thereby volume contraction due CuO reduction cancels out volume expansion due to Cu oxidation in the subsequent degreasing.
Inventors
- 👤 Kazuo Kondo
- 👤 Asao Morikawa
- 👤 Hiroshi Iwata
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 17:35
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; C; C03; C03C; C03C17/00; C03C17/006; C03C17/008; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K3/4626; H05K3/4629; C03C2217/00; C03C2217/20; C03C2217/21; C03C2217/23; C03C2217/29; C03C2218/00; C03C2218/10; C03C2218/11; C03C2218/119; H05K1/03; H05K1/0306
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
87 words
A multilayered wiring board comprising a plurality of green sheets containing a crystallizable glass and having printed on surfaces thereof respective patterns of conductive composition, said plurality of printed green sheets being laminated together and then sintered, wherein said conductive composition contains by weight, 100 parts of a base composition containing 50 to 90% CuO and 10 to 50% Cu by weight, 20 to 80 parts of Pd and/or Pt, 10 parts or less of MnO 2 , and 5 parts or less of Ag 2 O.
Claim 2
Dependent Claim
87 words
A multilayered wiring board comprising a plurality of green sheets containing a crystallizable glass and having printed on surfaces thereof respective patterns of conductive composition, said plurality of printed green sheets being laminated together and then sintered, wherein said conductive composition contains by weight, 100 parts of a base composition containing 50 to 90% CuO and 10 to 50% Cu by weight, 20 to 80 parts of Pd and/or Pt, 10 parts or less of MnO 2 , and 5 parts or less of Ag 2 O.
Claim 3
Dependent Claim
49 words
A high density multilayer wiring board as in claim 1, wherein a conductive composition contains by weight, 100 parts in total of CuO and Cu, 20 to 80 parts of Pd and/or Pt, 10 parts or less of MnO 2 , and 5 parts of less Ag 2 O.
Claim 4
Dependent Claim
88 words
A multilayered wiring board comprising a plurality of green sheets containing a crystallizable glass and having printed on surfaces thereof respective patterns of a conductive composition, said plurality of printed green sheets being laminated together and then sintered, wherein said conductive composition contains by weight, 100 parts (according to Cu components thereof) of a base composition of Cu and/or CuO, 16 parts or less of MnO 2 , 10.5 parts or less of Ag 2 O, and 4 parts or less of TiO 2 or TiH 2 .
Claim 5
Dependent Claim
88 words
A multilayered wiring board comprising a plurality of green sheets containing a crystallizable glass and having printed on surfaces thereof respective patterns of a conductive composition, said plurality of printed green sheets being laminated together and then sintered, wherein said conductive composition contains by weight, 100 parts (according to Cu components thereof) of a base composition of Cu and/or CuO, 16 parts or less of MnO 2 , 10.5 parts or less of Ag 2 O, and 4 parts or less of TiO 2 or TiH 2 .
Claim 6
Dependent Claim
53 words
A high density multilayer wired board as in claim 3, wherein a conductive composition contains by weight, 100 parts in total of CuO and Cu, 16 parts or less of MnO 2 , 10.5 parts or less of Ag 2 O, and 4 parts or less of TiO 2 or TiH 2 .
Claim 7
Independent Claim
99 words
A method of forming a multilayered wiring board comprising the steps of: printing on at least one respective surface of a plurality of green sheets containing a crystallizable glass a respective pattern formed of a conductive material; laminating together said printed green sheets; and sintering said laminated green sheets; wherein said conductive composition contains by weight, 100 parts of a base composition containing 50 to 90% CuO and 10 to 50% Cu by weight, 20 to 80 parts of Pd and/or Pt, 10 parts or less of MnO 2 , and 5 parts or less of Ag 2 O.
Claim 8
Independent Claim
99 words
A method of forming a multilayered wiring board comprising the steps of: printing on at least one respective surface of a plurality of green sheets containing a crystallizable glass a respective pattern formed of a conductive material; laminating together said printed green sheets; and sintering said laminated green sheets; wherein said conductive composition contains by weight, 100 parts of a base composition containing 50 to 90% CuO and 10 to 50% Cu by weight, 20 to 80 parts of Pd and/or Pt, 10 parts or less of MnO 2 , and 5 parts or less of Ag 2 O.
Claim 9
Independent Claim
99 words
A method of forming a multilayered wiring board comprising the steps of: printing on at least one respective surface of a plurality of green sheets containing a crystallizable glass a respective pattern formed of a conductive material; laminating together said printed green sheets; and sintering said laminated green sheets; wherein said conductive composition contains by weight, 100 parts (according to Cu components thereof) of a base composition of Cu and/or CuO, 16 parts or less of MnO 2 , 10.5 parts or less or Ag 2 O, and 4 parts or less of TiO 2 or TiH 2 .
Claim 10
Independent Claim
99 words
A method of forming a multilayered wiring board comprising the steps of: printing on at least one respective surface of a plurality of green sheets containing a crystallizable glass a respective pattern formed of a conductive material; laminating together said printed green sheets; and sintering said laminated green sheets; wherein said conductive composition contains by weight, 100 parts (according to Cu components thereof) of a base composition of Cu and/or CuO, 16 parts or less of MnO 2 , 10.5 parts or less or Ag 2 O, and 4 parts or less of TiO 2 or TiH 2 .
References Cited (Backward Citations)
US3293501A
Cited
US3776769A
Cited
US3851228A
Cited
US3843350A
Cited
US4072771A
Cited
US4109377A
Cited
EP0092155A2
Cited
US4446059A
Cited
US4756848A
Cited
US4705917A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-06-05 | 1992-12-05 | 1993-06-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-06-05 | 1996-12-05 | 1997-06-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-06-05 | 2000-12-05 | 2001-06-06 | $7700.00 | Window Closed / Lapsed |