US4836905A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Processing apparatus
Assignee: Texas Instruments Inc
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Filing: 1987-07-16
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Granted: 1989-06-06
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Expires: 2007-07-16
Abstract
Abstract A processing apparatus and method which permits sputter deposition and which is compatible with a vacuum processing system wherein the wafers are largely transferred and processed in the face down position. This includes an additional wafer movement, wherein, after a wafer has been emplaced face down, in a position where it can be clamped against the susceptor, the susceptor is rotated from its approximately horizontal position up to a more nearly vertical position. While the wafer is in the more nearly vertical position, sputter deposition may be performed. In situ or remote plasma capability is usefully provided in the bottom part of the chamber, so that a dry deglaze or cleanup step can be performed while the wafer is in its substantially horizontal position, followed by a sputter deposition after the wafer has been moved to its more nearly vertical position.
Inventors
- 👤 Cecil J. Davis
- 👤 Joseph V. Abernathy
- 👤 Robert T. Matthews
- 👤 Randall C. Hildenbrand
- 👤 Bruce Simpson
- 👤 James G. Bohlman
- 👤 Lee M. Loewenstein
- 👤 John I. Jones
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 19:56
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/30; H10P72/33; H10P72/3306; C; C23; C23C; C23C14/00; C23C14/22; C23C14/50; C23C14/56; C23C14/568; C23F; C23F4/00; H10P72/04; H10P72/0431; H10P72/0436; H10P72/3308; Y; Y10; Y10S; Y10S414/00; Y10S414/135; Y10S414/136; Y10S414/137
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
133 words
An apparatus for processing of wafers, comprising: (a) a vacuum processing chamber having a top processing chamber having means for performing a first processing step and an upper processing space having means for performing a second processing step within said vacuum processing chamber; (b) a wafer support within said vacuum processing chamber, said wafer support being capable of supporting a wafer in a substantially face down position with substantially no damage to structures on the face of said wafer in the top processing chamber while a first processing step is being performed; and (c) said wafer support being movable to rotate said wafer from said substantially face down position in said top process chamber into a more nearly vertical position in said upper processing space where a second processing step can be performed.
Claim 2
Independent Claim
133 words
An apparatus for processing of wafers, comprising: (a) a vacuum processing chamber having a top processing chamber having means for performing a first processing step and an upper processing space having means for performing a second processing step within said vacuum processing chamber; (b) a wafer support within said vacuum processing chamber, said wafer support being capable of supporting a wafer in a substantially face down position with substantially no damage to structures on the face of said wafer in the top processing chamber while a first processing step is being performed; and (c) said wafer support being movable to rotate said wafer from said substantially face down position in said top process chamber into a more nearly vertical position in said upper processing space where a second processing step can be performed.
Claim 3
Dependent Claim
14 words
The apparatus of claim 1 wherein the first processing step is a cleanup step.
Claim 4
Dependent Claim
15 words
The apparatus of claim 1 wherein the second processing step is a sputter deposition step.
Claim 5
Dependent Claim
36 words
The apparatus of claim 1 further comprising a wafer transfer mechanism positioned to controllably transfer wafers through an openable port into said vacuum process chamber, said wafer transfer mechanism being capable of operation under high vacuum.
Claim 6
Independent Claim
141 words
An apparatus for processing of wafers, comprising: (a) a vacuum process chamber having a top processing chamber having means for performing a first processing step and an upper processing space having means for performing a second processing step in the processing chamber; (b) a wafer support within said vacuum process chamber, said wafer support being capable of supporting a wafer in a substantially face down position with substantially no damage to structures on the face of said wafer in a top processing chamber where a first processing step can be performed; and (c) said wafer support is openable and closeable and is also controllable independently thereof to move said wafer support from said substantially face down position in said top processing chamber into a more nearly vertical position in said upper processing space where a second processing step can be performed.
Claim 7
Independent Claim
141 words
An apparatus for processing of wafers, comprising: (a) a vacuum process chamber having a top processing chamber having means for performing a first processing step and an upper processing space having means for performing a second processing step in the processing chamber; (b) a wafer support within said vacuum process chamber, said wafer support being capable of supporting a wafer in a substantially face down position with substantially no damage to structures on the face of said wafer in a top processing chamber where a first processing step can be performed; and (c) said wafer support is openable and closeable and is also controllable independently thereof to move said wafer support from said substantially face down position in said top processing chamber into a more nearly vertical position in said upper processing space where a second processing step can be performed.
Claim 8
Dependent Claim
14 words
The apparatus of claim 5 wherein the first processing step is a cleanup step.
Claim 9
Dependent Claim
15 words
The apparatus of claim 5 wherein the second processing step is a sputter deposition step.
Claim 10
Dependent Claim
36 words
The apparatus of claim 5 further comprising a wafer transfer mechanism positioned to controllably transfer wafers through an openable port into said vacuum process chamber, said wafer transfer mechanism being capable of operation under high vacuum.
Claim 11
Independent Claim
117 words
An apparatus for processing of wafers, comprising: (a) a vacuum process chamber; (b) a wafer support within said vacuum process chamber, said wafer support being capable of supporting a wafer in a substantially face down position with substantially no damage to structures on the face of said wafer; (c) said wafer support is openable and closeable and is also controllable independently thereof to move said wafer support from said substantially face down position into a more nearly vertical position; (d) a first process station to effect predetermined operation on a wafer held in said more nearly vertical position; and (e) second process station to effect predetermined operation on a wafer held in said substantially face down position.
Claim 12
Independent Claim
117 words
An apparatus for processing of wafers, comprising: (a) a vacuum process chamber; (b) a wafer support within said vacuum process chamber, said wafer support being capable of supporting a wafer in a substantially face down position with substantially no damage to structures on the face of said wafer; (c) said wafer support is openable and closeable and is also controllable independently thereof to move said wafer support from said substantially face down position into a more nearly vertical position; (d) a first process station to effect predetermined operation on a wafer held in said more nearly vertical position; and (e) second process station to effect predetermined operation on a wafer held in said substantially face down position.
Claim 13
Dependent Claim
14 words
The apparatus of claim 3 wherein said first process station comprises a sputtering apparatus.
Claim 14
Dependent Claim
16 words
The apparatus of claim 9 wherein the cleanup step is performed at the second process station.
Claim 15
Dependent Claim
36 words
The apparatus of claim 9 further comprising a wafer transfer mechanism positioned to controllably transfer wafers through an openable port into said vacuum process chamber, said wafer transfer mechanism being capable of operation under high vacuum.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-06-05 | 1992-12-05 | 1993-06-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-06-05 | 1996-12-05 | 1997-06-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-06-05 | 2000-12-05 | 2001-06-06 | $7700.00 | Window Closed / Lapsed |