Patent US2397663A successfully refreshed from Google Patents.
Patent US4835344A successfully refreshed from Google Patents.
US4835344A
Expired / Lapsed
US
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Electronic component parts and method for manufacturing the same
Assignee: Toshiba Corp
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Filing: 1988-02-10
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Granted: 1989-05-30
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Expires: 2008-02-10
Abstract
Abstract The present invention provides an electronic component part with terminal pins very closely and very strongly bonded to a high thermal conductivity ceramics circuit board and a method for simply and continuously manufacturing electronic component parts, with a high operability, each with terminal pins bonded to a high thermal conductivity ceramics circuit board. According to the present invention, an electronic component part is provided in which terminal pins are bonded to a high thermal conductivity ceramics circuit board by a brazing metal, containing at least one kind of Group IVa elements. In another aspect of the present invention a method is provided for manufacturing electronic component parts, which comprises the step of attaching terminal pins to a high thermal conductivity ceramics circuit board by a brazing paste layer comprised of brazing metal powder containing at least one kind of Group IVa elements, an acrylic binder with a carboxylic group as a substituent group and organic solvent, and heating the resultant structure in an atmosphere containing nitrogen as a principal element so that terminal pins are firmly bonded to a circuit board.
Inventors
- 👤 Kiyoshi Iyogi
- 👤 Takaaki Yasumoto
- 👤 Toshirou Yanazawa
- 👤 Nobuo Iwase
- 👤 Masako Nakahashi
- 👤 Hiromitsu Takeda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 20:32
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W70/099; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49147; Y10T29/49149
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
59 words
An electronic component part, comprising: (i) a high thermal conductivity ceramic circuit board including an insulating layer comprised of an AlN sintered body, (ii) terminal pins located over said circuit board, and (iii) a metal brazing material having 2 to 15 wt.% of at least one element selected from the Group IVa elements bonding said board and said pins.
Claim 2
Dependent Claim
59 words
An electronic component part, comprising: (i) a high thermal conductivity ceramic circuit board including an insulating layer comprised of an AlN sintered body, (ii) terminal pins located over said circuit board, and (iii) a metal brazing material having 2 to 15 wt.% of at least one element selected from the Group IVa elements bonding said board and said pins.
Claim 3
Dependent Claim
29 words
The electronic component part according to claim 1, wherein said circuit board has a recess at a location at which a corresponding one of said terminal pins is bonded.
Claim 4
Dependent Claim
38 words
The electronic component part according to claim 1, wherein said metal brazing material is comprised of an alloy containing Ag and/or Cu as a principal element and 2 to 15% by weight of Ti, Zr or their combination.
Claim 5
Dependent Claim
34 words
The electronic component part according to claim 1, wherein said brazing material is comprised of Ag and/or Cu as a principal element and 2 to 10% by weight of Ti, Zr or their combination.
Claim 6
Dependent Claim
30 words
The electronic component part according to claim 1, wherein said brazing material is comprised of Ag as a principal element and 2 to 10% by weight of Ti or Zr.
Claim 7
Independent Claim
73 words
A method for manufacturing an electronic component part, comprising the step of: (a) attaching terminal pins to a high thermal conductivity ceramic circuit board by a brazing paste layer consisting of a metal brazing powder containing at least one member of Group IVa elements, an acrylic binder with a carboxylic group as a substituent group, and an organic solvent; and (ii) heating the resultant structure to bond the pins to said circuit board.
Claim 8
Independent Claim
73 words
A method for manufacturing an electronic component part, comprising the step of: (a) attaching terminal pins to a high thermal conductivity ceramic circuit board by a brazing paste layer consisting of a metal brazing powder containing at least one member of Group IVa elements, an acrylic binder with a carboxylic group as a substituent group, and an organic solvent; and (ii) heating the resultant structure to bond the pins to said circuit board.
Claim 9
Dependent Claim
21 words
The method according to claim 6, wherein said circuit board includes an insulating layer comprised of an aluminum nitride sintered body.
Claim 10
Dependent Claim
26 words
The method according to claim 6, wherein said circuit board includes a recess at its location where a corresponding one of said terminal pins is bonded.
Claim 11
Dependent Claim
21 words
The method according to claim 8, wherein said recess is formed at a step of forming a green sheet of ceramic.
Claim 12
Dependent Claim
18 words
The method according to claim 6, wherein said Group IVa elements are Ti, Zr or a combination thereof.
Claim 13
Dependent Claim
17 words
The method according to claim 6, wherein said metal brazing powder consists principally of Ag and/or Cu.
Claim 14
Dependent Claim
16 words
The method according to claim 6, wherein said carboxylic group is 1 to 5% by weight.
Claim 15
Dependent Claim
18 words
The method according to claim 6, wherein said acrylic binder has a molecular weight of 5000 to 15000.
Claim 16
Dependent Claim
17 words
The method according to claim 6, wherein said heating is performed substantially in a nitrogen gas atmosphere.
Claim 17
Dependent Claim
17 words
The method according to claim 6, wherein said atmosphere contains an impurity oxygen of below 20 ppm.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-05-29 | 1992-11-28 | 1993-05-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-05-29 | 1996-11-28 | 1997-05-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-05-29 | 2000-11-28 | 2001-05-30 | $7700.00 | Window Closed / Lapsed |