Patent US1594412A successfully refreshed from Google Patents.
Patent US3354045A successfully refreshed from Google Patents.
Patent US4747466A successfully refreshed from Google Patents.
Patent US4834796A successfully refreshed from Google Patents.
← Back to Patent Explorer
US4834796A Expired / Lapsed US ⏱️ 0.0 years remaining

Electroless copper plating solution and process for electrolessly plating copper

Assignee: Denso Corp
•
Filing: 1987-11-05
•
Granted: 1989-05-30
•
Expires: 2007-11-05
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A practically fast electroless copper deposition is obtained by using a trialkanolmonoamine as a complexing agent for copper ion and as an accelerator, by adding it in an excess amount of 1.2 to 30 times the mole concentration of the copper ion. An optimum increased deposition rate of 100 μm/hr is obtained even if additives such as potassium ferrocyanide, 2,2'-bipyridyl, polyethylenegrycol and an anionic surfactant are added.

Inventors

  • 👤 Koji Kondo
  • 👤 Katuhiko Murakawa
  • 👤 Kaoru Nomoto
  • 👤 Futoshi Ishikawa
  • 👤 Nobumasa Isida
  • 👤 Junji Isikawa

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-01 14:57
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/31; C23C18/38; C23C18/40

Claims Analysis

Total Claims: 13
Claim 1
Independent Claim 94 words
An electroless copper plating solution comprising a copper salt, a reducing agent, a pH-adjustor and trialanolmonoamine or a salt thereof in an excess amount such that it acts as a complexing agent for copper ion and as an accelerator, said trialkanolmonoamine or a salt thereof being present in an amount such that a copper deposition rate is substantially increased in comparison with a copper deposition rate obtained when the trialkanolmonoamine or a salt thereof is present in an amount sufficient to completely complex the copper ion but not enough to act as an accelerator.
Claim 2
Dependent Claim 94 words
An electroless copper plating solution comprising a copper salt, a reducing agent, a pH-adjustor and trialanolmonoamine or a salt thereof in an excess amount such that it acts as a complexing agent for copper ion and as an accelerator, said trialkanolmonoamine or a salt thereof being present in an amount such that a copper deposition rate is substantially increased in comparison with a copper deposition rate obtained when the trialkanolmonoamine or a salt thereof is present in an amount sufficient to completely complex the copper ion but not enough to act as an accelerator.
Claim 3
Dependent Claim 29 words
A solution according to claim 1, wherein said trialkanolmonoamine is triethanolamine and is present in an amount of 1.2 to 30 times the mole concentration of the copper ion.
Claim 4
Dependent Claim 26 words
A solution according to claim 2, wherein said triethanolamine is present in an amount of 1.3 to 20 times the mole concentration of the copper ion.
Claim 5
Dependent Claim 26 words
A solution according to claim 3, wherein said triethanolamine is present in an amount of 1.5 to 20 times the mole concentration of the copper ion.
Claim 6
Dependent Claim 17 words
A solution according to claim 1, further containing an additive for improving properties of a deposited layer.
Claim 7
Dependent Claim 27 words
A solution according to claim 5, wherein said additive is selected from a group consisting of potassium ferrocyanide, 2,2-dipyridyl, polyetyleneglycol, an anionic surfactant and a mixture thereof.
Claim 8
Dependent Claim 13 words
A solution according to claim 6, wherein said anionic surfactant is an alkylsulphonate.
Claim 9
Dependent Claim 29 words
A solution according to claim 1, wherein said trialkanolmonoamine is triisopropanolamine and is present in an amount of 1.2 to 30 times the mole concentration of the copper ion.
Claim 10
Dependent Claim 26 words
A solution according to claim 8, wherein said triisopropanolamine is present in an amount of 1.2 to 10 times the mole concentration of the copper ion.
Claim 11
Dependent Claim 26 words
A solution according to claim 9, wherein said triisopropanolamine is present in an amount of 1.2 to 5 times the mole concentration of the copper ion.
Claim 12
Dependent Claim 30 words
A solution according to claim 1, having a pH of 12.0 to 13.4, a temperature of 0° C. to 80° C., and a oxygen concentration of 0.5 to 5.4 ppm.
Claim 13
Dependent Claim 31 words
A solution according to claim 11, having a pH from 12.4 to 13.0, and a temperature from 0° C. to 70° C., said oxygen concentration being from 1.5 to 4.0 ppm.

References Cited (Backward Citations)

US4301196A Cited
JPS5925965A Cited
US4265943A Cited
US4650691A Cited
US4448804A Cited
JPS60245783A Cited
EP0164580A2 Cited
US4684545A Cited
JPH0670183A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1992-05-29 1992-11-28 1993-05-30 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1996-05-29 1996-11-28 1997-05-30 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2000-05-29 2000-11-28 2001-05-30 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag