Patent US3688747A successfully refreshed from Google Patents.
Patent US4827376A successfully refreshed from Google Patents.
US4827376A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Heat dissipating interconnect tape for use in tape automated bonding
Assignee: Olin Corp
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Filing: 1987-12-18
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Granted: 1989-05-02
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Expires: 2007-12-18
Abstract
Abstract The present invention is directed to electronic packages. A heat dissipating pad positioned over the electrically active face of an electronic device transfers heat from the device to the electronic package or to an external heat sink. A dielectric electrically isolates the heat dissipating pad from the electronic device.
Inventors
- 👤 Scott V. Voss
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 09:24
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/464; H10W70/466; H10W40/00; H10W40/70; H10W40/77; H10W70/099; H10W70/453; H10W72/00; H10W72/701; H10W72/851; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W90/00; H10W90/701; H10W90/751; H10W90/754; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T428/00; Y10T428/12; Y10T428/12201
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
103 words
A package enclosing an electronic device, said electronic device containing electrically active bonding sites on a heat generating face, comprising: a base component; a cover component; a leadframe disposed between said base component and said cover component; a means electrically connecting said electronic component to said leadframe; a head dissipating pad adhesively affixed to said electrically active face of said electronic device said heat dissipating pad additionally containing at least one outwardly extending expandable support member; a first dielectric sealing compound disposed between said base component and said leadframe; and a second dielectric sealing compound disposed between said leadframe and said cover component.
Claim 2
Dependent Claim
103 words
A package enclosing an electronic device, said electronic device containing electrically active bonding sites on a heat generating face, comprising: a base component; a cover component; a leadframe disposed between said base component and said cover component; a means electrically connecting said electronic component to said leadframe; a head dissipating pad adhesively affixed to said electrically active face of said electronic device said heat dissipating pad additionally containing at least one outwardly extending expandable support member; a first dielectric sealing compound disposed between said base component and said leadframe; and a second dielectric sealing compound disposed between said leadframe and said cover component.
Claim 3
Dependent Claim
22 words
The package of claim 1 in which the means electrically connecting said electronic component to said leadframe is an electrically conductive wire.
Claim 4
Dependent Claim
17 words
The electrically conductive wire of claim 2 in which said wire is comprised of aluminum or gold.
Claim 5
Dependent Claim
26 words
The package of claim 1 in which the means electrically connecting said electronic component to said leadframe is a conductive tape adapted for tape automated bonding.
Claim 6
Dependent Claim
21 words
The package of claim 1 in which the adhesive affixing said heat dissipating pad to said electronic component is electrically conductive.
Claim 7
Dependent Claim
17 words
The package of claim 5 in which said adhesive is filled with a thermally conductive metal powder.
Claim 8
Dependent Claim
12 words
The package of claim 1 in which said adhesive is electrically nonconductive.
Claim 9
Dependent Claim
14 words
The package of claim 7 in which said nonconductive adhesive is a compliant polymer.
Claim 10
Dependent Claim
17 words
The package of claim 1 in which said base component is selected from metals, ceramics or polymers.
Claim 11
Dependent Claim
19 words
The package of claim 9 in which said base component is comprised of copper or a copper based alloy.
Claim 12
Dependent Claim
16 words
The package of claim 9 in which said base component is comprised of a thermosetting epoxy.
Claim 13
Dependent Claim
17 words
The package of claim 1 in which said cover component is selected from metals, ceramics or polymers.
Claim 14
Dependent Claim
18 words
The package of claim 12 in which said base and cover components are comprised of the same material.
Claim 15
Dependent Claim
18 words
The package of claim 1 in which said first and second dielectric sealing compounds are glasses or polymers.
Claim 16
Dependent Claim
13 words
The heat dissipating pad support of claim 1 further containing stress relief patterns.
Claim 17
Dependent Claim
12 words
The heat dissipating pad support of claim 1 further containing a downset.
Claim 18
Dependent Claim
26 words
The heat disipating pad support of claim 1 in which said outwardly extending end of said support is bonded to said base component or cover component.
Claim 19
Dependent Claim
23 words
The heat dissipating pad support of claim 17 in which said outwardly extending end of said support is expanded to maximize thermal dissipation.
Claim 20
Dependent Claim
26 words
The heat disipating pad support of claim 1 in which said outwardly extending end of said support extends beyond the base component and the cover component.
Claim 21
Dependent Claim
22 words
The heat dissipating pad support of claim 1 in which said outwardly extending end said support is bonded to an external heatsink.
Claim 22
Dependent Claim
18 words
The package of claim 1 in which said base component and said cover component comprise a unitary member.
Claim 23
Dependent Claim
20 words
The package of claim 21 in which said base component and said cover component are comprised of a molded polymer.
Claim 24
Dependent Claim
14 words
The package of claim 22 in which said molded polymer is a thermosetting epoxy.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-05-01 | 1992-10-31 | 1993-05-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-05-01 | 1996-10-31 | 1997-05-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-05-01 | 2000-10-31 | 2001-05-02 | $7700.00 | Window Closed / Lapsed |