US4827083A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wiring substrate
Assignee: NEC Corp
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Filing: 1988-04-07
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Granted: 1989-05-02
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Expires: 2008-04-07
Abstract
Abstract A wiring substrate which may be sintered with a minimum of cracking of the via-fills has a wiring substrate with wiring layers made of paste containing palladium powder and silver powder composed of spherical silver particles and flake-like silver particles, insulating layers made of a ceramic material and through-hole wirings formed by the paste within the insulating layers to provide electrical connection between the wiring layers.
Inventors
- 👤 Jun Inasaka
- 👤 Shin-Ichi Hasegawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 05:19
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4664; H05K3/4667; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/66; H10W70/666; H10W70/67; H10W70/68; H10W70/685; H05K1/03; H05K1/0306
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
96 words
A wiring substrate comprising: a plurality of wiring layers formed by sintering paste containing palladium powder composed of spherical palladium particles and silver powder composed of spherical silver particles and flake-like silver particles; a plurality of insulating layers formed by sintering a glass ceramic material for providing insulation between said wiring layers; and a plurality of through-hole wirings formed by said paste within said insulating layers to provide electrical connection between said wiring layers, wherein upon said sintering the shrinkage ratio of said paste is substantially equal to the shrinkage ratio of said glass ceramic material.
Claim 2
Dependent Claim
96 words
A wiring substrate comprising: a plurality of wiring layers formed by sintering paste containing palladium powder composed of spherical palladium particles and silver powder composed of spherical silver particles and flake-like silver particles; a plurality of insulating layers formed by sintering a glass ceramic material for providing insulation between said wiring layers; and a plurality of through-hole wirings formed by said paste within said insulating layers to provide electrical connection between said wiring layers, wherein upon said sintering the shrinkage ratio of said paste is substantially equal to the shrinkage ratio of said glass ceramic material.
Claim 3
Dependent Claim
58 words
A wiring substrate as claimed in claim 1, wherein said silver powder contains 5 to 50 weight percent of said spherical silver particles and 50 to 95 weight percent of said flake-like silver particles, and wherein said paste contains 85 to 95 weight percent of said silver powder and 5 to 15 weight percent of said palladium powder.
Claim 4
Dependent Claim
63 words
A wiring substrate as claimed in claim 2, wherein said spherical palladium particles have a diameter of about 0.3μ to about 0.5μ, said spherical silver particles have a diameter of about 0.1μ to about 0.5μ, and said flake-like silver particles have a width and a length of about 0.3 μm to about 1.5 μm and a thickness of about 0.03μ to about 0.15μ.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-05-01 | 1992-10-31 | 1993-05-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-05-01 | 1996-10-31 | 1997-05-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-05-01 | 2000-10-31 | 2001-05-02 | $7700.00 | Window Closed / Lapsed |