Patent US3718945A successfully refreshed from Google Patents.
Patent US4820659A successfully refreshed from Google Patents.
US4820659A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making a semiconductor device assembly
Assignee: General Electric Co
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Filing: 1987-10-15
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Granted: 1989-04-11
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Expires: 2007-10-15
Abstract
Abstract The invention is a semiconductor device assembly and method of making the same. A mounting plate has positioning means for positioning the plate relative to a header, a first mounting surface of the plate is attached to the header and a semiconductor device is attached to a second mounting surface of the mounting plate. The assembly is made by forming the mounting plate, positioning the mounting plate relative to the header by the positioning means, attaching the first mounting surface to the header and the semiconductor device to the second mounting surface. Another method of making the assembly is by defining and etching a mounting plate and attaching the first mounting surface to the header and the semiconductor device to the second mounting surface. This assembly and process provides an efficient means for mounting semiconductor devices and in particular electro-optic devices such as lasers.
Inventors
- 👤 Anil R. Dholakia
- 👤 Louis Trager
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 18:01
CPC Classifications
H; H01; H01S; H01S5/00; H01S5/02; H01S5/024; H01S5/02476; H01S5/022; H01S5/0235; H01S5/02355; H01S5/0237; H10; H10H; H10H20/00; H10H20/80; H10H20/85; H10H20/8506; Y; Y10; Y10T; Y10T29/00; Y10T29/53; Y10T29/5313; Y10T29/53174
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
57 words
A method of making a semiconductor device assembly which comprises the steps of: forming by photolithography and etching a metallic thermally conductive mounting plate having first and second major mounting surfaces for attachment to a header; attaching said mounting plate to the first surface of said header; and attaching said semiconductor device to said second mounting surface.
Claim 2
Independent Claim
57 words
A method of making a semiconductor device assembly which comprises the steps of: forming by photolithography and etching a metallic thermally conductive mounting plate having first and second major mounting surfaces for attachment to a header; attaching said mounting plate to the first surface of said header; and attaching said semiconductor device to said second mounting surface.
Claim 3
Dependent Claim
34 words
The method of claim 1, wherein the step of forming the mounting plate further comprises the step of forming a positioning means in said plate comprising at least one tab extending from said plate.
Claim 4
Dependent Claim
33 words
The method of claim 1, wherein the step of forming said mounting plate further comprises the step of forming integral with the plate means for manually positioning the plate relative to said header.
Claim 5
Dependent Claim
37 words
The method of claim 1, further comprises the step of positioning an end face of said device such that the end face is substantially coplanar with an edge of said mounting plate prior to attaching said device.
Claim 6
Dependent Claim
26 words
The method of claim 1, wherein the step of forming the mounting plate further comprises the step of coating the mounting plate with nickel and tin.
Claim 7
Independent Claim
48 words
A method of making a semiconductor device assembly which comprises the steps of: defining and etching a sheet to form a mounting plate having first and second major mounting surfaces; attaching said first mounting surface to a header; and attaching said semiconductor device to said second mounting surface.
Claim 8
Independent Claim
48 words
A method of making a semiconductor device assembly which comprises the steps of: defining and etching a sheet to form a mounting plate having first and second major mounting surfaces; attaching said first mounting surface to a header; and attaching said semiconductor device to said second mounting surface.
Claim 9
Dependent Claim
30 words
The method of claim 6, wherein the step of defining and etching the mounting plate comprises the steps of: forming a photoresist pattern on a sheet; and etching said sheet.
Claim 10
Dependent Claim
41 words
The method of claim 6, wherein the step of defining and etching said sheet further comprises the step of forming at least one tab extending from an edge of said plate in a direction about perpendicular to said first mounting surface.
Claim 11
Dependent Claim
28 words
The method of claim 6, further comprising the step of defining and etching said sheet such that said mounting plate is about 250 μm or less in thickness.
Claim 12
Dependent Claim
13 words
The method of claim 6, wherein said sheet is an electrically conducting material.
Claim 13
Dependent Claim
26 words
The method of claim 6, wherein the step of forming the mounting plate further comprises the step of coating the mounting plate with nickel and tin.
Claim 14
Dependent Claim
39 words
The method of claim 6, further comprising the step of attaching a light emitting device to said mounting plate such that an emitting end face of the device is substantially coplanar with a leading edge of said mounting plate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-04-10 | 1992-10-10 | 1993-04-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-04-10 | 1996-10-10 | 1997-04-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-04-10 | 2000-10-10 | 2001-04-11 | $7700.00 | Window Closed / Lapsed |