Method of bonding non-polar or highly crystalline resin substrates employing a primer and a cyanoacrylate adhesive

Claim 2

A process for bonding non-polar or highly crystalline resin substrates together or bonding the resin substrate to another material by using a primer comprising an organometallic compound and an organic polymer as the effective components, and a cyanoacrylate-based adhesive comprising 2-cyanoacrylate.

Claim 3

A process according to claim 1, wherein the organic polymer is an olefinic copolymer, a chlorinated olefinic polymer, vinylic polymer or synthetic rubber.

Claim 4

A process according to claim 2, wherein the olefinic copolymer is an ethylene-vinyl acetate copolymer, ethylene-acrylic acid ester copolymer or alpha-olefin-maleic acid copolymer.

Claim 5

A process according to claim 2, wherein the chlorinated olefinic copolymer is chlorinated polyethylene or chlorinated polypropylene.

Claim 6

A process according to claim 2, wherein the vinylic polymer is polyvinyl chloride, polyvinyl acetate, poly(metha)acrylic acid ester, polyvinyl ether or a polyvinyl chloride-polyvinylidene chloride copolymer.

Claim 7

A process according to claim 2, wherein the synthetic rubber is polychloroprene, NBR, SBR or chlorinated rubber.

Claim 8

A process according to claim 1, wherein the organometallic compound and organic polymer are dispersed or dissolved in an organic solvent to obtain a dispersion or solution.

Claim 9

A process according to claim 7, wherein the organic solvent is 1,1,2-trichloro-1,2,2-trifluoroethane, ethanol, acetone, ethyl acetate, 1,1,1-trichloroethane, tetrahydrofuran, 1,4-dioxane or toluene.

Claim 10

A process according to claim 7, wherein the organic polymer is contained in an amount of 0.1-20% in the dispersion or solution.

Claim 11

A process according to claim 7, wherein the organometallic compound is contained in an amount of 0.001-20% in the dispersion or solution.

Claim 12

A process according claim 7, wherein the dispersion or solution has a viscosity of 2-5000 cp at 25° C.

Claim 13

A process according to claim 7, wherein the moisture content is not more than 500 ppm.

Claim 14

A process according to claim 1, wherein the organometallic compound is a metal alcoholate represented by the following formula M-O-R wherein M is an elemental metal and R is an organic group.

Claim 15

A process according to claim 1, wherein the organometallic compound is a 1,3-dicarbonyl complex compound represented by the formula ##STR4## wherein M, is a metallic element.

Claim 16

A process according to claim 1, wherein the organometallic compound is a carboxylate represented by the formula ##STR5## wherein M is a metallic element and R is an organic group.

Claim 17

A process according to claim 1, wherein the organometallic compound is a hydrocarbon group-containing metal compound represented by the formula M-R wherein M is a metallic element and R is an organic group.

Claim 18

A process according to claim 1, wherein the organometallic compound is one represented by the formula M-X-R wherein M is metallic element, X is a hereto atom and R is an organic group.

Claim 19

A process according to claim 13, wherein the organic group is alkyl, cycloalkyl, haloalkyl, alkenyl, cycloalkenyl, alkoxy, cycloalkoxy, aryl, aralkyl, aralkyloxy, acetylacetate, acyloxy or cycloalkenyloxy or aryloxy group.

Claim 20

A process according to claim 13, wherein the organic group is a hydrocarbon group having at least three carbon atoms.

Claim 21

A process according to claim 13, wherein the elemental metal is a typical metal, a transition metal, a metalloid, phosphorus, boron or silicon.

Claim 22

A process according to claim 1, wherein the non-polar or highly crystalline resin substrates are polyolefin, polyfluoroolefin, polyethylene terephthalate, polyacetal, nylon or plasticizer-rich soft polyvinyl chloride substances.

Claim 23

A process according to claim 1, wherein the non-polar or high crystalline resin substrate is polyethylene or polypropylene.

Claim 24

A process according to claim 1, wherein the other material is a solid material selected from the group consisting of metals, glass, synthetic resins, rubber, leather, stone, cloth, paper, wood and ceramics.

Claim 25

A process according to claim 1, wherein said other material is a coating material.

Claim 26

A process according to claim 24, wherein the coating material is a paint.

Claim 27

A process according to claim 1, wherein said other material is a printing ink.

Claim 28

A process according to claim 13, wherein the organometallic compound of the formula M-O-R is aluminum isopropylate, aluminum mono-sec.-butoxydiisopropylate, aluminum ethylacetoacetate diisopropylate, aluminum oleyacetoacetate diisopropylate, tetrabutyl titanate, tetraisopropyl titanate, tri-n-butyl borate, triphenyl borate, tri-n-octadecyl borate, monobutyldimethyl borate, trioleyl phosphate, tridecyl phosphate, dibutyl phosphite, trisisodecyl phosphite, di-2-ethlhexyl phosphite, tridecyl phosphite, tetraoctyl silicate, triisobutoxygallium or tetrabutyl zirconate.

Claim 29

A process according to claim 14, wherein the organometallic compound of the formula ##STR6## is aluminum trisacetylacetonate, aluminum monoacetylacetonate bisethylacetoacetate, aluminum trisethylacetoacetate, acetylacetone lithium, acetylacetone beryllium, acetylacetone sodium, acetylacetone magnesium, acetylacetone calcium, acetylacetone titanium, acetylacetone strontium, acetylacetone barium, acetylacetone thallium, acetylacetone vanadium, acetylacetone manganese (III), acetylacetone iron (III), acetylacetone thorium, acetylacetone chromium (III), acetylacetone rhodium, acetylacetone cobalt (II), acetylacetone cobalt (III), acetylacetone nickel, acetylacetone copper, acetylacetone zinc, acetylacetone zirconium, acetylacetone palladium, acetylacetone indium, acetylacetone tin (IV), acetylacetone molybdenum complex salt, acetoacetic acid ester, trifluoroacetylacetone or benzoylacetone complex salt.

Claim 30

A process according to claim 15, wherein the organometallic compound of the formula ##STR7## is magnesium stearate, aluminum stearate, calcium stearate, ferric stearate, zinc stearate, barium stearate, lead stearate, potassium stearate, copper stearate, manganese stearate, nickel stearate, nickel naphthenate, cobalt naphthenatee, magnesium palmitate, cadmium palmitate, cobalt palmitate, sodium linoleate, sodium laurate, barium oleate, aluminum laurate, aluminum oleate, potassium oleate, aluminum acetate, stannous acetate, stannous 2-ethyl-hexanoate, aluminum formoacetate, zinc tartrate or basic aluminum thiodiglycolate.

Claim 31

A process according to claim 16, wherein the organometallic compound of the formula M-R is zinc 2-ethylhexyl, lithium hexadecyl, sodium n-hexyl, potassium hexadecyl, aluminum n-trioctyl, lead n-propylethyl, antimony tri-n-pentyl, antimony tri-n-decyl and zinc isobutylisoamyl, dibutyl tin diacetate, din-butyl tin dimaleate, di-n-butyl tin dioxide, triphenyl tin acetate, tri-n-butyl oxide, dioctyl tin dilaurate, tributyl tin acetate, tributyl tin chloride tin tetraamyl, diallyl tin dichloride, methylvinyldichlorosilane, octadecyldimethyll[3(-trimethoxysilyl)propyl]ammonium chloride, ferrocene, or titanocene dichloride.

Claim 32

A process according to claim 17, wherein the organometallic compound of the formula M-X-R is n-dodecylmercaptopotassium salt, aluminum trithiobutoxide, thin 2-ethylhexanemonothioate, zinc 2-ethylhexanedithioate, nickel dimethyldithiocarbamate, copper dimethyldithiocarbamate, iron dimethyldithiocarbamate, zinc diethyldithiocarbamate, nickel benzenesulfonate, vanadium dibutylphosphate or zinc mercaptobenzothiazole.

Claim 33

A process according to claim 1, wherein the 2-cyanoacrylate is a compound represented by the formula ##STR8## wherein R is alkyl, alkenyl, cycloalkyl, aryl, alkoxyalkyl, aralkyl or haloalkyl.