Patent US3314475A successfully refreshed from Google Patents.
US4817849A
Expired / Lapsed
US
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Method for bonding semiconductor laser element and apparatus therefor
Assignee: Panasonic Holdings Corp
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Filing: 1987-09-08
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Granted: 1989-04-04
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Expires: 2007-09-08
Abstract
Abstract A method for bonding a semiconductor laser element, wherein a laser chip (4) is mounted on a stem (1) and a driving electric power is supplied to the laser chip through members for mounting the laser chip so that the laser chip emits a laser light, then the direction of the laser light is examined, and position of the laser chip is adjusted, in a manner that the direction of the laser light becomes within a predetermined range, and subsequently the laser chip is bonded on the pedestal (2) upon detection of entering the direction in the range, by flowing a large current through in the pedestal (2).
Inventors
- 👤 Akihiro Yamamoto
- 👤 Yutaka Makino
- 👤 Shinji Kaino
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 11:51
CPC Classifications
H; H01; H01S; H01S5/00; H01S5/02; H01S5/022; H01S5/023; H01S5/02325; H01S5/02326; H05; H05K; H05K3/00; H01S3/00; H01S3/02; H01S5/0235; H01S5/02355; H10; H10W; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49004; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49133
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
134 words
A method for bonding a semiconductor laser element comprising: a step for movably locating a laser chip on a stem of a semiconductor laser device, a step for supplying an electric current to said movably located laser chip to cause said laser chip to emit a laser light, a step for examining an intensity of said emitted laser light, a step for detecting a central axis of a light beam of said emitted laser light; a step for measuring a difference between a direction of said central axis and a predetermined direction, a step for adjusting a portion of said laser chip until said difference becomes within a predetermined range, and a step for bonding said laser chip on the stem by passing a current therethrough, when said difference becomes within said predetermined range.
Claim 2
Independent Claim
134 words
A method for bonding a semiconductor laser element comprising: a step for movably locating a laser chip on a stem of a semiconductor laser device, a step for supplying an electric current to said movably located laser chip to cause said laser chip to emit a laser light, a step for examining an intensity of said emitted laser light, a step for detecting a central axis of a light beam of said emitted laser light; a step for measuring a difference between a direction of said central axis and a predetermined direction, a step for adjusting a portion of said laser chip until said difference becomes within a predetermined range, and a step for bonding said laser chip on the stem by passing a current therethrough, when said difference becomes within said predetermined range.
Claim 3
Independent Claim
123 words
An apparatus for bonding a semiconductor laser element comprising: means for movably locating a laser chip on a stem of a semiconductor laser device, means for supplying an electric current to said movably located laser chip to cause said laser chip to emit a laser light, means for examining an intensity of said emitted laser light, means for detecting a central axis of a light beam of said emitted laser light and measuring a difference between a direction of said central axis and a predetermined direction, means for adjusting said laser chip until said difference becomes within a predetermined range, and means for bonding said laser chip on the stem by passing a current therethrough when said difference becomes within said predetermined range.
Claim 4
Independent Claim
123 words
An apparatus for bonding a semiconductor laser element comprising: means for movably locating a laser chip on a stem of a semiconductor laser device, means for supplying an electric current to said movably located laser chip to cause said laser chip to emit a laser light, means for examining an intensity of said emitted laser light, means for detecting a central axis of a light beam of said emitted laser light and measuring a difference between a direction of said central axis and a predetermined direction, means for adjusting said laser chip until said difference becomes within a predetermined range, and means for bonding said laser chip on the stem by passing a current therethrough when said difference becomes within said predetermined range.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-04-03 | 1992-10-03 | 1993-04-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-04-03 | 1996-10-03 | 1997-04-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-04-03 | 2000-10-03 | 2001-04-04 | $7700.00 | Window Closed / Lapsed |