Patent US4813129A successfully refreshed from Google Patents.
US4813129A
Expired / Lapsed
US
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Interconnect structure for PC boards and integrated circuits
Assignee: HP Inc
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Filing: 1987-06-19
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Granted: 1989-03-21
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Expires: 2007-06-19
Abstract
Abstract An interconnect structure for electrically coupling conductive paths on two adjacent, rigid substrates, such as PC boards or IC chips. The interconnect structure includes a number of buttons formed on a first substrate, and a number of contacts formed on a second substrate. The buttons are elastically deformable, and include a resilient core made from an organic material such as polyimide, and a metallic coating formed over the core. The two substrates are compressed between mounting plates such that the buttons are pressed against the contracts to make electrical contact.
Inventors
- 👤 Marcos Karnezos
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 18:39
CPC Classifications
H; H01; H01R; H01R13/00; H01R13/02; H01R13/22; H01R13/24; H01R13/2464; H01R12/00; H01R12/70; H01R12/71; H01R12/712; H01R12/714; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/325; H05K3/40; H05K3/4007; H10; H10W; H10W72/00; H10W72/01; H10W72/012; H10W72/071; H10W72/072; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K1/113; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0314; H05K2201/0332; H05K2201/0364; H05K2201/0367; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09472; H05K2201/095; H05K2201/09509; H05K2201/09654; H05K2201/09745; H05K2201/09818; H05K2201/09909; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10719; H10W72/20; H10W72/251; H10W72/90; H10W72/921; H10W72/923; H10W72/941; H10W72/944; H10W72/9445; H10W72/951; H10W72/952; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
123 words
A method for making an interconnect structure between a first conductive path on a first substrate and a second conductive path on a second substrate comprising the steps of: forming a protuberance on a surface of said first substrate which includes a resilient core made from an organic material, and a conductive coating formed on an external surface of said core and coupled to aid fist conductive path, by applying a layer of said organic material to said first substrate and removing portions of said layer of organic material from said substrate to leave said protuberance; and forming contact means on a surface of said second substrate adapted to contact said protuberance, said contact means being electrically coupled to said second conductive path.
Claim 2
Independent Claim
123 words
A method for making an interconnect structure between a first conductive path on a first substrate and a second conductive path on a second substrate comprising the steps of: forming a protuberance on a surface of said first substrate which includes a resilient core made from an organic material, and a conductive coating formed on an external surface of said core and coupled to aid fist conductive path, by applying a layer of said organic material to said first substrate and removing portions of said layer of organic material from said substrate to leave said protuberance; and forming contact means on a surface of said second substrate adapted to contact said protuberance, said contact means being electrically coupled to said second conductive path.
Claim 3
Dependent Claim
73 words
A method for making an interconnect structure as recited in claim 1 wherein said step or removing portions of said layer of organic material includes the steps of: applying a resist over said layer of organic material; exposing said resist to an energy pattern; developing said resist to form a mask; etching said layer of organic material through said mask remove said portions of said layer of organic material; and removing said mask.
Claim 4
Dependent Claim
56 words
A method for making an interconnect structure as recited in claim 2 wherein said step of removing portions of said layer of organic material further includes the step of: applying a layer of aluminum to said layer of organic material prior to the application of said resist, said layer of aluminum forming part of said mask.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-03-20 | 1992-09-19 | 1993-03-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-03-20 | 1996-09-19 | 1997-03-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-03-20 | 2000-09-19 | 2001-03-21 | $7700.00 | Window Closed / Lapsed |