Patent US4812490A successfully refreshed from Google Patents.
US4812490A
Expired / Lapsed
US
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Epoxy resin molding compounds
Assignee: Siemens AG
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Filing: 1987-12-14
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Granted: 1989-03-14
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Expires: 2007-12-14
Abstract
Abstract Molding compounds for encapsulating semiconductor components comprise filler-containing polyepoxy resins and a 1,3,5-tris(3-amino-4-alkylphenyl)-2,4,6-trioxohexahydrotriazine with a C1 to C4 alkyl radical as a hardener. The molding compounds are storage-stable and moldings manufactured therefrom meet the requirements for these materials.
Inventors
- 👤 Wolfgang Kleeberg
- 👤 Heinz Hacker
- 👤 Jurgen Huber
- 👤 Dieter Wilhelm
- 👤 Heinz K. Laupenmuhlen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 15:01
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/40; H10W74/47; H10W74/473; C; C07; C07D; C07D251/00; C07D251/02; C07D251/12; C07D251/26; C07D251/30; C07D251/34; C08; C08G; C08G59/00; C08G59/18; C08G59/40; C08G59/50; C08G59/5046; C08G59/5053; C08G59/508; C08G59/5086; C08K; C08K3/00; C08K3/34; C08K3/36; H01; H01B; H01B3/00; H01B3/18; H01B3/30; H01B3/40
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
34 words
A molding compound for encapsulating semiconductor components comprising: an aromatic and/or heterocyclic polyepoxy resin; 1,3,5-tris(3-amino-4-alkylphenyl)-2,4,6-trioxo-hexahydrotriazine with a C 1 to C 4 alkyl radical as a hardener; and a mineral filler in powder form.
Claim 2
Dependent Claim
34 words
A molding compound for encapsulating semiconductor components comprising: an aromatic and/or heterocyclic polyepoxy resin; 1,3,5-tris(3-amino-4-alkylphenyl)-2,4,6-trioxo-hexahydrotriazine with a C 1 to C 4 alkyl radical as a hardener; and a mineral filler in powder form.
Claim 3
Dependent Claim
20 words
A molding compound according to claim 1 in which the mineral filler is in a mixture with inorganic short fibers.
Claim 4
Dependent Claim
21 words
A molding compound according to claim 1 in which the hardener is present in a mixture with aromatic and/or heterocyclic polymines.
Claim 5
Dependent Claim
24 words
A molding compound according to claim 3 in which the content of 1,3,5-tris(3-amino-4-alkylphenyl)-2,4,6-trioxo-hexahydrotriazine in the hardener mixture is at least about 50% by weight.
Claim 6
Dependent Claim
26 words
A molding compound according to claim 4 in which the content of 1,3,5-tris(3-amino-4-alkylphenyl)-2,4,6-trioxo-hexahydrotriazine in the hardener mixture is between about 80 and about 95% by weight.
Claim 7
Dependent Claim
24 words
A molding compound according to claim 1 in which the ratio of epoxy groups to amine hydrogen is from about 0.9:1 to about 1.1:1.
Claim 8
Dependent Claim
41 words
A molding compound according to claim 1 in which the polyepoxy resin is an epoxized novolak with an epoxy number of about 0.3 to about 0.6 and a total content of hydrolyzable halogen which is less than about 0.6% by weight.
Claim 9
Dependent Claim
41 words
A molding compound according to claim 1 in which the filler is selected from the group consisting of quartz meal, fused quartz meal and synthetically made silicon dioxide with an emission rate of less than about 0.01 alpha particles/cm 2 /hr.
Claim 10
Dependent Claim
29 words
A molding compound according to claim 1 in which the filler content is between about 50 to about 85% by weight relative to the total weight of the compound.
Claim 11
Dependent Claim
114 words
A molding compound for encapsulating semiconductor components comprising: an epoxized novolak with an epoxy number of about 0.3 to about 0.6 and a total content of hydrolyzable halogen which is less than about 0.6% by weight; a hardener mixture comprised of 1,3,5-tris(3-amino-4-alkylphenyl)-2,4,6-trioxo-hexahydrotriazine with a C 1 to C 4 alkyl radical and other aromatic or heterocyclic polyamines or mixtures thereof in which the content of the hexahydrotriazine in the hardener mixture is at least about 50% by weight; and one or more mineral fillers selected from the group consisting of quartz meal, fused quartz meal and synthetically made silicon dioxide with an alpha emission rate of less than about 0.01 alpha particles/cm 2 /hr.
Claim 12
Dependent Claim
114 words
A molding compound for encapsulating semiconductor components comprising: an epoxized novolak with an epoxy number of about 0.3 to about 0.6 and a total content of hydrolyzable halogen which is less than about 0.6% by weight; a hardener mixture comprised of 1,3,5-tris(3-amino-4-alkylphenyl)-2,4,6-trioxo-hexahydrotriazine with a C 1 to C 4 alkyl radical and other aromatic or heterocyclic polyamines or mixtures thereof in which the content of the hexahydrotriazine in the hardener mixture is at least about 50% by weight; and one or more mineral fillers selected from the group consisting of quartz meal, fused quartz meal and synthetically made silicon dioxide with an alpha emission rate of less than about 0.01 alpha particles/cm 2 /hr.
Claim 13
Dependent Claim
20 words
A molding compound according to claim 10 in which the mineral fillers are in a mixture with inorganic short fibers.
Claim 14
Dependent Claim
24 words
A molding compound according to claim 10 in which the ratio of epoxy to amine hydrogen function is from about 0.9:1 to about 1.1:1.
Claim 15
Dependent Claim
22 words
A molding compound according to claim 10 in which the polyepoxy resin is a mixture of an epoxized novolak and triglycidyl isocyanurate.
Claim 16
Dependent Claim
61 words
A molding compound according to claim 10 in which the polyepoxy resin is a mixture of epoxized novolak and a nucleus-halogenated bisphenol bisglycidyl ether or a nucleus-brominated epoxized novolak or a mixture thereof, wherein the total content of the mixture of nucleus-bound halogen is equal to or smaller than about 4% by weight relative to the total weight of the resin.
Claim 17
Dependent Claim
21 words
A molding compound according to claim 10 in which the filler content is between about 50 to about 85% by weight.
Claim 18
Dependent Claim
70 words
A molding compound for encapsulating semiconductor components comprising: an aromatic and/or heterocyclic polyepoxy resin which is a mixture of triglycidyl isocyanurate and an epoxized novolak with an epoxy number of about 0.3 to about 0.6 and a total content of hydrolyzable halogen which is less than about 0.6% by weight; 1,3,5-tris(3-amino-4-alkylphenyl)-2,4,6-trioxo-hexahydrotriazine with a C 1 to C 4 alkyl radical as a hardener; and a mineral filler in powder form.
Claim 19
Dependent Claim
70 words
A molding compound for encapsulating semiconductor components comprising: an aromatic and/or heterocyclic polyepoxy resin which is a mixture of triglycidyl isocyanurate and an epoxized novolak with an epoxy number of about 0.3 to about 0.6 and a total content of hydrolyzable halogen which is less than about 0.6% by weight; 1,3,5-tris(3-amino-4-alkylphenyl)-2,4,6-trioxo-hexahydrotriazine with a C 1 to C 4 alkyl radical as a hardener; and a mineral filler in powder form.
Claim 20
Dependent Claim
110 words
A molding compound for encapsulating semiconductor components comprising: an aromatic and/or heterocyclic polyepoxy resin which is a mixture of an epoxized novolak with an epoxy number of about 0.3 to about 0.6 and a total content of hydrolyzable halogen which is less than about 0.6% by weight and a nucleus-halogenated bisphenol bisglycidyl ether or a nucleus-brominated epoxized novolak or mixture thereof, wherein the total content of the mixture of nucleus bound halogen is equal to or smaller than about 4% by weight relative to the total weight of the resin; 1,3,5-tris(3-amino-4-alkylphenyl)-2,4,6-trioxo-hexahydrotriazine with a C 1 to C 4 alkyl radical as a hardener; and a mineral filler in powder form.
Claim 21
Dependent Claim
110 words
A molding compound for encapsulating semiconductor components comprising: an aromatic and/or heterocyclic polyepoxy resin which is a mixture of an epoxized novolak with an epoxy number of about 0.3 to about 0.6 and a total content of hydrolyzable halogen which is less than about 0.6% by weight and a nucleus-halogenated bisphenol bisglycidyl ether or a nucleus-brominated epoxized novolak or mixture thereof, wherein the total content of the mixture of nucleus bound halogen is equal to or smaller than about 4% by weight relative to the total weight of the resin; 1,3,5-tris(3-amino-4-alkylphenyl)-2,4,6-trioxo-hexahydrotriazine with a C 1 to C 4 alkyl radical as a hardener; and a mineral filler in powder form.
Claim 22
Dependent Claim
38 words
A molding compound according to claim 16 in which the hardener is present in a mixture with aromatic and/or heterocyclic polyamines in which the content of 1,3,5-tris(3-amino-4-alkylphenyl)-2,4,6-trioxo-hexahydrotriazine in the hardener mixture is at least about 50% by weight.
Claim 23
Dependent Claim
38 words
A molding compound according to claim 17 in which the hardener is present in a mixture with aromatic and/or heterocyclic polyamines in which the content of 1,3,5-tris(3-amino-4-alkylphenyl)-2,4,6-trioxo-hexahydrotriazine in the hardener mixture is at least about 50% by weight.
Claim 24
Dependent Claim
24 words
A molding compound according to claim 16 in which the ratio of epoxy groups to amine hydrogen is from about 0.9:1 to about 1.1:1.
Claim 25
Dependent Claim
24 words
A molding compound according to claim 17 in which the ratio of epoxy groups to amine hydrogen is from about 0.9:1 to about 1.1:1.
References Cited (Backward Citations)
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1992-03-13 | 1992-09-12 | 1993-03-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-03-13 | 1996-09-12 | 1997-03-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-03-13 | 2000-09-12 | 2001-03-14 | $7700.00 | Window Closed / Lapsed |