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US4808274A
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Metallized substrates and process for producing
Assignee: BASF Catalysts LLC
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Filing: 1986-09-10
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Granted: 1989-02-28
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Expires: 2006-09-10
Abstract
Abstract The present invention is directed to metallized substrates and particularly metallized substrates for use in microwave integrated circuits and a process for producing such substrates. The metallized substrates generally comprise a dielectric substrate on which is formed a pattern such as a conductor line pattern, the pattern being formed of a conductive metal. The metallization is accomplished by forming one or more adhesion layers from a metallo organic composition which is built up with a metal conductor.
Inventors
- 👤 Pascaline H. Nguyen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 03:00
CPC Classifications
H; H05; H05K; H05K1/00; H05K3/00; H05K3/22; H05K3/24; H05K3/245; H05K3/246; C; C03; C03C; C03C17/00; C03C17/34; C03C17/36; C03C17/40; C04; C04B; C04B41/00; C04B41/45; C04B41/50; C04B41/51; C04B41/5111; C04B41/80; C04B41/81; C04B41/85; C04B41/88; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/098; H10W70/60; H10W70/62; H10W70/66; H05K1/02; H05K1/09; H05K1/092; H05K2203/00; H05K2203/12; H05K2203/121
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
74 words
A metallized substrate comprising a dielectric substrate, a metal layer produced from a metallo organic composition comprising at least one precious metal resinate in an amount of from about 4 to 25 percent, at least one film forming in an amount of from about 0.01 to 1.0 percent, at least one base metal resinate in an amount of from about 0.1 to 3 percent and a suitable medium, and a conductive metal layer thereon.
Claim 2
Dependent Claim
74 words
A metallized substrate comprising a dielectric substrate, a metal layer produced from a metallo organic composition comprising at least one precious metal resinate in an amount of from about 4 to 25 percent, at least one film forming in an amount of from about 0.01 to 1.0 percent, at least one base metal resinate in an amount of from about 0.1 to 3 percent and a suitable medium, and a conductive metal layer thereon.
Claim 3
Dependent Claim
19 words
The metallized substrate of claim 1, wherein the conductive metal layer is applied by either screen printing or electroplating.
Claim 4
Dependent Claim
16 words
The metallized substrate of claim 2, wherein the conductive metal layer is applied by screen printing.
Claim 5
Dependent Claim
15 words
The metallized substrate of claim 3, wherein the conductive metal layer is applied by electroplating.
Claim 6
Dependent Claim
24 words
The metallized substrate of claim 1, wherein the dielectric substrate is selected from the group consisting of 99.6% alumina, polished alumina and fused silica.
Claim 7
Dependent Claim
37 words
The metallized substrate of claim 4, wherein the metallo organic composition comprises at least one precious metal resinate, at least one film forming resinate and at least one base metal resinate other than tin, bismuth or chromium.
Claim 8
Dependent Claim
25 words
The metallized substrate of claim 5, wherein the precious metal resinate is selected from the group consisting of gold, silver, platinum, palladium or mixture thereof.
Claim 9
Dependent Claim
16 words
The metallized substrate of claim 1, wherein the conductive metal layer comprises either gold or copper.
Claim 10
Dependent Claim
16 words
The metallized substrate of claim 1, wherein the metallized substrate is a microwave integrated circuit substrate.
Claim 11
Dependent Claim
17 words
The metallized substrate of claim 9, wherein the microwave integrated circuit substrate contains a microstrip transmission line.
Claim 12
Dependent Claim
87 words
A process for producing a metallized substrate comprising forming a first adhesion promoting layer by applying a metallo organic composition to a dielectric substrate and thereafter forming a conductive layer thereon said metallo organic composition comprising at least one precious metal resinate in an amount of from about 4 to 25 percent, at least one film forming in an amount of from about 0.01 to 1.0 percent, at least one base metal resinate in an amount of from about 0.1 to 3 percent and a suitable medium.
Claim 13
Dependent Claim
87 words
A process for producing a metallized substrate comprising forming a first adhesion promoting layer by applying a metallo organic composition to a dielectric substrate and thereafter forming a conductive layer thereon said metallo organic composition comprising at least one precious metal resinate in an amount of from about 4 to 25 percent, at least one film forming in an amount of from about 0.01 to 1.0 percent, at least one base metal resinate in an amount of from about 0.1 to 3 percent and a suitable medium.
Claim 14
Dependent Claim
25 words
A process according to claim 11, wherein a first adhesion promoting layer is formed by screen printing and the conductive layer is formed by electroplating.
Claim 15
Dependent Claim
22 words
A process according to claim 11, wherein the first adhesion promoting layer and the conductive layer are both formed by screen printing.
Claim 16
Dependent Claim
33 words
A process according to claim 11, wherein the metallized substrate is a microwave integrated circuit substrate and conducting line patterns and ground plane are formed thereon by means of photoresist and etching techniques.
Claim 17
Dependent Claim
33 words
A process according to claim 11, wherein a second adhesion promoting layer is formed on the first adhesion promoting layer from a metallo organic composition prior to the formation of the conductive layer.
Claim 18
Dependent Claim
24 words
A process according to claim 11, wherein the dielectric substrate is selected from the group consisting of 99.6% alumina, polished alumina and fused silica.
Claim 19
Dependent Claim
33 words
A process according to claim 15, wherein the metallo organic composition used to form the second adhesion promoting layer comprises at least one precious metal resinate and at least one film forming resinate.
Claim 20
Dependent Claim
32 words
The process according to claim 11, wherein the conductive layer is formed by electroplating the metallo organic composition wherein the at least one base metal resinate is neither tin, bismuth, or chromium.
Claim 21
Dependent Claim
17 words
The process according to claim 11, wherein the conductive layer is formed of either gold or copper.
References Cited (Backward Citations)
US4303480A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-02-28 | 1992-08-29 | 1993-02-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-02-28 | 1996-08-29 | 1997-02-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-02-28 | 2000-08-29 | 2001-02-28 | $7700.00 | Window Closed / Lapsed |