Method for manufacture of printed circuit boards

Claim 1

In a method for manufacturing printed circuit boards the steps comprising: (a) providing a circuit board material containing through-holes and pads surrounding the surface openings of said through-holes, said board consisting of a non-conductive substrate material having copper foil laminated to each side thereof, the areas defined by said through-holes consisting of layered coatings extending radially inward toward the center of said holes, the layers being, sequentially from the wall of each electroless copper, electroplated copper and etch resistant electroplated tin-lead, the areas defined by said pads consisting of layered coatings, commencing from said coper foil on the non-conductive substrate surface, of electroless copper, electroplated copper and etch resistant electroplated tin-lead, and said non-conductive substrate having a trace pattern on at least one surface of said non-conductive substrate consisting of layered coatings, commencing from said substrate surface, of copper foil, electroless copper, electroplated copper and etch resistant electroplated tin-lead; (b) etching away all copper from the areas of said circuit board not provided with said etch resistant tin-lead layer; (c) subjecting said tin-lead etch resist to the actio of a first stripper composition comprising an oxidant for the tin and lead metals of said etch resist and an acid acceptor for the cations so oxidized to leave a thin film of tin smut on said trace pattern, through-holes and surrounding pad surfaces; (d) subjecting said thin film of tin smut to the action of a second stripper composition comprising an aqueous solution containing a mixture comprising an alkali metal hydroxide and an alkali metal chlorite until said thin film of tin smut has been removed and replaced by a layer of copper oxide; (e) applying a solder mask to the said trace pattern which has said layer of copper oxide on it, but not to said through-holes and surrounding pad surfaces; (f) etching away said thin film of copper oxide from said through-holes and surrounding pad surfaces; and (g) applying solder to said through-holes and pads.