Photoresist process of fabricating microelectronic circuits using water processable diazonium compound containing contrast enhancement layer

Claim 1

A photolithographic process for fabricating microelectronic circuits on a substrate comprising: a. applying on the substrate a layer of positive photoresist, said photoresist being developable in an aqueous solution after exposure to predetermined wavelengths; b. applying directly on the photoresist a contrast enhancement layer consisting of a water soluble binder and a water soluble diazonium compound bleachable at the predetermined wavelengths; c. exposing the contrast enhancement layer to an image formed by light at the predetermined wavelengths, thereby bleaching the contrast enhancement layer and exposing the photoresist and rendering the photoresist developable; d. immersing the coated substrate in an aqueous solution of photoresist developer, thereby dissolving the contrast enhancement layer with photoresist developer and developing the photoresist, resulting in the complete removal of the contrast enhancement layer and the development of the photoresist.