Apparatus for manufacturing semiconductor device

Claim 1

A method of forming a uniform film on a semiconductor substrate in a heating furnace, comprising the steps of positioning a plurality of semiconductor substrates within a supporting structure having a plurality of supports for holding said plurality of semiconductor substrates in generally parallel, spaced relation to each other, said supports being circumferentially spaced from each other and each support having projections spaced from each other along the support, said projections each having an upward exposed surface contacting to support at least part of a bottom face of each semiconductor substrate and wherein adjacent projections on each support are sufficiently vertically spaced from each other so that the spacing between an upper peripheral surface of one substrate and the bottom surface of an adjacent above projection overlying said upper peripheral surface is considerably greater than the thickness of said substrate; placing the supporting structure containing the stacked substrates within a vertical heating furnace; and introducing a raw material gas within the heating furnace for forming films on the upper surface of the substrates, the said spacing enabling a free flow of said gas along substantially the entire surface of each substrate including substantially the entire peripheral surface thereof to induce a uniform film along the entire surface of each ubstrate, wherein each projection has an upward exposed surface formed with a step portion, and wherein the wherein the upward exposed surface of each projection includes a notched portion defining a step portion having a depth approximately equal to the thickness of the semiconductor substrate so that the upper surface of the substrate exposed to the raw material gas is substantially coplanar with the remainder of the upward exposed surface of the projections located radially outward from the substrate upper surface.

Claim 2

A method of forming a uniform film on a semiconductor substrate in a heating furnace, comprising the steps of positioning a plurality of semiconductor substrates within a supporting structure having a plurality of supports for holding said plurality of semiconductor substrates in generally parallel, spaced relation to each other, said supports being circumferentially spaced from each other and each support having projections spaced from each other along the support, said projections each having an upward exposed surface contacting to support at least part of a bottom face of each semiconductor substrate and wherein adjacent projections on each support are sufficiently vertically spaced from each other so that the spacing between an upper peripheral surface of one substrate and the bottom surface of an adjacent above projection overlying said upper peripheral surface is considerably greater than the thickness of said substrate; placing the supporting structure containing the stacked substrates within a vertical heating furnace; and introducing a raw material gas within the heating furnace for forming films on the upper surface of the substrates, the said spacing enabling a free flow of said gas along substantially the entire surface of each substrate including substantially the entire peripheral surface thereof to induce a uniform film along the entire surface of each ubstrate, wherein each projection has an upward exposed surface formed with a step portion, and wherein the wherein the upward exposed surface of each projection includes a notched portion defining a step portion having a depth approximately equal to the thickness of the semiconductor substrate so that the upper surface of the substrate exposed to the raw material gas is substantially coplanar with the remainder of the upward exposed surface of the projections located radially outward from the substrate upper surface.

Claim 3

A method of forming a uniform film on a semiconductor substrate in a heating furnace, comprising the steps of positioning a plurality of semiconductor substrates within a supporting structure having a plurality of supports for holding said plurality of semiconductor substrates in generally parallel, spaced relation to each other, said supports being circumferentially spaced from each other and each support having projections spaced from each other along the support, said projections each having an upward exposed surface contacting to support at least part of a bottom face of each semiconductor substrate and wherein adjacent projections on each support are sufficiently vertically spaced from each other so that the spacing between an upper peripheral surface of one substrate and the bottom surface of an adjacent above projections overlying said upper peripherial surface is considerably greater than the thickness of said substrate; placing the supporting structure containing the stacked substrates within a vertical heating furnace; and introducing a raw material gas within the heating furnace for forming films on the upper surface of the substrates, the said spacing enabling a free flow of said gas along substantially the entire surface of each substrate including substantially the entire peripheral surface thereof to induce a uniform film along the entire surface of each substrate, wherein said projections and supports being further structured such that the upward and lower surfaces of substantially each projection are generally parallel to each other and substantially horizontal in operative position and wherein the inner substantially vertical surface of each support extending between vertically adjacent projections on said support extends smoothly and continuously and generally perpendicular to said upward and lower surfaces to define said interior volumtric region being a substantially cylindrical regions in conjunction with the said spacing between adjacent stacked substrates enabling said free flow of gas to occur.

Claim 4

A method of forming a uniform film on a semiconductor substrate in a heating furnace, comprising the steps of positioning a plurality of semiconductor substrates within a supporting structure having a plurality of supports for holding said plurality of semiconductor substrates in generally parallel, spaced relation to each other, said supports being circumferentially spaced from each other and each support having projections spaced from each other along the support, said projections each having an upward exposed surface contacting to support at least part of a bottom face of each semiconductor substrate and wherein adjacent projections on each support are sufficiently vertically spaced from each other so that the spacing between an upper peripheral surface of one substrate and the bottom surface of an adjacent above projections overlying said upper peripherial surface is considerably greater than the thickness of said substrate; placing the supporting structure containing the stacked substrates within a vertical heating furnace; and introducing a raw material gas within the heating furnace for forming films on the upper surface of the substrates, the said spacing enabling a free flow of said gas along substantially the entire surface of each substrate including substantially the entire peripheral surface thereof to induce a uniform film along the entire surface of each substrate, wherein said projections and supports being further structured such that the upward and lower surfaces of substantially each projection are generally parallel to each other and substantially horizontal in operative position and wherein the inner substantially vertical surface of each support extending between vertically adjacent projections on said support extends smoothly and continuously and generally perpendicular to said upward and lower surfaces to define said interior volumtric region being a substantially cylindrical regions in conjunction with the said spacing between adjacent stacked substrates enabling said free flow of gas to occur.