Substrate mounting assembly

Claim 2

A substrate mounting assembly comprising: a substrate having a plate-shaped configuration with a top surface having metallized conductor paths and bonding pads thereon and a bottom surface; a base carrier having a top surface to which said substrate bottom surface is to be bonded to, said base carrier having a substantially different temperature coefficient of expansion than said substrate; first adhesive means bonding a portion of said substrate bottom surface adjacent at least one critical one of said bonding pads to said base carrier top surface to effectively fix the position of said critical bonding pad with respect to said base carrier; and second adhesive means bonding other portions of said substrate bottom surface to said base carrier top surface, said second adhesive means forming a substantially more compliant and flexible bond between said substrate and said base carrier than said first adhesive means.

Claim 3

A substrate mounting assembly according to claim 1 wherein said first adhesive means is applied adjacent a lateral edge of said substrate to effectively fix said edge with respect to said base carrier, and wherein a plurality of critical ones of said bonding pads are located adjacent said lateral edge of said substrate.

Claim 4

A substrate mounting assembly according to claim 2 which includes wires connecting associated ones of said critical bonding pads to at least one semiconductor die mounted separate from said substrate.

Claim 5

A substrate mounting assembly according to claim 3 wherein said base carrier comprises a thermally conductive material and wherein said semiconductor die is mounted on said base carrier top surface with a bottom surface of said die effectively coupled to said base carrier top surface in thermal conducting relationship thereto.

Claim 6

A substrate mounting assembly according to claim 1 which includes at least one wire bonded at one portion thereof to said one critical bonding pad and at another portion of said wire to a bonding area separate from said substrate and fixed with respect to said base carrier.

Claim 7

A substrate mounting assembly according to claim 5 wherein said separate bonding area is on a device mounted to said base via a mounting structure separate from said substrate.

Claim 8

A substrate mounting assembly according to claim 6 wherein said base carrier comprises a heat sink and wherein said device is mounted in thermal conducting relationship to said heat sink.

Claim 9

A substrate mounting assembly according to claim 7 wherein said second adhesive means comprises one of a group consisting of a compliant adhesive urethane material and an acrylic adhesive tape.

Claim 10

A substrate mounting assembly according to claim 8 wherein said first adhesive means comprises a silicone adhesive providing a semi-rigid bond between said substrate and said base carrier, said second adhesive means still providing a substantially more compliant and flexible bond between said substrate and base carrier than said silicone adhesive.

Claim 11

A substrate mounting assembly according to claim 6 wherein said substrate is constructed of a ceramic material and said base carrier is constructed of a thermally and electrically conductive metal.

Claim 12

A substrate mounting assembly comprising: a substrate having a plate-shaped configuration with a top surface having metallized conductor paths and bonding pads thereon and a bottom surface; a base carrier having a top surface to which said substrate bottom surface is to be bonded to, said base carrier having a substantially different temperature coefficient of expansion than said substrate; first adhesive means bonding a portion of said substrate bottom surface adjacent at least one critical one of said bonding pads to said base carrier top surface to effectively fix the position of said critical bonding pad with respect to said base carrier; second adhesive means bonding other portions of said substrate bottom surface to said base carrier top surface, said second adhesive means forming a substantially more compliant and flexible bond between said substrate and said base carrier than said first adhesive means; said critical one of said bonding pads located adjacent one lateral edge of said substrate, and at least a non-critical one of said bonding pads located adjacent an opposite lateral edge of said substrate; a wire bonded at one portion thereof to said critical bonding pad and at another portion of said wire to a bonding area separate from said substrate and fixed with respect to said base carrier; and a wire/conductor having a portion bonded to said non-critical bonding pad and having another portion bonded to a lead frame bonding area separate from said substrate and fixed with respect to said base carrier.

Claim 13

A substrate mounting assembly comprising: a substrate having a plate-shaped configuration with a top surface having metallized conductor paths and bonding pads thereon and a bottom surface; a base carrier having a top surface to which said substrate bottom surface is to be bonded to, said base carrier having a substantially different temperature coefficient of expansion than said substrate; first adhesive means bonding a portion of said substrate bottom surface adjacent at least one critical one of said bonding pads to said base carrier top surface to effectively fix the position of said critical bonding pad with respect to said base carrier; second adhesive means bonding other portions of said substrate bottom surface to said base carrier top surface, said second adhesive means forming a substantially more compliant and flexible bond between said substrate and said base carrier than said first adhesive means; said critical one of said bonding pads located adjacent one lateral edge of said substrate, and at least a non-critical one of said bonding pads located adjacent an opposite lateral edge of said substrate; a wire bonded at one portion thereof to said critical bonding pad and at another portion of said wire to a bonding area separate from said substrate and fixed with respect to said base carrier; and a wire/conductor having a portion bonded to said non-critical bonding pad and having another portion bonded to a lead frame bonding area separate from said substrate and fixed with respect to said base carrier.

Claim 14

A substrate mounting assembly according to claim 11 wherein said lead frame bonding area comprises a conductor embedded in and extending from a non-conductive housing fixed to said base carrier, and wherein said wire bonded to said critical bonding pad connects said critical bonding pad to a semiconductor die mounted to said base carrier which provides a heat sink for said semiconductor die.

Claim 15

A substrate mounting assembly according to claim 11 wherein said substrate is constructed of a ceramic material and wherein said base carrier comprises an aluminum plate.

Claim 16

A substrate mounting assembly according to claim 12 wherein said ceramic substrate has a dimension between said lateral edges of at least two inches.

Claim 17

A substrate mounting assembly according to claim 14 wherein said first adhesive means is applied adjacent said lateral edge adjacent said critical bonding pad to effectively fix said edge with respect to said base carrier, and wherein a plurality of critical ones of said bonding pads are located adjacent said lateral edge of said substrate adjacent said one critical bonding pad.

Claim 18

A substrate mounting assembly according to claim 15 which includes a plurality of wires connecting associated ones of said critical bonding pads to at least one semiconductor die mounted separate from said substrate.

Claim 19

A substrate mounting assembly according to claim 16 wherein said base carrier comprises a thermally conductive structure and wherein said semiconductor die is mounted on said base carrier top surface with a bottom surface of said die effectively coupled to said base carrier top surface in thermal conducting relationship thereto.

Claim 20

A substrate mounting assembly according to claim 17 wherein said second adhesive means comprises one of a group consisting of a compliant adhesive urethane material and an acrylic adhesive tape.