US4795694A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Manufacture of fine structures for semiconductor contacting
Assignee: Siemens AG
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Filing: 1987-05-21
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Granted: 1989-01-03
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Expires: 2007-05-21
Abstract
Abstract A method for the manufacture of fine structures for semiconductors were in a photographic structuring is carried out on both sides of a smooth, non-stressed metal tape. The tape is etched from both sides. A single sided metal deposition than takes place by means of a float type electroplating. Stabilization of the fine structure is achieved by depositing a lacquer or resin by an electrophoretic deposition or by electro-immersion lacquering. The insulator carrier is applied as one of the final steps of the process.
Inventors
- 👤 Alfred Groeber
- 👤 Hans Hadersbeck
- 👤 Fritz Mueller
- 👤 Hubert Zukier
- 👤 Hans J. Hacke
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 13:31
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/02; H05K3/06; H10; H10W; H10W70/00; H10W70/01; H10W70/04; H10W70/042; H10W70/40; H10W70/421; H10W70/424; H05K2203/00; H05K2203/13; H05K2203/1333; H05K2203/135; H05K2203/15; H05K2203/1572; H05K3/061; H05K3/064; H05K3/10; H05K3/20; H05K3/202
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
103 words
A method for manufacturing fine structures for semiconductor contacting which comprises: providing a smooth, non-stressed metal tape, coating both sides of said tape with a photoresist, exposing both sides photographically in a predetermined pattern, developing said photoresist after exposure to provide a mask, electrodepositing a metal coating on the upper side of said tape by a floatation electroplating process, selectively etching the underside structure of said tape to about one half its thickness, de-coating the photoresist from both sides of said tape, applying a plastic stabilizer film to said underside, and finish etching the metal tape from the upper side of said tape.
Claim 2
Independent Claim
103 words
A method for manufacturing fine structures for semiconductor contacting which comprises: providing a smooth, non-stressed metal tape, coating both sides of said tape with a photoresist, exposing both sides photographically in a predetermined pattern, developing said photoresist after exposure to provide a mask, electrodepositing a metal coating on the upper side of said tape by a floatation electroplating process, selectively etching the underside structure of said tape to about one half its thickness, de-coating the photoresist from both sides of said tape, applying a plastic stabilizer film to said underside, and finish etching the metal tape from the upper side of said tape.
Claim 3
Dependent Claim
28 words
A method according to claim 1 which includes the step of electrodepositing an insulating film resistant to decoating of said photoresist onto said underside after said selective etching.
Claim 4
Dependent Claim
18 words
A method according to claim 2 wherein said electrodepositing of said insulating film takes place by electrophoretic deposition.
Claim 5
Dependent Claim
18 words
A method according to claim 2 wherein said electroplating of said insulating film takes place by electro-immersion lacquering.
Claim 6
Dependent Claim
35 words
A method according to claim 2 which includes: carrying out both a photographic structuring and a single sided electrodeposition of metal on the lower side of said tape following the electrodeposition of said insulating film.
Claim 7
Dependent Claim
37 words
A method according to claim 2 wherein the photographic structuring of the underside is carried out to produce an etching mask and the photographic structuring of said upper side is carried out to produce an electroplating mask.
Claim 8
Dependent Claim
23 words
A method according to claim 2 wherein the electrodepositing of said insulating film is followed by a finish etching of the upper side.
Claim 9
Dependent Claim
24 words
A method according to claim 7 which includes the step of electrophoretic coating or electro-immersion lacquering of the upper side after said finish etching.
Claim 10
Dependent Claim
26 words
A method according to claim 8 which includes the step of depositing a coating of tin on the upper side of said film after said de-coating.
Claim 11
Dependent Claim
16 words
A method according to claim 1 wherein said plastic stabilizing film is applied in individual pieces.
Claim 12
Dependent Claim
19 words
A method according to claim 1 wherein said plastic stabilizing film is applied in individual pieces by silk screening.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-01-03 | 1992-07-04 | 1993-01-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-01-03 | 1996-07-04 | 1997-01-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-01-03 | 2000-07-04 | 2001-01-03 | $7700.00 | Window Closed / Lapsed |