Patent US4775596A successfully refreshed from Google Patents.
US4775596A
Expired / Lapsed
US
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Composite substrate for integrated circuits
Assignee: Corning Glass Works
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Filing: 1987-02-18
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Granted: 1988-10-04
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Expires: 2007-02-18
Abstract
Abstract This invention is particularly directed to the preparation of inorganic ceramic laminated structures for use as substrates in integrated circuit packages. One lamina is composed of a high thermal conductivity material, the second lamina is composed of a low thermal conductivity material having a dielectric constant below 10, a sintering temperature below 1050° C., and a linear coefficient of thermal expansion compatible with that of the other lamina, and a bonding medium sealing the two laminae together exhibiting flow at a temperature below the sintering temperature of the second lamina and a linear coefficient of thermal expansion compatible with those of the two laminae.
Inventors
- 👤 Louis M. Holleran
- 👤 Gregory A. Merkel
- 👤 Robert J. Paisley
- 👤 Kathleen A. Wexell
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 16:08
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/692; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/24926
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
150 words
A laminated structure consisting of at least two inorganic laminae bonded together with an inorganic ceramic bonding medium wherein the material of the first lamina exhibits a thermal conductivity in excess of 50 W/m·K selected from the group consisting of tungsten, AlN, and SiC, the material of the second lamina exhibits a thermal conductivity below 25 W/m·K, a dielectric constant below 10, a sintering temperature below 1050° C., and a linear coefficient of thermal expansion compatible with that of the first lamina selected from the group consisting of glass, glass-ceramic, and glass-bonded ceramic, and the material of the bonding medium exhibiting flow at a temperature below the sintering temperature of the second lamina and a linear coefficient of thermal expansion compatible with those of the first and second laminae selected from the group consisting of borosilicate glasses and devitrifiable sealing glasses having a composition within the lead titanium borosilicate system.
Claim 2
Dependent Claim
150 words
A laminated structure consisting of at least two inorganic laminae bonded together with an inorganic ceramic bonding medium wherein the material of the first lamina exhibits a thermal conductivity in excess of 50 W/m·K selected from the group consisting of tungsten, AlN, and SiC, the material of the second lamina exhibits a thermal conductivity below 25 W/m·K, a dielectric constant below 10, a sintering temperature below 1050° C., and a linear coefficient of thermal expansion compatible with that of the first lamina selected from the group consisting of glass, glass-ceramic, and glass-bonded ceramic, and the material of the bonding medium exhibiting flow at a temperature below the sintering temperature of the second lamina and a linear coefficient of thermal expansion compatible with those of the first and second laminae selected from the group consisting of borosilicate glasses and devitrifiable sealing glasses having a composition within the lead titanium borosilicate system.
Claim 3
Dependent Claim
17 words
A laminated structure according to claim 1 wherein the material of said first lamina is electrically insulating.
Claim 4
Dependent Claim
44 words
A laminated structure according to claim 1 wherein said glass-ceramic is essentially free of Li 2 O, Na 2 O, and K 2 O and wherein the predominant crystal phase is selected from the group consisting of cordierite, willemite, and mixtures of those phases.
Claim 5
Dependent Claim
38 words
A laminated structure according to claim 3 wherein said willemite-containing glass-ceramic consists essentially, expressed in terms of weight percent on the oxide basis, of about 15-45% ZnO, 10-30% Al 2 O 3 , and 30-55% SiO 2 .
Claim 6
Dependent Claim
121 words
A laminated structure consisting of a first inorganic ceramic lamina, wherein the material of said first lamina exhibits a thermal conductivity in excess of 50 W/m·K selected from the group consisting of tungsten, AlN, and SiC, sandwiched between two inorganic ceramic laminae exhibiting a thermal conductivity below 25 W/m·K, a dielectric constant below 10, a sintering temperature below 1050° C., and a linear coefficient of thermal expansion compatible with that of said first lamina selected from the group consisting of glass, glass-ceramic, and glass-bonded ceramic, said first lamina being bonded between said two laminae through a inorganic ceramic bonding medium selected from the group consisting of borosilicate glasses and devitrifiable sealing glasses having a composition within the lead titanium borosilicate system.
Claim 7
Dependent Claim
121 words
A laminated structure consisting of a first inorganic ceramic lamina, wherein the material of said first lamina exhibits a thermal conductivity in excess of 50 W/m·K selected from the group consisting of tungsten, AlN, and SiC, sandwiched between two inorganic ceramic laminae exhibiting a thermal conductivity below 25 W/m·K, a dielectric constant below 10, a sintering temperature below 1050° C., and a linear coefficient of thermal expansion compatible with that of said first lamina selected from the group consisting of glass, glass-ceramic, and glass-bonded ceramic, said first lamina being bonded between said two laminae through a inorganic ceramic bonding medium selected from the group consisting of borosilicate glasses and devitrifiable sealing glasses having a composition within the lead titanium borosilicate system.
References Cited (Backward Citations)
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| 3.5 Years (Year 4) | 1991-10-04 | 1992-04-04 | 1992-10-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-10-04 | 1996-04-04 | 1996-10-04 | $3760.00 | Window Closed / Lapsed |
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