US4772927A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thin film FET doped with diffusion inhibitor
Assignee: Hitachi Ltd
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Filing: 1986-10-23
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Granted: 1988-09-20
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Expires: 2006-10-23
Abstract
Abstract The present invention relates to a semiconductor device including a MOS transistor which is formed with a source region, a drain region and a channel region by the use of polycrystalline silicon, and a method of manufacturing the semiconductor device. Ions of carbon, oxygen or/and nitrogen are introduced into a polycrystalline silicon layer over the whole area thereof, and restrain conductive ions in the source and drain regions from diffusing into the channel region.
Inventors
- 👤 Ryuichi Saito
- 👤 Naohiro Momma
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 08:22
CPC Classifications
H; H10; H10D; H10D30/00; H10D30/01; H10D30/021; H10D30/031; H10D30/0312; H10D30/0314; H10B; H10B10/00; H10B10/12; H10B10/125; H10D30/0321; H10D30/60; H10D30/67; H10D30/6704; H10D30/6713; H10D30/6729; H10D30/673; H10D30/6731; H10D30/674; H10D30/6741; H10D30/6743; H10D30/6745; H10D62/00; H10D62/40; H10D62/80; H10D62/83; H10D62/834; H10D84/00; H10D84/80; H10D84/82; H10D84/83; H10D84/85; H10D84/856; H10P; H10P32/00; H10P32/30; H10P32/302
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
104 words
A semiconductor device having a MOS transistor element which is formed with a source region, a drain region and a channel region in a polycrystalline silicon layer on a semiconductor body, characterized in that said source region, drain region and channel region are all formed of polycrystalline silicon, that a conductive impurity is contained in said source region and drain region, and that at least one species of ions selected from the group consisting of oxygen, nitrogen and carbon ions are contained in said source region, drain region and channel region in order to restrain said conductive impurity from diffusing into said channel region.
Claim 2
Dependent Claim
104 words
A semiconductor device having a MOS transistor element which is formed with a source region, a drain region and a channel region in a polycrystalline silicon layer on a semiconductor body, characterized in that said source region, drain region and channel region are all formed of polycrystalline silicon, that a conductive impurity is contained in said source region and drain region, and that at least one species of ions selected from the group consisting of oxygen, nitrogen and carbon ions are contained in said source region, drain region and channel region in order to restrain said conductive impurity from diffusing into said channel region.
Claim 3
Dependent Claim
62 words
A semiconductor device as defined in claim 1, wherein the at least one species of ions selected from the group consisting of oxygen, nitrogen and carbon are contained in said source region, drain region and channel region such that the grain boundaries of the polycrystalline silicon respectively are partly formed with at least one of silicon oxide, silicon nitride and silicon carbide.
Claim 4
Dependent Claim
37 words
A semiconductor device as defined in claim 1, wherein the concentration of the at least one species of ions contained in said source region, drain region and channel region is 10 19 -10 22 atoms/cm 3 .
Claim 5
Dependent Claim
47 words
A semiconductor device as defined in claim 1, wherein said at least one species of ions is contained at a relatively low concentration in the channel region and a relatively high concentration in the source and drain regions as compared to the concentration in the channel region.
Claim 6
Dependent Claim
57 words
A semiconductor device as defined in claim 4, wherein the concentration of the at least one species of ions contained in the channel region is 10 19 -10 20 atoms/cm 3 , the concentration of the at least one species of ions contained in the source and drain regions being 10 19 -10 22 atoms/cm 3 .
Claim 7
Dependent Claim
30 words
A semiconductor device as defined in claim 1, the device further including a gate electrode, spaced from the channel region in the polycrystalline silicon layer via a gate insulating film.
Claim 8
Dependent Claim
20 words
A semiconductor device as defined in claim 6, wherein said gate electrode has a width of at most 2 μm.
Claim 9
Dependent Claim
56 words
A semiconductor device as defined in claim 6, wherein said semiconductor body has source and drain regions formed therein, with a channel region formed in the semiconductor body extending between the source and drain regions, the device further comprising a gate electrode spaced via a gate insulating film from the channel region in the semiconductor body.
Claim 10
Dependent Claim
50 words
A semiconductor device as defined in claim 8, wherein the gate electrode spaced from the channel region in the semiconductor body and the gate electrode spaced from the channel region in the polycrystalline silicon film is a common gate electrode, extending between said semiconductor body and said polycrystalline silicon film.
Claim 11
Dependent Claim
55 words
A semiconductor device as defined in claim 8, wherein the conductive impurity contained in the source and drain regions in the polycrystalline silicon layer are of a first conductivity type, and the source and drain regions formed in the semiconductor body contain a conductive impurity of a second conductivity type opposite the first conductivity type.
Claim 12
Dependent Claim
23 words
A semiconductor device as defined in claim 1, wherein all of said polycrystalline silicon layer contains said at least one species of ions.
References Cited (Backward Citations)
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