Patent US4770751A successfully refreshed from Google Patents.
US4770751A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for forming on a nonconductor a shielding layer against electromagnetic radiation
Assignee: Okuno Chemical Industries Co Ltd
•
Filing: 1986-12-30
•
Granted: 1988-09-13
•
Expires: 2006-12-30
Abstract
Abstract This invention provides a method for forming metallic deposits on a nonconductor to provide a shield against electromagnetic radiation, the method comprising the steps of: (i) subjecting the surface of a nonconductor to pretreatment prior to electroless copper plating, (ii) electrolessly plating the pretreated surface of nonconductor with copper to form a copper layer about 0.5 to about 20 mu m in thickness on the surface, and (iii) immersing the copper-coated nonconductor in an electroless Ni plating solution and passing an electric current through the solution with the copper layer serving as the cathode, followed by cutting of current, to deposit as Ni layer 1.0 to about 20 mu m on the copper layer.
Inventors
- 👤 Shigemitsu Kawagishi
- 👤 Toshiyuki Kita
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 16:37
CPC Classifications
H; H05; H05K; H05K9/00; H05K9/0073; H05K9/0081; H05K9/0084; C; C23; C23C; C23C18/00; C23C18/16; C23C18/31; C23C18/32; C23C18/34; C25; C25D; C25D3/00; C25D3/02; C25D3/12; C25D5/00; C25D5/48
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
163 words
A method for forming metallic deposits on a nonconductor to provide a shield against electromagnetic radiation, the method comprising the steps of: (i) subjecting the surface of a nonconductor to pretreatment prior to electroless copper plating, (ii) electrolessly plating the pretreated surface of nonconductor with copper to form a copper layer about 0.5 to about 20 μm in thickness on the surface, and (iii) immersing the copper-coated nonconductor in an electroless Ni or Ni alloy plating solution and passing an electric current at a cathode current density of about 0.2 to about 3 A/dm 2 through the solution with the copper layer serving as the cathode, followed by cutting off current, to deposit a Ni or Ni alloy layer about 1.0 to about 20 μm on the copper layer, said Ni or Ni alloy layer comprising an electrolytically formed layer of about 0.2 to about 0.5 μm in thickness and an electrolessly formed layer of about 0.8 to about 19.5 μm in thickness.
Claim 2
Independent Claim
163 words
A method for forming metallic deposits on a nonconductor to provide a shield against electromagnetic radiation, the method comprising the steps of: (i) subjecting the surface of a nonconductor to pretreatment prior to electroless copper plating, (ii) electrolessly plating the pretreated surface of nonconductor with copper to form a copper layer about 0.5 to about 20 μm in thickness on the surface, and (iii) immersing the copper-coated nonconductor in an electroless Ni or Ni alloy plating solution and passing an electric current at a cathode current density of about 0.2 to about 3 A/dm 2 through the solution with the copper layer serving as the cathode, followed by cutting off current, to deposit a Ni or Ni alloy layer about 1.0 to about 20 μm on the copper layer, said Ni or Ni alloy layer comprising an electrolytically formed layer of about 0.2 to about 0.5 μm in thickness and an electrolessly formed layer of about 0.8 to about 19.5 μm in thickness.
Claim 3
Dependent Claim
14 words
A method according to claim 1 wherein the nonconductor is an organic polymeric material.
Claim 4
Dependent Claim
13 words
A method according to claim 1 wherein the nonconductor is an inorganic material.
Claim 5
Dependent Claim
14 words
A method according to claim 1 wherein the Ni alloy is a Ni-Fe alloy.
Claim 6
Dependent Claim
18 words
A method according to claim 4 wherein the Fe content is about 5 to about 20% by weight.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-09-13 | 1992-03-14 | 1992-09-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-09-13 | 1996-03-14 | 1996-09-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-09-13 | 2000-03-14 | 2000-09-13 | $7700.00 | Window Closed / Lapsed |