Substrate for a printed circuit board

Claim 2

A substrate for a printed circuit board, comprising a metal core plate having apertures and an inorganic fiber cloth impregnated with a heat resistant thermoplastic resin, coated thereon, wherein said apertures are filled with a mixture of said resin and an inorganic filler, wherein said inorganic filler comprises short glass fibers having a diameter of from 5 to 20 μm and a length of from 10 μm to 6 mm.

Claim 3

The substrate according to claim 1, wherein the thermoplastic resin is selected from the group consisting of a polysulfone, polyphenylene oxide, polyphenylene sulfide, polyether ketone, polyether ether ketone, a thermoplastic fluororesin, a polyether imide, polyether sulfone and polyamide imide.

Claim 4

The substrate according to claim 1, wherein the metal core plate is made of aluminum, copper, zinc, iron, silicon steel or an iron-nickel alloy.

Claim 5

The substrate according to claim 1, wherein the inorganic fiber cloth is a glass cloth or a quartz cloth.

Claim 6

The substrate according to claim 1, which further includes a conductive layer formed on at least one side of the substrate.

Claim 7

The substrate according to claim 1, wherein the amount of said inorganic filler is from 5 to 200 parts by weight relative to 100 parts by weight of the resin.

Claim 8

The substrate according to claim 1, wherein the amount of said inorganic filler is from 20 to 80 parts by weight relative to 100 parts by weight of the resin.

Claim 9

The substrate according to claim 1, wherein the length of the short glass fibers is from 10 μm to 500 μm.

Claim 10

A printed circuit board comprising a substrate and a printed circuit formed thereon, wherein said substrate comprises a metal core plate having apertures, and an insulating layer formed on each side of the core plate so that the printed circuit is formed on the insulating layer, wherein said insulating layer comprises an inorganic fiber cloth impregnated with a heat resistant thermoplastic resin, and said apertures are coated with an insulating material comprising said resin and an inorganic filler, and a conductive layer formed on said insulating material to form through circuit holes, wherein said inorganic filler comprises short glass fibers having a diameter of from 5 to 20 μm and a length of from 10 μm to 6 mm.

Claim 11

A printed circuit board comprising a substrate and a printed circuit formed thereon, wherein said substrate comprises a metal core plate having apertures, and an insulating layer formed on each side of the core plate so that the printed circuit is formed on the insulating layer, wherein said insulating layer comprises an inorganic fiber cloth impregnated with a heat resistant thermoplastic resin, and said apertures are coated with an insulating material comprising said resin and an inorganic filler, and a conductive layer formed on said insulating material to form through circuit holes, wherein said inorganic filler comprises short glass fibers having a diameter of from 5 to 20 μm and a length of from 10 μm to 6 mm.

Claim 12

A multilayer printed circuit board comprising a plurality of printed circuit units, wherein at least one of said circuit units is the printed circuit board as defined in claim 9.

Claim 13

The printed circuit board according to claim 9, wherein the amount of said inorganic filler is from 5 to 200 parts by weight relative to 100 parts by weight of the resin.

Claim 14

The printed circuit board according to claim 9, wherein the amount of said inorganic filler is from 20 to 80 parts by weight relative to 100 parts by weight of the resin.

Claim 15

The printed circuit board according to claim 9, wherein the length of the short glass fibers is from 10 μm to 500 μm.