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Patent US4767661A successfully refreshed from Google Patents.
US4767661A
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Copper etching process and product
Assignee: PSI Star Inc
•
Filing: 1987-08-11
•
Granted: 1988-08-30
•
Expires: 2007-08-11
Abstract
Abstract Copper etching process and product particularly suitable for use in the manufacture of printed circuit boards. The copper is etched in a liquid etchant, and the crystal structure of the copper is selected and carefully controlled to provide an anisotropic etch and a vertical-to-lateral etching ratio greater than 1:1. In one disclosed embodiment, the etching solution contains nitric acid, copper nitrate or sulfuric acid, a polymer and a surfactant, and the copper has a top surface crystal structure with predominantly (111) orientation. In another disclosed embodiment, the etching solution contains hydrogen peroxide and sulfuric acid, and the copper foil has a top surface crystal structure with predominantly (311) and (511) orientations and/or (111) orientation. A printed circuit board manufactured in accordance with the invention has a copper foil with a crystal structure selected to provide anisotropic etching and a vertical-to-lateral etching ratio greater than 1:1 with a given etching solution bonded to a substrate, with portions of the copper foil being etched away by the etching solution to form the desired foil pattern.
Inventors
- 👤 James F. Battey
- 👤 Norvell J. Nelson
- 👤 Daniel J. Barnett
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 15:27
CPC Classifications
C; C23; C23F; C23F1/00; C23F1/10; C23F1/14; C23F1/16; C23F1/18; H; H05; H05K; H05K3/00; H05K3/02; H05K3/06; H05K3/067; H05K1/00; H05K1/02; H05K1/09; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T428/00; Y10T428/12; Y10T428/12389; Y10T428/12396; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/31504; Y10T428/31678
Claims Analysis
Total Claims: 94
Claim 1
Independent Claim
71 words
In a process utilizing a liquid etchant for manufacturing a circuit board, the steps of: selecting a copper foil having a top surface crystal structure which is etched anisotropically and with a vertical-to-lateral etching ratio greater than 1:1 by the liquid etchant, bonding the copper foil to a substrate, and exposing a portion of the copper foil to the liquid etchant to remove that portion of the foil from the substrate.
Claim 2
Dependent Claim
71 words
In a process utilizing a liquid etchant for manufacturing a circuit board, the steps of: selecting a copper foil having a top surface crystal structure which is etched anisotropically and with a vertical-to-lateral etching ratio greater than 1:1 by the liquid etchant, bonding the copper foil to a substrate, and exposing a portion of the copper foil to the liquid etchant to remove that portion of the foil from the substrate.
Claim 3
Dependent Claim
45 words
The process of claim 1 wherein the liquid etchant comprises an aqueous solution of nitric acid and copper mitrate or sulfuric acid with a polymer and a surfactant, and the copper foil is selected to have a top surface crystal structure with predominantly (111) orientation.
Claim 4
Dependent Claim
40 words
The process of claim 1 wherein the liquid etchant comprises an aqueous solution of hydrogen peroxide, sulfuric acid, a polymer and a surfactant, and the copper foil is selected to have a top surface crystal structure with predominantly (111) orientation.
Claim 5
Dependent Claim
64 words
A circuit board manufactured by the steps of: selecting a copper foil having a top surface crystal structure which is etched anisotropically and with a vertical-to-lateral etching ratio greater than 1:1 by a liquid etchant, bonding the copper foil to a substrate, and exposing a portion of the copper foil to the liquid etchant to remove that portion of the foil from the substrate.
Claim 6
Dependent Claim
64 words
A circuit board manufactured by the steps of: selecting a copper foil having a top surface crystal structure which is etched anisotropically and with a vertical-to-lateral etching ratio greater than 1:1 by a liquid etchant, bonding the copper foil to a substrate, and exposing a portion of the copper foil to the liquid etchant to remove that portion of the foil from the substrate.
Claim 7
Dependent Claim
44 words
The circuit board of claim 4 wherein the liquid etchant comprises an aqueous solution of nitric acid, copper nitrate or sulfuric acid, a polymer and a surfactant, and the copper foil is selected to have a top surface crystal structure with predominantly (111) orientation.
Claim 8
Dependent Claim
41 words
The circuit board of claim 4 wherein the liquid etchant comprises an aqueous solution of hydrogen peroxide, sulfuric acid, a polymer and a surfactant, and the copper foil is selected to have a top surface crystal structure with predominantly (111) orientation.
Claim 9
Dependent Claim
58 words
In a process for manufacturing a circuit board, the steps of: bonding a copper foil having a top surface crystal structure with predominantly (111) orientation to a substrate, and exposing a portion of the copper foil to an aqueous solution of nitric acid, a polymer and a surfactant to remove that portion of the foil from the substrate.
Claim 10
Dependent Claim
58 words
In a process for manufacturing a circuit board, the steps of: bonding a copper foil having a top surface crystal structure with predominantly (111) orientation to a substrate, and exposing a portion of the copper foil to an aqueous solution of nitric acid, a polymer and a surfactant to remove that portion of the foil from the substrate.
Claim 11
Dependent Claim
37 words
The process of claim 7 wherein the copper foil has enough (111) crystal orientation so that greater than 50% of the line intensity produced by Bragg x-ray analysis of the foil is due to the (111) orientation.
Claim 12
Dependent Claim
22 words
The process of claim 7 wherein the aqueous solution contains nitric acid, the polymer, copper nitrate or sulfuric acid, and the surfactant.
Claim 13
Dependent Claim
24 words
The process of claim 7 wherein the copper foil has a weight on the order of 1/8-2 ounces per square foot of surface area.
Claim 14
Dependent Claim
50 words
In a circuit board: a substrate, and a copper foil on one side of the substrate having a top surface crystal structure with predominantly (111) orientation, portions of the foil having been removed from the board by etching with an aqueous solution of nitric acid, a polymer and a surfactant.
Claim 15
Dependent Claim
50 words
In a circuit board: a substrate, and a copper foil on one side of the substrate having a top surface crystal structure with predominantly (111) orientation, portions of the foil having been removed from the board by etching with an aqueous solution of nitric acid, a polymer and a surfactant.
Claim 16
Dependent Claim
39 words
The circuit board of claim 11 wherein the (111) orientation content of the copper foil is such that greater than 50% of the line intensity produced by Bragg x-ray analysis of the foil is due to the (111) orientation.
Claim 17
Dependent Claim
23 words
The circuit board of claim 11 wherein the aqueous solution contains nitric acid, the polymer, copper nitrate or sulfuric acid, and the surfactant.
Claim 18
Dependent Claim
25 words
The circuit board of claim 11 wherein the copper foil has a weight on the order of 1/8-2 ounces per square foot of surface area.
Claim 19
Dependent Claim
55 words
A circuit board manufactured by the steps of bonding a copper foil having a top surface crystal structure with predominantly (111) orientation to a substrate, and removing a portion of the copper foil from the substrate by etching with an aqueous solution of nitric acid, copper nitrate or sulfuric acid, a polymer and a surfactant.
Claim 20
Dependent Claim
55 words
A circuit board manufactured by the steps of bonding a copper foil having a top surface crystal structure with predominantly (111) orientation to a substrate, and removing a portion of the copper foil from the substrate by etching with an aqueous solution of nitric acid, copper nitrate or sulfuric acid, a polymer and a surfactant.
Claim 21
Dependent Claim
39 words
The circuit board of claim 15 wherein the (111) crystal orientation content of the copper foil is such that at least 50% of the line intensity produced by x-ray analysis of the foil is due to the (111) orientation.
Claim 22
Dependent Claim
22 words
The circuit board of claim 15 wherein the aqueous solution contains nitric acid, the polymer, copper nitrate or sulfuric acid, and surfactant.
Claim 23
Dependent Claim
25 words
The circuit board of claim 15 wherein the copper foil has a weight on the order of 1/8-2 ounces per square foot of surface area.
Claim 24
Dependent Claim
32 words
A process of etching copper having a top surface crystal structure with predominantly (111) orientation with an aqueous solution of nitric acid, copper nitrate or sulfuric acid, a polymer and a surfactant.
Claim 25
Dependent Claim
32 words
A process of etching copper having a top surface crystal structure with predominantly (111) orientation with an aqueous solution of nitric acid, copper nitrate or sulfuric acid, a polymer and a surfactant.
Claim 26
Dependent Claim
35 words
The process of claim 19 wherein (111) crystal content of the copper is such that at least 50% of the line intensity produced by x-ray analysis of the copper is due to the (111) orientation.
Claim 27
Dependent Claim
21 words
The process of claim 20 wherein the aqueous solution contains nitric acid, the polymer, copper nitrate or sulfuric acid, and surfactant.
Claim 28
Dependent Claim
60 words
In a process for manufacturing a circuit board, the steps of: bonding a copper foil having a top surface crystal structure with predominantly (111) orientation to a substrate, and exposing a portion of the copper foil to a liquid etchant containing hydrogen peroxide, sulfuric acid, a polymer and a surfactant to remove that portion of the foil from the substrate.
Claim 29
Dependent Claim
60 words
In a process for manufacturing a circuit board, the steps of: bonding a copper foil having a top surface crystal structure with predominantly (111) orientation to a substrate, and exposing a portion of the copper foil to a liquid etchant containing hydrogen peroxide, sulfuric acid, a polymer and a surfactant to remove that portion of the foil from the substrate.
Claim 30
Dependent Claim
53 words
In a circuit board: a substrate, and a copper foil on one side of the substrate having a top surface crystal structure with predominantly (111) orientation, portions of the copper foil having been removed from the board by etching with an aqueous solution containing hydrogen peroxide, sulfuric acid, a polymer and a surfactant.
Claim 31
Dependent Claim
53 words
In a circuit board: a substrate, and a copper foil on one side of the substrate having a top surface crystal structure with predominantly (111) orientation, portions of the copper foil having been removed from the board by etching with an aqueous solution containing hydrogen peroxide, sulfuric acid, a polymer and a surfactant.
Claim 32
Dependent Claim
57 words
A circuit board manufactured by the steps of: bonding a copper foil having a top surface crystal structure with predominantly (111) orientation to a substrate, and exposing a portion of the copper foil to a liquid etchant containing hydrogen peroxide, sulfuric acid, a polymer and a surfactant to remove that portion of the foil from the substrate.
Claim 33
Dependent Claim
57 words
A circuit board manufactured by the steps of: bonding a copper foil having a top surface crystal structure with predominantly (111) orientation to a substrate, and exposing a portion of the copper foil to a liquid etchant containing hydrogen peroxide, sulfuric acid, a polymer and a surfactant to remove that portion of the foil from the substrate.
Claim 34
Dependent Claim
43 words
The process of claim 1 wherein the liquid etchant comprises an aqueous solution of hydrogen peroxide, sulfuric acid, a polymer and a surfactant, and the copper foil is selected to have a top surface crystal structure with predominantly (311), (511) and (111) orientations.
Claim 35
Dependent Claim
44 words
The circuit board of claim 4 wherein the liquid etchant comprises an aqueous solution of hydrogen peroxide, sulfuric acid, a polymer and a surfactant, and the copper foil is selected to have a top surface crystal structure with predominantly (311), (511) and (111) orientations.
Claim 36
Dependent Claim
63 words
In a process for manufacturing a circuit board, the steps of: bonding a copper foil having a top surface crystal structure with predominantly (311), (511) and (111) orientations to a substrate, and exposing a portion of the copper foil to a liquid etchant containing hydrogen peroxide, sulfuric acid, a polymer and a surfactant to remove that portion of the foil from the substrate.
Claim 37
Dependent Claim
63 words
In a process for manufacturing a circuit board, the steps of: bonding a copper foil having a top surface crystal structure with predominantly (311), (511) and (111) orientations to a substrate, and exposing a portion of the copper foil to a liquid etchant containing hydrogen peroxide, sulfuric acid, a polymer and a surfactant to remove that portion of the foil from the substrate.
Claim 38
Dependent Claim
56 words
In a circuit board: a substrate, and a copper foil on one side of the substrate having a top surface crystal structure with predominantly (311), (511) and (111) orientations, portions of the copper foil having been removed from the board by etching with an aqueous solution containing hydrogen peroxide, sulfuric acid, a polymer and a surfactant.
Claim 39
Dependent Claim
56 words
In a circuit board: a substrate, and a copper foil on one side of the substrate having a top surface crystal structure with predominantly (311), (511) and (111) orientations, portions of the copper foil having been removed from the board by etching with an aqueous solution containing hydrogen peroxide, sulfuric acid, a polymer and a surfactant.
Claim 40
Dependent Claim
60 words
A circuit board manufactured by the steps of: bonding a copper foil having a top surface crystal structure with predominantly (311), (511) and (111) orientations to a substrate, and exposing a portion of the copper foil to a liquid etchant containing hydrogen peroxide, sulfuric acid, a polymer and a surfactant to remove that portion of the foil from the substrate.
Claim 41
Dependent Claim
60 words
A circuit board manufactured by the steps of: bonding a copper foil having a top surface crystal structure with predominantly (311), (511) and (111) orientations to a substrate, and exposing a portion of the copper foil to a liquid etchant containing hydrogen peroxide, sulfuric acid, a polymer and a surfactant to remove that portion of the foil from the substrate.
Claim 42
Dependent Claim
42 words
The process of claim 1 wherein the liquid etchant comprises an aqueous solution of hydrogen peroxide, sulfuric acid, a polymer and a surfactant, and the copper foil is selected to have a top surface crystal structure with predominantly (311) and (511) orientations.
Claim 43
Dependent Claim
43 words
The circuit board of claim 4 wherein the liquid etchant comprises an aqueous solution of hydrogen peroxide, sulfuric acid, a polymer and a surfactant, and the copper foil is selected to have a top surface crystal structure with predominantly (311) and (511) orientations.
Claim 44
Dependent Claim
62 words
In a process for manufacturing a circuit board, the steps of: bonding a copper foil having a top surface crystal structure with predominantly (311) and (511) orientatios to a substrate, and exposing a portion of the copper foil to a liquid etchant containing hydrogen peroxide, sulfuric acid, a polymer and a surfactant to remove that portion of the foil from the substrate.
Claim 45
Dependent Claim
62 words
In a process for manufacturing a circuit board, the steps of: bonding a copper foil having a top surface crystal structure with predominantly (311) and (511) orientatios to a substrate, and exposing a portion of the copper foil to a liquid etchant containing hydrogen peroxide, sulfuric acid, a polymer and a surfactant to remove that portion of the foil from the substrate.
Claim 46
Dependent Claim
55 words
In a circuit board: a substrate, and a copper foil on one side of the substrate having a top surface crystal structure with predominantly (311) and (511) orientations, portions of the copper foil having been removed from the board by etching with an aqueous solution containing hydrogen peroxide, sulfuric acid, a polymer and a surfactant.
Claim 47
Dependent Claim
55 words
In a circuit board: a substrate, and a copper foil on one side of the substrate having a top surface crystal structure with predominantly (311) and (511) orientations, portions of the copper foil having been removed from the board by etching with an aqueous solution containing hydrogen peroxide, sulfuric acid, a polymer and a surfactant.
Claim 48
Dependent Claim
59 words
A circuit board manufactured by the steps of: bonding a copper foil having a top surface crystal structure with predominantly (311) and (511) orientations to a substrate, and exposing a portion of the copper foil to a liquid etchant containing hydrogen peroxide, sulfuric acid, a polymer and a surfactant to remove that portion of the foil from the substrate.
Claim 49
Dependent Claim
59 words
A circuit board manufactured by the steps of: bonding a copper foil having a top surface crystal structure with predominantly (311) and (511) orientations to a substrate, and exposing a portion of the copper foil to a liquid etchant containing hydrogen peroxide, sulfuric acid, a polymer and a surfactant to remove that portion of the foil from the substrate.
Claim 50
Dependent Claim
41 words
The process of claim 1 wherein the liquid etchant comprises an aqueous solution of nitric acid and copper nitrate or sulfuric acid with polymer, and the copper foil is selected to have a top surface crystal structure with predominantly (111) orientation.
Claim 51
Dependent Claim
38 words
The process of claim 1 wherein the liquid etchant comprises an aqueous solution of hydrogen peroxide, sulfuric acid, and a polymer, and the copper foil is selected to have a top surface crystal structure with predominantly (111) orientation.
Claim 52
Dependent Claim
42 words
The circuit board of claim 4 wherein the liquid etchant comprises an aqeous solution of nitric acid, copper nitrate or sulfuric acid, and a polymer, and the copper foil is selected to have a top surface crystal structure with predominantly (111) orientation.
Claim 53
Dependent Claim
39 words
The circuit board of claim 4 wherein the liquid etchant comprises an aqueous solution of hydrogen peroxide, sulfuric acid, and a polymer, and a copper foil is selected to have a top surface crystal structure with predominantly (111) orientation.
Claim 54
Dependent Claim
56 words
In a process for manufacturing a circuit board, the steps of: bonding a copper foil having a top surface crystal structure with predominantly (111) orientation to a substrate, and exposing a portion of the copper foil to an aqueous solution of nitric acid and a polymer to remove that portion of the foil from the substrate.
Claim 55
Dependent Claim
56 words
In a process for manufacturing a circuit board, the steps of: bonding a copper foil having a top surface crystal structure with predominantly (111) orientation to a substrate, and exposing a portion of the copper foil to an aqueous solution of nitric acid and a polymer to remove that portion of the foil from the substrate.
Claim 56
Dependent Claim
37 words
The process of claim 39 wherein the copper foil has enough (111) crystal orientation so that greater than 50% of the line intensity produced by Bragg x-ray analysis of the foil is due to the (111) orientation.
Claim 57
Dependent Claim
20 words
The process of claim 39 wherein the aqueous solution contains nitric acid, the polymer, and copper nitrate or sulfuric acid.
Claim 58
Dependent Claim
24 words
The process of claim 7 wherein the copper foil has a weight on the order of 1/8-2 ounces per square foot of surface area.
Claim 59
Dependent Claim
48 words
In a circuit board: a substrate, and a copper foil on one side of the substrate having a top surface crystal structure with predominantly (111) orientation, portions of the foil having been removed from the board by etching with an aqueous solution of nitric acid and a polymer.
Claim 60
Dependent Claim
48 words
In a circuit board: a substrate, and a copper foil on one side of the substrate having a top surface crystal structure with predominantly (111) orientation, portions of the foil having been removed from the board by etching with an aqueous solution of nitric acid and a polymer.
Claim 61
Dependent Claim
30 words
The circuit board of claim 43 wherein the (111) orientation content of the copper foil is such that greater than 50% of the foil is due to the (111) orientation.
Claim 62
Dependent Claim
21 words
The circuit board of claim 43 wherein the aqueous solution contains nitric acid, the polymer, and copper nitrate or sulfuric acid.
Claim 63
Dependent Claim
25 words
The circuit board of claim 43 wherein the copper foil has a weight on the order of 1/8-2 ounces per square foot of surface area.
Claim 64
Dependent Claim
53 words
A circuit board manufactured by the steps of bonding a copper foil having a top surface crystal structure with predominantly (111) orientation to a substrate, and removing a portion of the copper foil from the substrate by etching with an aqueous solution of nitric acid, copper nitrate or sulfuric acid, and a polymer.
Claim 65
Dependent Claim
53 words
A circuit board manufactured by the steps of bonding a copper foil having a top surface crystal structure with predominantly (111) orientation to a substrate, and removing a portion of the copper foil from the substrate by etching with an aqueous solution of nitric acid, copper nitrate or sulfuric acid, and a polymer.
Claim 66
Dependent Claim
39 words
The circuit board of claim 47 wherein the (111) crystal orientation content of the copper foil is such that at least 50% of the line intensity produced by x-ray analysis of the foil is due to the (111) orientation.
Claim 67
Dependent Claim
21 words
The circuit board of claim 47 wherein the aqueous solution contains nitric acid, the polymer, and copper nitrate or sulfuric acid.
Claim 68
Dependent Claim
25 words
The circuit board of claim 47 wherein the copper foil has a weight on the order of 1/8-2 ounces per square foot of surface area.
Claim 69
Dependent Claim
30 words
A process of etching copper having a top surface crystal structure with predominantly (111) orientation with an aqueous solution of nitric acid, copper nitrate or sulfuric acid and a polymer.
Claim 70
Dependent Claim
30 words
A process of etching copper having a top surface crystal structure with predominantly (111) orientation with an aqueous solution of nitric acid, copper nitrate or sulfuric acid and a polymer.
Claim 71
Dependent Claim
35 words
The process of claim 51 wherein (111) crystal content of the copper is such that at least 50% of the line intensity produced by x-ray analysis of the copper is due to the (111) orientation.
Claim 72
Dependent Claim
20 words
The process of claim 50 wherein the aqueous solution contains nitric acid, the polymer, and copper nitrate or sulfuric acid.
Claim 73
Dependent Claim
58 words
In a process for manufacturing a circuit board, the steps of: bonding a copper foil having a top surface crystal structure with predominantly (111) orientation to a substrate, and exposing a portion of the copper foil to a liquid etchant containing hydrogen peroxide, sulfuric acid, and a polymer to remove that portion of the foil from the substrate.
Claim 74
Dependent Claim
58 words
In a process for manufacturing a circuit board, the steps of: bonding a copper foil having a top surface crystal structure with predominantly (111) orientation to a substrate, and exposing a portion of the copper foil to a liquid etchant containing hydrogen peroxide, sulfuric acid, and a polymer to remove that portion of the foil from the substrate.
Claim 75
Dependent Claim
51 words
In a circuit board: a substrate, and a copper foil on one side of the substrate having a top surface crystal structure with predominantly (111) orientation, portions of the copper foil having been removed from the board by etching with an aqueous solution containing hydrogen peroxide, sulfuric acid and a polymer.
Claim 76
Dependent Claim
51 words
In a circuit board: a substrate, and a copper foil on one side of the substrate having a top surface crystal structure with predominantly (111) orientation, portions of the copper foil having been removed from the board by etching with an aqueous solution containing hydrogen peroxide, sulfuric acid and a polymer.
Claim 77
Dependent Claim
55 words
A circuit board manufactured by the steps of: bonding a copper foil having a top surface crystal structure with predominantly (111) orientation to a substrate, and exposing a portion of the copper foil to a liquid etchant containing hydrogen peroxide, sulfuric acid, and a polymer to remove that portion of the foil from the substrate.
Claim 78
Dependent Claim
55 words
A circuit board manufactured by the steps of: bonding a copper foil having a top surface crystal structure with predominantly (111) orientation to a substrate, and exposing a portion of the copper foil to a liquid etchant containing hydrogen peroxide, sulfuric acid, and a polymer to remove that portion of the foil from the substrate.
Claim 79
Dependent Claim
41 words
The process of claim 1 wherein the liquid etchant comprises an aqueous solution of hydrogen peroxide, sulfuric acid, and a polymer, and the copper foil is selected to have a top surface crystal structure with predominantly (311), (511) and (111) orientations.
Claim 80
Dependent Claim
42 words
The circuit board of claim 4 wherein the liquid etchant comprises an aqueous solution of hydrogen peroxide, sulfuric acid, and a polymer, and the copper foil is selected to have a top surface crystal structure with predominantly (311), (511) and (111) orientations.
Claim 81
Dependent Claim
61 words
In a process for manufacturing a circuit board, the steps of: bonding a copper foil having a top surface crystal structure with predominantly (311), (511) and (111) orientations to a substrate, and exposing a portion of the copper foil to a liquid etchant containing hydrogen peroxide, sulfuric acid, and a polymer to remove that portion of the foil from the substrate.
Claim 82
Dependent Claim
61 words
In a process for manufacturing a circuit board, the steps of: bonding a copper foil having a top surface crystal structure with predominantly (311), (511) and (111) orientations to a substrate, and exposing a portion of the copper foil to a liquid etchant containing hydrogen peroxide, sulfuric acid, and a polymer to remove that portion of the foil from the substrate.
Claim 83
Dependent Claim
53 words
In a circuit board: a substrate, and a copper foil on one side of the substrate having a top surface crystal structure with predominantly (311), (511) and (111) orientations, portions of the copper foil having been removed from the board by etching with an aqueous solution containing hydrogen peroxide, sulfuric acid, and polymer.
Claim 84
Dependent Claim
53 words
In a circuit board: a substrate, and a copper foil on one side of the substrate having a top surface crystal structure with predominantly (311), (511) and (111) orientations, portions of the copper foil having been removed from the board by etching with an aqueous solution containing hydrogen peroxide, sulfuric acid, and polymer.
Claim 85
Dependent Claim
58 words
A circuit board manufactured by the steps of: bonding a copper foil having a top surface crystal structure with predominantly (311), (511) and (111) orientations to a substrate, and exposing a portion of the copper foil to a liquid etchant containing hydrogen peroxide, sulfuric acid, and a polymer to remove that portion of the foil from the substrate.
Claim 86
Dependent Claim
58 words
A circuit board manufactured by the steps of: bonding a copper foil having a top surface crystal structure with predominantly (311), (511) and (111) orientations to a substrate, and exposing a portion of the copper foil to a liquid etchant containing hydrogen peroxide, sulfuric acid, and a polymer to remove that portion of the foil from the substrate.
Claim 87
Dependent Claim
40 words
The process of claim 1 wherein the liquid etchant comprises an aqueous solution of hydrogen peroxide, sulfuric acid, an a polymer, and the copper foil is selected to have a top surface crystal structure with predominantly (311) and (511) orientations.
Claim 88
Dependent Claim
41 words
The circuit board of claim 4 wherein the liquid etchant comprises an aqueous solution of hydrogen peroxide, sulfuric acid, and a polymer, and the copper foil is selected to have a top surface crystal structure with predominantly (311) and (511) orientations.
Claim 89
Dependent Claim
60 words
In a process for manufacturing a circuit board, the steps of: bonding a copper foil having a top surface crystal structure with predominantly (311) and (511) orientations to a substrate, and exposing a portion of the copper foil to a liquid etchant containing hydrogen peroxide, sulfuric acid, and a polymer to remove that portion of the foil from the substrate.
Claim 90
Dependent Claim
60 words
In a process for manufacturing a circuit board, the steps of: bonding a copper foil having a top surface crystal structure with predominantly (311) and (511) orientations to a substrate, and exposing a portion of the copper foil to a liquid etchant containing hydrogen peroxide, sulfuric acid, and a polymer to remove that portion of the foil from the substrate.
Claim 91
Dependent Claim
53 words
In a circuit board: a substrate, and a copper foil on one side of the substrate having a top surface crystal structure with predominantly (311) and (511) orientations, portions of the copper foil having been removed from the board by etching with an aqueous solution containing hydrogen peroxide, sulfuric acid, and a polymer.
Claim 92
Dependent Claim
53 words
In a circuit board: a substrate, and a copper foil on one side of the substrate having a top surface crystal structure with predominantly (311) and (511) orientations, portions of the copper foil having been removed from the board by etching with an aqueous solution containing hydrogen peroxide, sulfuric acid, and a polymer.
Claim 93
Dependent Claim
57 words
A circuit board manufactured by the steps of: bonding a copper foil having a top surface crystal structure with predominantly (311) and (511) orientations to a substrate, and exposing a portion of the copper foil to a liquid etchant containing hydrogen peroxide, sulfuric acid, and a polymer to remove that portion of the foil from the substrate.
Claim 94
Dependent Claim
57 words
A circuit board manufactured by the steps of: bonding a copper foil having a top surface crystal structure with predominantly (311) and (511) orientations to a substrate, and exposing a portion of the copper foil to a liquid etchant containing hydrogen peroxide, sulfuric acid, and a polymer to remove that portion of the foil from the substrate.
References Cited (Backward Citations)
US4695348A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-08-30 | 1992-02-29 | 1992-08-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-08-30 | 1996-02-29 | 1996-08-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-08-30 | 2000-02-29 | 2000-08-30 | $7700.00 | Window Closed / Lapsed |