US4763829A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Soldering of electronic components
Assignee: Nokia Bell Labs
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Filing: 1986-06-04
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Granted: 1988-08-16
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Expires: 2006-06-04
Abstract
Abstract Disclosed is a technique for providing solder bumps to electronic components, such as silicon chips, chip carriers, and circuit boards, so as to achieve large stand-off heights. The component is covered with a mask, such as a photoresist, leaving exposed the solder pads on the component. Solder is applied to the surface along with ultrasonic energy so that the solder wets the exposed pads. The mask acts as a mold for the solder, thereby producing large solder bump heights.
Inventors
- 👤 William M. Sherry
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 06:16
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468; H05K2203/00; H05K2203/02; H05K2203/0285; H05K2203/04; H05K2203/044; H05K3/3452; H10; H10W; H10W72/00; H10W72/01; H10W72/012; H10W72/01251; H10W72/01255; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49204; Y10T29/49224
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
102 words
A method of soldering together electronic components having bonding pads having an area less than 250,000 μm 2 formed on a major surface including depositing solder mounds on at least one of said components comprising the steps of: covering the one of said components with a mask having a thickness of at least 10 μm so as to expose the bonding pads; applying solder to the component while also applying ultrasonic energy to the solder so that the solder wets the surfaces of the exposed pads; and removing the mask while leaving the solder in the form of mounds on the pads.
Claim 2
Independent Claim
102 words
A method of soldering together electronic components having bonding pads having an area less than 250,000 μm 2 formed on a major surface including depositing solder mounds on at least one of said components comprising the steps of: covering the one of said components with a mask having a thickness of at least 10 μm so as to expose the bonding pads; applying solder to the component while also applying ultrasonic energy to the solder so that the solder wets the surfaces of the exposed pads; and removing the mask while leaving the solder in the form of mounds on the pads.
Claim 3
Dependent Claim
13 words
The method according to claim 1 wherein the mask comprises a photoresist material.
Claim 4
Dependent Claim
17 words
The method according to claim 1 wherein the said one of the components is a semiconductor chip.
Claim 5
Dependent Claim
18 words
The method according to claim 1 wherein the solder is applied by immersing the component in molten solder.
Claim 6
Dependent Claim
15 words
The method according to claim 4 wherein the solder is propelled toward the immersed component.
Claim 7
Dependent Claim
16 words
The method according to claim 4 wherein the component is immersed for less than 5 sec.
Claim 8
Dependent Claim
16 words
The method according to claim 1 wherein the solder mounds are at least 25 μm high.
Claim 9
Dependent Claim
16 words
The method according to claim 1 wherein the ultrasonic energy lies within the range 50-300 watts.
Claim 10
Dependent Claim
33 words
The method according to claim 1 further comprising the step of bonding the one of said components to the other component so as to produce a stand-off height of at least 25 μm.
Claim 11
Independent Claim
113 words
The method of depositing solder mounds on an electronic component having bonding pads of an area less than 250,000 μm 2 formed on a major surface comprising the steps of: covering the components with a photoresist mask having a thickness of at least 10 μm so as to expose the bonding pads and cover the remaining portion of the structure; immersing the component in molten solder while applying ultrasonic energy to the solder for a period of less than 5 sec so that the solder wets the surfaces of the exposed pads; removing the photoresist mask while leaving the solder in the form of mounds at least 20 μm high on the pads.
Claim 12
Independent Claim
113 words
The method of depositing solder mounds on an electronic component having bonding pads of an area less than 250,000 μm 2 formed on a major surface comprising the steps of: covering the components with a photoresist mask having a thickness of at least 10 μm so as to expose the bonding pads and cover the remaining portion of the structure; immersing the component in molten solder while applying ultrasonic energy to the solder for a period of less than 5 sec so that the solder wets the surfaces of the exposed pads; removing the photoresist mask while leaving the solder in the form of mounds at least 20 μm high on the pads.
Claim 13
Dependent Claim
13 words
The method according to claim 10 wherein the component is a semiconductor chip.
Claim 14
Dependent Claim
17 words
The method according to claim 10 wherein the component is a board used for interconnecting semiconductor components.
Claim 15
Dependent Claim
15 words
The method according to claim 10 wherein the solder is propelled toward the immersed component.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-08-16 | 1992-02-15 | 1992-08-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-08-16 | 1996-02-15 | 1996-08-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-08-16 | 2000-02-15 | 2000-08-16 | $7700.00 | Window Closed / Lapsed |