High performance induction curable two-component structural adhesive with nonsagging behavior

Claim 1

A two component adhesive composition which is curable by induction heating which comprises a mixture of the components (I) an epoxy resin component comprising (a) an epoxy resin, from 1 to 15% by weight of which is a flexible di- or tri-glycidyl ether of a poly(alkylene glycol), (b) from 1 to 15% by weight of the epoxy resin of a carboxylic acid terminated acrylonitrile-butadiene rubber and (c) from 2 to 50% by weight of an electromagnetic energy absorbing material selected from the group consisting of particulate, magnetizable iron, cobalt, nickel, alloys of nickel and iron, alloys of nickel and chromium, inorganic oxides of iron, inorganic oxides of nickel, carbonaceous materials and mixtures thereof, and (II) a hardener component comprising (a) from 50 to 90% by weight of a poly(alkylene oxide) di- or tri-primary amine having a molecularr weight greater than 2000, (b) up to 20% by weight of a poly(alkylene oxide) di- or tri-primary amine and/or amido-amine having a molecular weight in the range of from 200 to 600, (c) up to 10% by weight of a compound selected from the group consisting of ethylene diamine, aminoethyl piperazine and di-ethanol amine, (d) from 2 to 15% by weight of a phenolic compound, (e) up to 15% by weight of an amine cure accelerator selected from the group consisting of tertiary amino group containing molecules and boron trifluoride-amine complexes and (f) from 20 to 60% by weight of an electromagnetic material selected from the group consisting of particulate, magnetizable iron, cobalt, nickel, alloys of nickel and iron, alloys of nickel and chromium, inorganic oxides of iron, inorganic oxides of nickel, carbonaceous materials and mixtures thereof.